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    • 2. 发明授权
    • Method for operating a memory array
    • 操作存储器阵列的方法
    • US5706228A
    • 1998-01-06
    • US603939
    • 1996-02-20
    • Kuo-Tung ChangCraig A. CavinsKo-Min ChangBruce L. MortonGeorge L. Espinor
    • Kuo-Tung ChangCraig A. CavinsKo-Min ChangBruce L. MortonGeorge L. Espinor
    • G11C16/04G11C16/10G11C11/40
    • G11C16/3427G11C16/0433G11C16/10
    • A memory array (25) having a selected memory cell (10) and an unselected memory cell (30) is programmed and read. Each memory cell in the memory array (25) contains an isolation transistor (22) and a floating gate transistor (23). To program the selected memory cell (10), programming voltages are applied to a control gate line (21), a drain line (14), an isolation line (19), and a source line (12). To reduce the effects of the drain disturb problem, a gate terminal (32) of the unselected memory cell (30) is held at a positive voltage. To read selected memory cell (10), a read voltage is applied to an isolation gate line (31) of unselected memory cell (30) which insures that the unselected memory cell (30) does not conduct or contribute to leakage current and power consumption during the read operation.
    • 具有选定的存储单元(10)和未选择的存储单元(30)的存储器阵列(25)被编程和读取。 存储器阵列(25)中的每个存储单元包含隔离晶体管(22)和浮动栅极晶体管(23)。 为了对所选择的存储单元(10)进行编程,将编程电压施加到控制栅极线(21),漏极线(14),隔离线(19)和源极线(12)。 为了减小漏极干扰问题的影响,未选择的存储单元(30)的栅极端子(32)被保持在正电压。 为了读取所选择的存储单元(10),读取电压被施加到未选择存储单元(30)的隔离栅极线(31),其确保未选择的存储单元(30)不导通或有助于漏电流和功耗 在读操作期间。
    • 4. 发明授权
    • Nonvolatile memory having overerase protection
    • 非易失性存储器具有过度保护
    • US5422846A
    • 1995-06-06
    • US222066
    • 1994-04-04
    • Kuo-Tung ChangBruce L. MortonKo-Min Chang
    • Kuo-Tung ChangBruce L. MortonKo-Min Chang
    • G11C16/16G11C11/40
    • G11C16/16
    • A nonvolatile memory (20) includes an array of floating gate transistors (22) organized as rows and columns. Word lines of adjacent rows are coupled together to form shared word lines. In one embodiment, a coupling transistor (56-61) is used to couple the sources of the floating gate transistors (36, 39-55) of a row to a predetermined potential in response to the shared word line being selected. The sources of the unselected floating gate transistors of the array (22) are isolated. In another embodiment, an inverter (113, 114, and 115) couples the sources to zero volts in response to the shared word line being selected. The conductivity of the floating gate transistors (36, 39-55) is controlled in response to the logic state of the shared word lines to ensure that unselected cells do not adversely affect the operation of the nonvolatile memory.
    • 非易失性存储器(20)包括以行和列组织的浮栅晶体管阵列(22)。 相邻行的字线被耦合在一起以形成共享字线。 在一个实施例中,耦合晶体管(56-61)用于响应于所选择的共享字线将行的浮置栅晶体管(36,39-55)的源耦合到预定电位。 阵列(22)的未选择的浮栅晶体管的源极被隔离。 在另一个实施例中,响应于所选择的共享字线,反相器(113,114和115)将源耦合到零伏特。 响应于共享字线的逻辑状态来控制浮栅晶体管(36,39-55)的电导率,以确保未选择的单元不会不利地影响非易失性存储器的操作。
    • 5. 发明授权
    • Cross-point eeprom memory array
    • 交叉点eeprom存储器阵列
    • US5467308A
    • 1995-11-14
    • US223354
    • 1994-04-05
    • Kuo-Tung ChangKo-Min Chang
    • Kuo-Tung ChangKo-Min Chang
    • G11C16/04H01L21/8246H01L27/115G11C11/40
    • H01L27/11568G11C16/0491H01L27/115
    • A cross-point EEPROM memory array includes a semiconductor substrate (10) having first and second bit-lines (32, 34) spaced apart by a channel region (36). A control gate electrode (24) is formed by a portion of a control gate line, which overlies a first portion of the channel region (36) and is separated therefrom by an ONO layer (17). A select gate electrode (40) is formed by a portion of a select gate line disposed on the substrate (10) perpendicular to the control gate line. Individual cells in the array are programmed by injecting electrons using source-side injection into trapping sites (19) in the silicon nitride layer (14) of the ONO layer (17). The cells in the array are erased by electron tunneling through the top silicon dioxide layer (16) of the ONO layer (17), and are dissipated in the control gate electrode (24). Improved operating performance is obtained, in part, by fabricating the first silicon dioxide layer (12) of the ONO layer (17) to a greater thickness than the top silicon dioxide layer (16) of the ONO layer (17).
