会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method for fabricating a laser diode using a reflective layer including an air layer
    • 使用包括空气层的反射层制造激光二极管的方法
    • US06790693B2
    • 2004-09-14
    • US10420704
    • 2003-04-23
    • Kwang-ki ChoiJae-hee Cho
    • Kwang-ki ChoiJae-hee Cho
    • H01L2100
    • H01S5/028H01L33/46H01S5/0287H01S5/125
    • A laser diode that uses air as a reflective layer, thereby enhancing reflectance with respect to an oscillating laser beam, and a method for fabricating such a laser diode are provided. The laser diode includes a substrate, a laser oscillating layer formed on the substrate, an upper electrode formed on the laser oscillating layer, and a reflective layer formed at one side of the laser oscillating layer, wherein the reflective layer comprises air layers. According to the laser diode and the method for fabricating the same, it is possible to form a reflective layer having a higher reflectivity with a reduced number of pairs of reflective layers, thereby making a laser diode whose threshold voltage is reduced and which can produce a high-output laser beam.
    • 提供使用空气作为反射层的激光二极管,从而提高相对于振荡激光束的反射率,以及制造这种激光二极管的方法。 激光二极管包括基板,形成在基板上的激光振荡层,形成在激光振荡层上的上电极和形成在激光振荡层一侧的反射层,其中反射层包括空气层。 根据激光二极管及其制造方法,可以形成具有较低反射率的反射层,反射层数减少的反射层,从而形成阈值电压降低的激光二极管,并可产生 高输出激光束。
    • 2. 发明授权
    • Laser diode using reflective layer including air layer and method for fabricating the same
    • 使用包括空气层的反射层的激光二极管及其制造方法
    • US06603212B2
    • 2003-08-05
    • US10152037
    • 2002-05-22
    • Kwang-ki ChoiJae-hee Cho
    • Kwang-ki ChoiJae-hee Cho
    • H01L23544
    • H01S5/028H01L33/46H01S5/0287H01S5/125
    • A laser diode that uses air as a reflective layer, thereby enhancing reflectance with respect to an oscillating laser beam, and a method for fabricating such a laser diode are provided. The laser diode includes a substrate, a laser oscillating layer formed on the substrate, an upper electrode formed on the laser oscillating layer, and a reflective layer formed at one side of the laser oscillating layer, wherein the reflective layer comprises air layers. According to the laser diode and the method for fabricating the same, it is possible to form a reflective layer having a higher reflectivity with a reduced number of pairs of reflective layers, thereby making a laser diode whose threshold voltage is reduced and which can produce a high-output laser beam.
    • 提供了使用空气作为反射层的激光二极管,从而提高相对于振荡激光束的反射率,以及制造这种激光二极管的方法。 激光二极管包括基板,形成在基板上的激光振荡层,形成在激光振荡层上的上电极和形成在激光振荡层一侧的反射层,其中反射层包括空气层。 根据激光二极管及其制造方法,可以形成具有较低反射率的反射层,反射层数减少的反射层,从而形成阈值电压降低的激光二极管,并可产生 高输出激光束。
    • 5. 发明授权
    • Semiconductor laser device with a rounded base mesa structure
    • 具有圆形底座台面结构的半导体激光器件
    • US07894499B2
    • 2011-02-22
    • US10823653
    • 2004-04-14
    • Kwang-ki ChoiJoon-seop Kwak
    • Kwang-ki ChoiJoon-seop Kwak
    • H01S3/16H01S5/00
    • H01S5/227H01S5/32341
    • A semiconductor laser device having a smooth cleavage plane is provided. The provided laser device includes a current injection ridge and force distribution ridges formed adjacent to the current injection ridge, which protrudes from an upper surface of a mesa structure. The mesa structure is formed of multi-semiconductor material layers including a laser resonance layer and cladding layers disposed above and below the resonance layer. The current injection ridge and the force distribution ridges distribute a scribing force when cleaving the laser device so that the smooth cleavage planes are obtained. Defects are prevented in the current injection ridge due to the distribution of force when bonding flip chips.
