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    • 3. 发明授权
    • Metal gasket, vacuum flange for the metal gasket, and vacuum seal
structure using the metal gasket
    • 金属垫片,金属垫片的真空法兰,以及使用金属垫片的真空密封结构
    • US5630592A
    • 1997-05-20
    • US658307
    • 1996-06-05
    • Kenjiro ObaraYoshio MurakamiMitsuyosi Saito
    • Kenjiro ObaraYoshio MurakamiMitsuyosi Saito
    • F16J15/08F16L23/20
    • F16J15/0881F16L23/20
    • A ring-shaped metal gasket with the cross-section thereof being substantially rectangular shaped, with the ratio (t/w) of the thickness t of the ring portion to the width w thereof being in the range of 0.5 to 4, having a Vickers hardness in the range of 50 to 120; a vacuum flange for a metal gasket, including a sealing groove for receiving a metal gasket at the surface of the flange, the width of a cross section of the groove gradually decreasing in the direction of the depth thereof, an outer side wall section of the sealing groove being substantially perpendicular to the flange surface, and an inner side wall section of the sealing groove being inclined with respect to the flange surface, with a difference in level being provided so that the flange surface positioned to the inside of the sealing groove is lower than the flange surface positioned to the outside of the sealing groove, and a vacuum seal structure including the above gasket and flange are disclosed.
    • 一种环形金属垫片,其横截面为大致矩形,环形部分的厚度t与其宽度w之比(t / w)在0.5至4的范围内,具有维氏 硬度在50〜120的范围内; 用于金属垫圈的真空凸缘,包括用于在凸缘的表面处接收金属垫圈的密封槽,槽的横截面的宽度在其深度方向上逐渐减小,外侧壁部分 所述密封槽基本上垂直于所述凸缘表面,并且所述密封槽的内侧壁部分相对于所述凸缘表面倾斜,其间设置有差异,使得位于所述密封槽内侧的凸缘表面是 低于位于密封槽外侧的凸缘表面,以及包括上述垫圈和凸缘的真空密封结构。
    • 9. 发明授权
    • Method of manufacturing a ceramics-type vacuum vessel
    • 制造陶瓷型真空容器的方法
    • US5603788A
    • 1997-02-18
    • US457013
    • 1995-06-01
    • Tetsuya AbeYoshio MurakamiHisao TakeuchiAkira YamakawaMasaya Miyake
    • Tetsuya AbeYoshio MurakamiHisao TakeuchiAkira YamakawaMasaya Miyake
    • C04B37/00F16J12/00H05H7/14B32B31/12B32B31/26
    • H05H7/14
    • A vacuum vessel is provided in which the majority of a vessel wall including an annular wall portion (1) and a plate-wall portion (2) is formed of ceramic material such as silicon nitride, for example. To bond the plural wall members together, bonding faces having a surface flatness of not more than 1 .mu.m are prepared thereon, and then a ceramic powder bonding substance with an average particle diameter of not more than 1 .mu.m is interposed between adjacent bonding faces and subjected to heating. Because the generation of gas, such as hydrogen, from the wall of the ceramic vessel is reduced, extremely high vacuum can be generated and maintained in the interior of the vacuum vessel. Also, because the wall of the vacuum vessel has a high permeability with respect to a magnetic field and an electric field, the vacuum vessel can be used as a vessel in a particle accelerator that allows the high precision control of charged particles therein by means of an electromagnetic field.
    • 提供一种真空容器,其中包括环形壁部分(1)和板壁部分(2)的容器壁的大部分由诸如氮化硅的陶瓷材料形成。 为了将多个壁构件结合在一起,在其上制备具有不大于1μm的表面平坦度的接合面,然后将平均粒径不大于1μm的陶瓷粉末粘合物置于相邻的接合面 并进行加热。 因为从陶瓷容器的壁产生气体,例如氢气,所以可以在真空容器的内部产生极高的真空度并维持真空。 此外,由于真空容器的壁相对于磁场和电场具有高磁导率,所以真空容器可以用作粒子加速器中的容器,其允许通过以下方式对带电粒子进行高精度控制: 电磁场。
    • 10. 发明授权
    • Dicing method
    • 切片方法
    • US5494549A
    • 1996-02-27
    • US131960
    • 1993-10-08
    • Tetsuro OkiYoshio MurakamiTsuyoshi Miyata
    • Tetsuro OkiYoshio MurakamiTsuyoshi Miyata
    • B28D5/00B32B31/18
    • B28D5/0082Y10T156/1082
    • In a dicing method, a resin adhesive tape is stuck to one surface of a wafer mount frame, then a rubber plate is stuck to the tape from the open side of the frame. With the rubber plate stretched, an adhesive is sprayed over the rubber plate, whereupon a wafer is stuck to the rubber plate. A weight is placed on the rubber plate to extend it further, thus fixing the wafer to the frame. The thus mounted wafer is diced. Alternatively, a resin adhesive tape is stuck to one surface of the frame, then a thick adhesive rubber plate is stuck to the tape from the open side of the frame, whereupon a wafer with hard wax printed using a screen mask is stuck to the rubber plate. The thus mounted wafer is diced by cutting into it deeply. The cut wafer is soaked in a solvent for separation from the rubber plate. As a further alternative, screen mask printing is carried out on a wafer, and wax is coated over the wafer. A resin adhesive tape is stuck to one surface of a wafer mount frame, and then a thick adhesive rubber plate is stuck to the tape from the open side of the wafer mount frame, whereupon the wax-side surface of the wafer is stuck to the rubber plate. The mounted wafer is diced. The wafer is soaked in a solvent for separation of chips from the rubber plate.
    • 在切割方法中,将树脂粘合带粘贴在晶片安装框架的一个表面上,然后橡胶板从框架的开放侧粘附到带子上。 在橡胶板拉伸的同时,将粘合剂喷在橡胶板上,然后将晶片粘在橡胶板上。 将重物放置在橡胶板上以进一步延伸,从而将晶片固定到框架上。 将如此安装的晶片切割。 或者,将树脂粘合带粘贴在框架的一个表面上,然后将厚的粘合橡胶板从框架的开口侧粘附到带上,由此将使用筛网掩模印刷的具有硬蜡的晶片粘附到橡胶 盘子。 将这样安装的晶片深入切入。 将切割的晶片浸入溶剂中以从橡胶板分离。 作为另一替代方案,在晶片上进行屏幕掩模印刷,并且将蜡涂覆在晶片上。 将树脂粘合带粘贴在晶片安装框架的一个表面上,然后将厚的粘合橡胶板从晶片安装框架的开放侧粘附到带上,由此将晶片的蜡侧表面粘附到 橡胶板。 安装的晶片被切割。 将晶片浸泡在溶剂中以从橡胶板分离碎片。