    • 交叉点EEPROM存储器阵列包括具有由沟道区域(36)间隔开的第一和第二位线(32,34)的半导体衬底(10)。 控制栅电极(24)由控制栅极线的一部分形成,该部分覆盖在沟道区(36)的第一部分上并由ONO层(17)分离。 选择栅极(40)由垂直于控制栅线的基板(10)上的选择栅线的一部分形成。 通过使用源侧注入将电子注入到ONO层(17)的氮化硅层(14)中的捕获位点(19)中来编程阵列中的各个单元。 通过电子隧道穿过ONO层(17)的顶部二氧化硅层(16)擦除阵列中的电池,并在控制栅电极(24)中消散。 部分地通过将ONO层(17)的第一二氧化硅层(12)制造成比ONO层(17)的顶部二氧化硅层(16)更大的厚度来获得改进的操作性能。
    • 8. 发明授权
    • Program and erase in a thin film storage non-volatile memory
    • 在薄膜存储非易失性存储器中编程和擦除
    • US06791883B2
    • 2004-09-14
    • US10178658
    • 2002-06-24
    • Craig T. SwiftJane A. YaterAlexander B. HoeflerKo-Min ChangErwin J. PrinzBruce L. Morton
    • Craig T. SwiftJane A. YaterAlexander B. HoeflerKo-Min ChangErwin J. PrinzBruce L. Morton
    • G11C1600
    • G11C16/0466
    • A non-volatile memory having a thin film dielectric storage element is programmed by hot carrier injection (HCI) and erased by tunneling. The typical structure for the memory cells for this type of memory is silicon, oxide, nitride, oxide, and silicon (SONOS). The hot carrier injection provides relatively fast programming for SONOS, while the tunneling provides for erase that avoids the difficulties with the hot hole erase (HHE) type erase that generally accompanies hot carrier injection for programming. HHE is significantly more damaging to dielectrics leading to reliability issues. HHE also has a relatively narrow area of erasure that may not perfectly match the pattern for the HCI programming leaving an incomplete erasure. The tunnel erase effectively covers the entire area so there is no concern about incomplete erase. Although tunnel erase is slower than HHE, erase time is generally less critical in a system operation than is programming time.
    • 具有薄膜电介质存储元件的非易失性存储器通过热载流子注入(HCI)编程并通过隧道擦除。 这种存储器的存储单元的典型结构是硅,氧化物,氮化物,氧化物和硅(SONOS)。 热载波注入为SONOS提供相对快速的编程,而隧道提供擦除,避免了通常伴随热载流子注入进行编程的热孔擦除(HHE)类型擦除的困难。 HHE对电介质的破坏性更大,导致可靠性问题。 HHE还具有相对较窄的擦除区域,可能不完全匹配HCI编程的模式,从而导致不完整的擦除。 隧道擦除有效地覆盖整个区域,所以不用担心不完全擦除。 虽然隧道擦除比HHE慢,但擦除时间在系统操作中通常不如编程时间那么重要。
    • 10. 发明授权
    • Nonvolatile memory with enhanced carrier generation and method for
programming the same
    • 具有增强载波生成的非易失性存储器和用于编程的方法
    • US5258949A
    • 1993-11-02
    • US620813
    • 1990-12-03
    • Ko-Min ChangMing-Bing Chang
    • Ko-Min ChangMing-Bing Chang
    • G11C17/00G11C16/04G11C16/12H01L21/8246H01L21/8247H01L27/112H01L29/788H01L29/792G11C13/00
    • G11C16/12H01L29/7885
    • Programming speed of a nonvolatile memory is improved by enhancing carrier generation. In one form, a nonvolatile memory has a control gate which overlies a channel region in a substrate. A floating gate overlies a portion of the channel region and is positioned between the substrate and the control gate. A source and a drain are formed in the substrate, being displaced by the channel region. A first programming voltage is applied to the drain to create an electric field at a junction between the drain and channel region. Current is forced into the source and through the substrate in order to enhance carrier generation at the junction between the drain and channel region, thereby increasing an electric field at the junction. A second programming voltage, having a ramp shaped leading edge, is applied to the control gate to increase the electrical field and to program the memory to a predetermined logic state.
    • 通过增强载体生成来提高非易失性存储器的编程速度。 在一种形式中,非易失性存储器具有覆盖在衬底中的沟道区域的控制栅极。 浮动栅极覆盖沟道区的一部分并位于衬底和控制栅之间。 源极和漏极形成在衬底中,被沟道区域置换。 将第一编程电压施加到漏极,以在漏极和沟道区域之间的结处产生电场。 电流被迫进入源极并通过衬底,以便增强在漏极和沟道区域之间的结处的载流子产生,从而增加了结处的电场。 具有斜坡形状的前沿的第二编程电压被施加到控制栅极以增加电场并将存储器编程到预定的逻辑状态。