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热词
    • 8. 发明授权
    • Formation of multilayer dopant distributions in a semiconductor
    • 在半导体中形成多层掺杂剂分布
    • US4364778A
    • 1982-12-21
    • US154855
    • 1980-05-30
    • Harry J. LeamyThomas E. Seidel
    • Harry J. LeamyThomas E. Seidel
    • H01L21/228H01L7/34H01L21/265
    • H01L21/228
    • A method of making solid state devices having multilayer dopant distributions, including p-p+ and n-n+ junctions, etc. A semiconductor body is rapidly melted, typically by a laser, electron beam, or ion beam. Present in the melt is a first dopant having a low segregation coefficient and a second dopant having a high segregation coefficient. During rapid resolidification of the melt, the first dopant segregates toward the surface, while the second dopant remains substantially in place, producing a junction. The production of diodes, bipolar and field effect transistors, Schottky barriers, ohmic contacts, junction isolated surface regions, high conductivity paths, etc., is possible by this method.
    • 制造具有多层掺杂剂分布的固态器件的方法,包括p-p +和n-n +结等。半导体主体通常通过激光,电子束或离子束而迅速熔化。 存在于熔体中的是具有低偏析系数的第一掺杂剂和具有高偏析系数的第二掺杂剂。 在熔体的快速再凝固期间,第一掺杂剂朝向表面偏析,而第二掺杂剂保持基本就位,产生结。 通过该方法,可以制造二极管,双极和场效应晶体管,肖特基势垒,欧姆接触,结隔离表面区域,高导电性路径等。