专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120153009A1 METHOD FOR SURFACE MOUNTING USING CLEANING-FREE ACTIVATED RESINOUS COMPOSITION 有权
标题翻译：使用无清洁活性树脂组合物的表面安装方法
公开(公告)号：US20120153009A1
公开(公告)日：2012-06-21
申请号：US13335015
申请日：2011-12-22
申请人： Kazunori KITAMURA , Yasuhiro TAKASE
发明人： Kazunori KITAMURA , Yasuhiro TAKASE
IPC分类号： B23K1/20
CPC分类号： C08G59/628 , C08G59/4021 , H01L2224/73204 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/00
摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
摘要翻译：活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度所述硬化剂为150℃以上，溶剂为10〜300重量份。

2. 发明申请

US20110132639A1 PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 有权
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20110132639A1
公开(公告)日：2011-06-09
申请号：US12874755
申请日：2010-09-02
申请人： Takeshi SAITO , Kazunori KITAMURA , Yukihiro KOGA
发明人： Takeshi SAITO , Kazunori KITAMURA , Yukihiro KOGA
IPC分类号： H05K1/00 , G03F7/20
CPC分类号： G03F7/168 , H05K3/28 , H05K3/3452 , H05K2203/0278
摘要： A method produces an undercoat-covered smoothed printed wiring board, requiring no step of polishing the surface of the printed wiring board. A method for producing a solder-resist-covered printed wiring board causes no depression in an area between circuit traces. A printed wiring board so produced is also described. The method for producing a printed wiring board includes applying a photo- and heat-curable resin composition onto at least a part of a surface of a printed wiring substrate; placing an optically transparent smoothing member on the resin layer; moving a hard roller on the smoothing member to thin the applied resin layer to a thickness of interest; placing a negative-image mask on the smoothing member; exposing the applied resin layer to light via the negative-image mask; removing the optically transparent smoothing member; removing a light-unexposed portion of the applied resin layer through development; and completely heat-curing the cured light-exposed portion.
摘要翻译：一种方法产生底漆覆盖的平滑印刷线路板，不需要抛光印刷线路板的表面的步骤。用于制造阻焊覆盖印刷线路板的方法不会在电路迹线之间的区域中产生凹陷。还描述了如此制造的印刷线路板。印刷电路板的制造方法包括将光固化树脂组合物和热固化性树脂组合物涂布在印刷布线基板的表面的至少一部分上; 将光学透明的平滑部件放置在树脂层上; 在平滑构件上移动硬辊以将所施加的树脂层稀薄至感兴趣的厚度; 在平滑构件上放置负像掩模; 将所施加的树脂层经由负像掩模曝光; 去除光学透明平滑件; 通过显影去除涂布的树脂层的未曝光部分; 并使固化的光照部分完全热固化。

3. 发明授权

US07410673B2 Smooth board and process for preparing a smooth board 有权
标题翻译：平稳的板和流程准备一个光滑的板
公开(公告)号：US07410673B2
公开(公告)日：2008-08-12
申请号：US10920809
申请日：2004-08-18
申请人： Kiyoshi Sato , Kazunori Kitamura
发明人： Kiyoshi Sato , Kazunori Kitamura
IPC分类号： B05D3/02 , B05D3/10 , B05D3/12 , C08L63/10
CPC分类号： H05K3/4626 , C08F283/10 , C08G59/18 , C08L63/10 , H01L23/49894 , H01L2924/0002 , H05K3/0094 , H05K3/28 , H05K3/4602 , H05K2201/0959 , H05K2201/09881 , Y10T428/31511 , Y10T428/31515 , C08L63/00 , H01L2924/00
摘要： The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) acrylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.
摘要翻译：对印刷电路板的底涂层有价值且不在固化膜中留下气泡并使表面抛光容易并且可以形成光滑的印刷电路板的热固性树脂组合物包括（I）环氧树脂的加合物具有不饱和脂肪酸的树脂，（II）（甲基）丙烯酸酯，（III）自由基聚合引发剂，（IV）可结晶环氧树脂和（V）潜伏性固化剂。

