会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 6. 发明授权
    • Ultrasonic thermal compression beam lead, flip chip bonder
    • 超声波热压缩引线,倒装芯片焊接机
    • US3938722A
    • 1976-02-17
    • US355889
    • 1973-04-30
    • James E. KellyRichard F. FoulkeRaymond T. Fitzsimmons
    • James E. KellyRichard F. FoulkeRaymond T. Fitzsimmons
    • B23K20/10H01L21/00B23K21/02
    • H01L21/67144B23K20/106
    • An apparatus for bonding beam lead devices and flip chip devices onto mating conductive surfaces on a substrate or other surface and for bonding electrical leads to semiconductor devices and subsequently to mating conductive surfaces on a substrate or other surface, utilizing either thermocompression or ultrasonic energy. The bonding system of this disclosure includes a novel bonding tool having minute spherically shaped bonding surfaces which are caused by a novel pivoting mechanism to individually and successively bond each of a plurality of electrical leads in a complex wobbling motion which permits the bonding surfaces to trace an adjustable rectangular or other predetermined linear path around the periphery of the device. The system also includes a frequency modulated ultrasonic generator and a novel lead composite, developed for this apparatus.
    • 一种用于将光束引线器件和倒装芯片器件接合到衬底或其他表面上的匹配导电表面上并用于将电引线接合到半导体器件,并且随后使用热压或超声波能量匹配衬底或其它表面上的导电表面的设备。 本公开的接合系统包括具有微小的球形接合表面的新颖的接合工具,其由新颖的枢转机构引起,以便以复杂的摆动运动单独且连续地接合多个电引线,这允许接合表面跟踪 围绕设备周边的可调节的矩形或其它预定的线性路径。 该系统还包括为该装置开发的调频超声波发生器和新颖的引线复合材料。
    • 10. 发明授权
    • Method and circuitry for writing data
    • 用于写入数据的方法和电路
    • US6101134A
    • 2000-08-08
    • US344514
    • 1999-06-25
    • Sanjay K. SanchetiGeorge M. AnselWilliam G. BakerJames E. Kelly
    • Sanjay K. SanchetiGeorge M. AnselWilliam G. BakerJames E. Kelly
    • G11C7/10G11C11/407
    • G11C7/1078
    • An apparatus comprising a first circuit, a reset circuit and an output circuit. The first circuit may be configured to generate one or more state signals in response to (i) a first and a second write control signals and (ii) one or more control signals. The reset circuit may be configured to generate the one or more control signals in response to (i) a global write signal and (ii) the first and second state signals. The output circuit may be configured to generate a third and fourth write control signal in response to (i) the global write signal (ii) a data input signal and (iii) the first and second state signals. In one example, the third and fourth write control signals may generate a pulse on either the third or the fourth write control signals in response to a transition of the data input signal.
    • 一种包括第一电路,复位电路和输出电路的装置。 第一电路可以被配置为响应于(i)第一和第二写控制信号和(ii)一个或多个控制信号而产生一个或多个状态信号。 复位电路可以被配置为响应于(i)全局写信号和(ii)第一和第二状态信号而产生一个或多个控制信号。 输出电路可以被配置为响应于(i)全局写入信号(ii)数据输入信号和(iii)第一和第二状态信号而产生第三和第四写入控制信号。 在一个示例中,响应于数据输入信号的转变,第三和第四写入控制信号可以在第三或第四写入控制信号上产生脉冲。