    • 提供具有平滑解理面的半导体激光器件。 提供的激光装置包括从台面结构的上表面突出的电流注入脊和与当前注入脊相邻形成的力分布脊。 台面结构由包括激光共振层和设置在共振层上方和下方的包覆层的多半导体材料层形成。 当切割激光器件时,当前的注入脊和力分布脊分布划线力,从而获得平滑的解理面。 由于在接合倒装芯片时的力分布,在当前的注入脊中防止了缺陷。
    • 6. 发明申请
    • Method of manufacturing vertical light emitting device
    • 制造垂直发光装置的方法
    • US20080113462A1
    • 2008-05-15
    • US11882259
    • 2007-07-31
    • Hyun-soo KimKyoung-kook KimHyung-kun KimKwang-ki ChoiJeong-wook Lee
    • Hyun-soo KimKyoung-kook KimHyung-kun KimKwang-ki ChoiJeong-wook Lee
    • H01L21/02
    • H01L33/0079H01L33/44
    • Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.
    • 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。
    • 7. 发明申请
    • Semiconductor laser diode and method of fabricating the same
    • 半导体激光二极管及其制造方法
    • US20060109881A1
    • 2006-05-25
    • US11221872
    • 2005-09-09
    • Joon-seop KwakKwang-ki ChoiKyoung-ho HaYeon-hee KimJong-in Shim
    • Joon-seop KwakKwang-ki ChoiKyoung-ho HaYeon-hee KimJong-in Shim
    • H01S5/00
    • H01S5/22H01S5/2202
    • A semiconductor laser diode and a method of fabricating the same are provided. The semiconductor laser diode includes: a substrate; a predetermined compound semiconductor layer formed on the substrate; a lower cladding layer formed on the compound semiconductor layer; an active layer formed on the lower cladding layer; an upper cladding layer formed on the active layer and having a ridge formed in the middle thereof; trenches formed to a predetermined depth on at least one side of the ridge to penetrate the active layer from the upper cladding layer; a current blocking layer formed on surfaces of the upper cladding layer, except a top surface of the ridge, and inner walls of the trenches; a contact layer formed on the top surface of the ridge; and a first electrode formed on top surfaces of the contact layer and the current blocking layer.
    • 提供半导体激光二极管及其制造方法。 半导体激光二极管包括:基板; 形成在所述基板上的预定化合物半导体层; 形成在所述化合物半导体层上的下包层; 形成在下包层上的有源层; 在所述有源层上形成有在其中间形成有脊的上包层; 沟槽形成在脊的至少一侧上的预定深度,以从上包层穿透有源层; 形成在上包层的表面以外的电流阻挡层,除了脊的上表面和沟槽的内壁之外; 形成在所述脊的顶表面上的接触层; 以及形成在接触层和电流阻挡层的顶表面上的第一电极。
    • 8. 发明授权
    • Method of manufacturing vertical light emitting device
    • 制造垂直发光装置的方法
    • US07781246B2
    • 2010-08-24
    • US11882259
    • 2007-07-31
    • Hyun-soo KimKyoung-kook KimHyung-kun KimKwang-ki ChoiJeong-wook Lee
    • Hyun-soo KimKyoung-kook KimHyung-kun KimKwang-ki ChoiJeong-wook Lee
    • H01L21/00
    • H01L33/0079H01L33/44
    • Provided is a method of manufacturing a vertical light emitting device. The method of manufacturing the vertical light emitting device may include forming an emissive layer including a n-type semiconductor layer, an active layer, and a p-type semiconductor layer on a substrate, forming a first trench dividing the emissive layer into light emitting device units in which the emissive layer remains on the lower part of the first trench to a desired, or alternatively, a predetermined thickness, forming a passivation layer on the emissive layer, forming a p-type electrode on the p-type semiconductor layer of the emissive layer, forming a metal supporting layer on the passivation layer and the p-type electrode, removing the substrate, removing a remaining portion of the emissive layer when the surface of the emissive layer is exposed by removing the substrate, forming a n-type electrode on the n-type semiconductor layer of the emissive layer, and cutting the metal supporting layer to divide the emissive layer into the light emitting device units.
    • 提供一种垂直发光装置的制造方法。 制造垂直发光器件的方法可以包括在衬底上形成包括n型半导体层,有源层和p型半导体层的发射层,形成将发光层划分成发光器件的第一沟槽 其中发射层保留在第一沟槽的下部上的单元到期望的或可选的预定厚度,在发射层上形成钝化层,在p型半导体层上形成p型电极 发射层,在钝化层和p型电极上形成金属支撑层,去除衬底,当发射层的表面通过去除衬底而暴露时去除发射层的剩余部分,形成n型 电极,并且切割金属支撑层以将发光层划分为发光器件单元。