4. 发明授权

US07396885B2 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board 有权
标题翻译：光固化和热固性树脂组合物，制备插孔通孔印刷线路板和堵塞通孔印刷线路板的方法
公开(公告)号：US07396885B2
公开(公告)日：2008-07-08
申请号：US10241459
申请日：2002-09-12
申请人： Kiyoshi Sato , Kazunori Kitamura
发明人： Kiyoshi Sato , Kazunori Kitamura
IPC分类号： C08L63/10
CPC分类号： H05K3/0094 , C08F283/10 , C08F290/00 , C08F290/06 , C08F290/064 , C08L63/00 , C08L63/10 , G03F7/038 , H05K3/287 , H05K3/4602 , H05K3/4652 , H05K2201/0347 , H05K2201/09536 , H05K2201/0959 , C08L2666/22
摘要： A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid epoxy resin, and (V) a latent curing agent. The resin composition can be easily charged and plugged into a through-hole, does not drip down, and can be effectively photo-set and thermoset. A photo-set product prepared of the resin composition can be easily polished. A plugged-through-hole printed wiring (substrate) board prepared of the resin composition does not cause defects such as hollows, cracks, blisters, peelings and so on, is excellent in solder-resistance, does not corrode a metal part, and can produce an appliance of high reliability and long life which does not occur short circuit and poor electrical connection.
摘要翻译：光固性和热固性树脂组合物包含（I）环氧树脂与不饱和脂肪酸的部分加合物，（II）（甲基）丙烯酸酯，（III）光交联剂，（IV）液体环氧树脂和（V）潜在固化剂。树脂组合物可以容易地充填并堵塞到通孔中，不会滴落，并且可以有效地进行光固化和热固化。可以容易地研磨由树脂组合物制备的光固化剂产品。通过树脂组合物制成的通孔印刷布线（基板）板不会引起中空，裂纹，起泡，剥离等缺陷，耐焊接性优异，不会腐蚀金属部，能够生产高可靠性，长寿命的电器，不会发生短路和电连接不良。

5. 发明申请

US20070188093A1 Organic electroluminescent display panel 审中-公开
标题翻译：有机电致发光显示面板
公开(公告)号：US20070188093A1
公开(公告)日：2007-08-16
申请号：US11707316
申请日：2007-02-16
申请人： Yoshiaki Nagara , Kazunori Kitamura , Yoshifumi Fujita , Hiromu Iwata , Takeshi Yamaguchi , Yoshifumi Kato
发明人： Yoshiaki Nagara , Kazunori Kitamura , Yoshifumi Fujita , Hiromu Iwata , Takeshi Yamaguchi , Yoshifumi Kato
IPC分类号： H01J1/62
CPC分类号： H01L27/3283 , H01L51/5253
摘要： An organic electroluminescent display panel includes a substrate, a plurality of first electrodes forming parallel stripes on the substrate, a plurality of electrical insulating partitions intersecting the first electrodes, an organic electroluminescent layer formed on the first electrodes and the partitions, a plurality of second electrodes located on the organic electroluminescent layer, and a sealing film. The second electrodes form stripes parallel with the partitions. An organic electroluminescent element is formed at each intersection of the first and second electrodes. The sealing film covers exposed portions of the first electrodes, the organic electroluminescent layer, the partitions, and the second electrodes. Each partition has an inverse tapered portion with a widened distal end. The angle θ defined by each tapered surface of the inverse tapered portion and a plane parallel with the substrate is in a range between 50 degrees and 80 degrees, inclusive, and the height H of the partitions is in a range between 1.5 μm and 6.0 μm, inclusive. The sealing film is formed of silicon nitride, and its thickness is in a range between 0.7 μm and 4.0 μm, inclusive.
摘要翻译：有机电致发光显示面板包括基板，在基板上形成平行条纹的多个第一电极，与第一电极相交的多个电绝缘隔板，形成在第一电极和隔板上的有机电致发光层，多个第二电极位于有机电致发光层上，并具有密封膜。第二电极形成与隔板平行的条纹。在第一和第二电极的每个交叉处形成有机电致发光元件。密封膜覆盖第一电极，有机电致发光层，隔板和第二电极的暴露部分。每个分隔件具有带有加宽的远端的倒锥形部分。由倒锥形部分的每个锥形表面限定的角度θ和与基底平行的平面的角度θ在50度至80度之间的范围内，并且隔板的高度H在1.5毫米至6.0毫米之间，包括的。密封膜由氮化硅形成，其厚度在0.7μm和4.0μm之间的范围内。

6. 发明授权

US06812299B2 Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin 有权
标题翻译：环氧树脂不饱和酸加成物，（甲基）丙烯酸酯和可结晶环氧树脂的组成
公开(公告)号：US06812299B2
公开(公告)日：2004-11-02
申请号：US10191126
申请日：2002-07-08
申请人： Kiyoshi Sato , Kazunori Kitamura
发明人： Kiyoshi Sato , Kazunori Kitamura
IPC分类号： C08L6310
CPC分类号： H05K3/4626 , C08F283/10 , C08G59/18 , C08L63/10 , H01L23/49894 , H01L2924/0002 , H05K3/0094 , H05K3/28 , H05K3/4602 , H05K2201/0959 , H05K2201/09881 , Y10T428/31511 , Y10T428/31515 , C08L63/00 , H01L2924/00
摘要： The thermosetting resin composition which is valuable for an undercoat of a printed wiring board, and does not leave an air bubble in a cured film, and makes the surface polishing easy and can form a smooth printed wiring board comprises (I) an adduct of epoxy resin with unsaturated aliphatic acid, (II) a (meth) arcylate, (III) a radical polymerization initiator, (IV) a crystallizable epoxy resin, and (V) a latent curing agent.
摘要翻译：对印刷电路板的底涂层有价值且不在固化膜中留下气泡并使表面抛光容易并且可以形成光滑的印刷电路板的热固性树脂组合物包括（I）环氧树脂的加合物具有不饱和脂肪酸的树脂，（II）（甲基）丙烯酸酯，（III）自由基聚合引发剂，（IV）可结晶环氧树脂和（V）潜伏性固化剂。

7. 发明授权

US08551819B2 Method for surface mounting using cleaning-free activated resinous composition 有权
标题翻译：使用无清洁活性树脂组合物进行表面贴装的方法
公开(公告)号：US08551819B2
公开(公告)日：2013-10-08
申请号：US13335015
申请日：2011-12-22
申请人： Kazunori Kitamura , Yasuhiro Takase
发明人： Kazunori Kitamura , Yasuhiro Takase
IPC分类号： H01L21/58 , C08L63/00 , C09J163/00
CPC分类号： C08G59/628 , C08G59/4021 , H01L2224/73204 , H01L2924/1305 , H01L2924/13055 , H01L2924/15311 , H01L2924/00
摘要： Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.
摘要翻译：活性树脂组合物在室温为100重量份的固体的环氧树脂的基础上，含有1〜10重量份的羧酸化合物，1〜30重量份的固化剂，硬化反应开始温度所述硬化剂为150℃以上，溶剂为10〜300重量份。

8. 发明申请

US20100006324A1 CURABLE RESIN COMPOSITION, HALOGEN-FREE RESIN SUBSTRATE, AND HALOGEN-FREE BUILD-UP PRINTED WIRING BOARD 有权
标题翻译：可固化树脂组合物，无卤素树脂基材和无卤素建筑印刷线路板
公开(公告)号：US20100006324A1
公开(公告)日：2010-01-14
申请号：US12494798
申请日：2009-06-30
申请人： Kazunori KITAMURA , Yukihiro Koga , Kiyoshi Sato
发明人： Kazunori KITAMURA , Yukihiro Koga , Kiyoshi Sato
IPC分类号： H05K1/03 , C08K3/30 , C08K3/26 , C08K3/36
CPC分类号： H05K3/0094 , C08K3/013 , C08K2201/003 , C08L63/00 , H05K3/4602 , H05K2201/0209 , H05K2201/0347 , H05K2201/068 , H05K2201/09536 , H05K2201/0959 , H05K2201/096 , Y10T428/24917
摘要： In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like.
摘要翻译：在含有无机填料的固化性树脂组合物中，无机填料的平均粒径为1μm以下，无机填料的含量为50重量％以下。固化性树脂组合物可以优选用于作为空穴堵塞固化性树脂组合物的环境负荷小的无卤素树脂基材等，并且用于提供具有孔堵塞积聚印刷线路板，其具有具有优异的抗裂性，优异的绝缘/连接可靠性等的通孔通孔结构（特别是堆叠通孔结构）。

9. 发明申请

US20120168219A1 ACTIVE RESIN COMPOSITION, SURFACE MOUNTING METHOD AND PRINTED WIRING BOARD 审中-公开
标题翻译：活性树脂组合物，表面安装方法和印刷线路板
公开(公告)号：US20120168219A1
公开(公告)日：2012-07-05
申请号：US13339981
申请日：2011-12-29
申请人： Kazunori KITAMURA , Yasuhiro TAKASE , Kazuki HANADA
发明人： Kazunori KITAMURA , Yasuhiro TAKASE , Kazuki HANADA
IPC分类号： H05K1/11 , B23K31/02 , B23K1/20 , C09D163/04 , C09D163/02
CPC分类号： H05K3/305 , B23K1/0016 , B23K1/20 , C08G59/42 , C08L63/00 , H01L21/563 , H01L23/3135 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/131 , H01L2224/16238 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81395 , H01L2224/81815 , H01L2224/8191 , H01L2224/83102 , H01L2224/83192 , H01L2224/83862 , H01L2224/92125 , H01L2924/01029 , H01L2924/13055 , H05K3/341 , H05K13/0465 , H05K2201/10977 , Y02P70/613 , H01L2924/00 , H01L2924/00012 , H01L2924/0665 , H01L2924/014
摘要： A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.
摘要翻译：表面安装方法包括将活性树脂组合物施加到印刷布线基板的表面的至少一部分上; 将表面安装装置安装在基板上; 进行回流焊接; 将未充满的树脂施加到感兴趣的空间中; 在施加未充填树脂之前和/或之后，在低于所施加的活性树脂组合物和未充填树脂的固化反应引发温度的温度下进行真空处理和/或加热; 然后将树脂组合物和未填充树脂热固化。活性树脂组合物含有100重量份的环氧树脂，1-50重量份的封端羧酸化合物和/或1-10重量份的羧酸化合物，和可以在150℃以上引发固化反应的固化剂，其量为1-30重量份。

10. 发明申请

US20050218803A1 Organic EL device and method of manufacturing the same 审中-公开
标题翻译：有机EL器件及其制造方法
公开(公告)号：US20050218803A1
公开(公告)日：2005-10-06
申请号：US11055311
申请日：2005-02-10
申请人： Kazuyoshi Takeuchi , Atsushi Kidokoro , Ryouichi Tomida , Kazunori Kitamura
发明人： Kazuyoshi Takeuchi , Atsushi Kidokoro , Ryouichi Tomida , Kazunori Kitamura
IPC分类号： C23C16/34 , C23C16/42 , H01L21/318 , H01L51/10 , H01L51/50 , H01L51/52 , H05B33/04 , H05B33/10
CPC分类号： C23C16/345 , H01L21/02164 , H01L21/0217 , H01L21/02211 , H01L21/02222 , H01L21/02274 , H01L21/02282 , H01L21/3185 , H01L51/5253
摘要： An EL device including an anode, an organic light emitting layer, and a cathode is formed on a glass substrate, and a sealing film made of Si and SiNx in which a ratio of the number of silicon atoms bonded to silicon atoms to the number of silicon atoms bonded to nitrogen atoms is equal to or larger than 0.6 but is equal to or smaller than 2.0 is formed on a surface of the EL element so as to cover the EL element.
摘要翻译：包括阳极，有机发光层和阴极的EL器件形成在玻璃衬底上，并且由Si和SiN 制成的密封膜，其中硅原子数与硅原子键合至与氮原子键合的硅原子数为0.6以上，并且在EL元件的表面上形成为2.0以上，以覆盖EL元件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式