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1. 发明授权

US07105074B2 Substrate treating method and apparatus 有权
公开(公告)号：US07105074B2
公开(公告)日：2006-09-12
申请号：US10202279
申请日：2002-07-22
申请人： Osamu Tamada , Tsuyoshi Mitsuhashi , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Masakazu Sanada , Takashi Nagao , Mitsumasa Kodama
发明人： Osamu Tamada , Tsuyoshi Mitsuhashi , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Masakazu Sanada , Takashi Nagao , Mitsumasa Kodama
IPC分类号： B05B3/00 , B08B3/00
CPC分类号： H01L21/6715 , H01L21/31133
摘要： A substrate treating apparatus is provided for eliminating wasteful consumption of a treating solution in a treating mode in which the treating solution is delivered in a strip form to a substrate from a treating solution delivery nozzle sweeping over the substrate. In a first aspect of the invention, collecting vessels are arranged around a developing cup surrounding a wafer supported by a wafer holder. The collecting vessels collect part of a developer delivered from a discharge opening of a developer delivery nozzle outwardly of a surface of the wafer. In a second aspect of the invention, collecting vessels are arranged below a developer delivery nozzle, with collecting openings of the collecting vessels opposed to a discharge opening or openings of the delivery nozzle. The collecting vessels are moved longitudinally of the discharge openings according to a position of the developer delivery nozzle relative to the wafer.

2. 发明授权

US06832863B2 Substrate treating apparatus and method 有权
标题翻译：底物处理装置及方法
公开(公告)号：US06832863B2
公开(公告)日：2004-12-21
申请号：US10458719
申请日：2003-06-09
申请人： Kenji Sugimoto , Minobu Matsunaga , Masakazu Sanada , Katsushi Yoshioka , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama
发明人： Kenji Sugimoto , Minobu Matsunaga , Masakazu Sanada , Katsushi Yoshioka , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama
IPC分类号： G03D500
CPC分类号： H01L21/67173 , G03F7/70691 , H01L21/67178 , H01L21/67184 , H01L21/67276 , Y10S414/135 , Y10S414/14
摘要： A series of substrate transport paths for transporting substrates is arranged on upper and lower stories. Substrates are transferable between the substrate transport path on the first story and the substrate transport path on the second story. The paths include a going-only path for transporting the substrates forward, and a return-only path for transporting the substrates in the opposite direction, these paths being arranged on the upper and lower stories. An indexer connects one end of the substrate transport path on one story to one end of the substrate transport path on the other story. An interface connects the other end of the substrate transport path on one story to the other end of the substrate transport path on the other story. This construction efficiently reduces a waiting time due to interference between the substrates transported along the going-only path and the substrates transported along the return-only path.
摘要翻译：用于传送基板的一系列基板传送路径被布置在上层和下层。基底可以在第一层的基底输送路径和第二层的基底输送路径之间转移。这些路径包括用于向前传送基板的唯一路径，以及用于沿相反方向传送基板的返回路径，这些路径布置在上部和下部故事物上。分度器将另一个故事的基底传送路径的一端连接到基底传送路径的一端。一个界面将一个故事的基板传送路径的另一端连接到另一个故事的基板传送路径的另一端。这种构造有效地减少了由沿着仅路径传送的基板与沿着返回路径传送的基板之间的干涉导致的等待时间。

3. 发明授权

US06558053B2 Substrate processing apparatus 有权
公开(公告)号：US06558053B2
公开(公告)日：2003-05-06
申请号：US10125229
申请日：2002-04-18
申请人： Kazuhito Shigemori , Masakazu Sanada , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama , Yukihiko Inagaki , Yoshihisa Yamada
发明人： Kazuhito Shigemori , Masakazu Sanada , Minobu Matsunaga , Katsushi Yoshioka , Kenji Sugimoto , Kaoru Aoki , Moritaka Yano , Satoshi Yamamoto , Tsuyoshi Mitsuhashi , Takashi Nagao , Mitsumasa Kodama , Yukihiko Inagaki , Yoshihisa Yamada
IPC分类号： G03D500
CPC分类号： H01L21/67161 , H01L21/6715 , H01L21/67167 , H01L21/67178
摘要： A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.

4. 发明授权

US06893171B2 Substrate treating apparatus 有权
标题翻译：底物处理装置
公开(公告)号：US06893171B2
公开(公告)日：2005-05-17
申请号：US10417460
申请日：2003-04-16
申请人： Yoshiteru Fukutomi , Kenji Sugimoto , Takashi Ito , Takeo Okamoto , Yukihiko Inagaki , Katsushi Yoshioka , Tsuyoshi Mitsuhashi
发明人： Yoshiteru Fukutomi , Kenji Sugimoto , Takashi Ito , Takeo Okamoto , Yukihiko Inagaki , Katsushi Yoshioka , Tsuyoshi Mitsuhashi
IPC分类号： G03F7/30 , B05C9/14 , B05C13/00 , B65G1/00 , H01L21/00 , H01L21/027 , H01L21/67 , H01L21/677 , G03D5/00 , B65G49/07 , B65H1/00 , G03B27/32
CPC分类号： H01L21/67173 , H01L21/67178 , H01L21/67225 , H01L21/67276 , H01L21/67778 , Y10S414/135
摘要： A substrate treating apparatus disclosed herein realizes improved throughput. The substrate treating apparatus according to this invention includes an antireflection film forming block, a resist film forming block and a developing block arranged in juxtaposition. Each block includes chemical treating modules, heat-treating modules and a single main transport mechanism. The main transport mechanism transports substrates within each block. Transfer of the substrates between adjacent blocks is carried out through substrate rests. The main transport mechanism of each block is not affected by movement of the main transport mechanisms of the adjoining blocks. Consequently, the substrates may be transported efficiently to improve the throughput of the substrate treating apparatus.
摘要翻译：本文公开的基板处理装置实现了改善的生产量。根据本发明的基板处理装置包括并列布置的防反射膜形成块，抗蚀剂膜形成块和显影块。每个块包括化学处理模块，热处理模块和单个主要输送机构。主要运输机构在每个区块内运输基材。通过基板支架进行相邻块之间的基板的转移。每个块的主要运输机构不受邻接块主运输机构的运动的影响。因此，可以有效地输送基板，以提高基板处理装置的通过量。

5. 发明授权

US5677000A Substrate spin treating method and apparatus 失效
标题翻译：底物旋转处理方法和装置
公开(公告)号：US5677000A
公开(公告)日：1997-10-14
申请号：US699728
申请日：1996-08-19
申请人： Katsushi Yoshioka , Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Kenji Sugimoto
发明人： Katsushi Yoshioka , Yoshiteru Fukutomi , Tsuyoshi Mitsuhashi , Kenji Sugimoto
IPC分类号： B05C11/08 , G03F7/16 , H01L21/00 , H01L21/027 , H01L21/304 , B05D3/12 , B05C11/00
CPC分类号： H01L21/6715 , G03F7/162
摘要： A substrate spin treating method and apparatus having a cup cleaner device for cleaning a scatter preventive cup, which cleaner device does not require attaching and/or detaching of a cleaning jig. The cleaner device is driven through engagement with a spin chuck which operates at a low torque that is provided for normal substrate spin treating operation. During the normal spin treating operation, only the spin chuck is driven by a rotary shaft, with the cup cleaner device being disengaged from the spin chuck and its driving rotary shaft. For a cup cleaning operation, the spin chuck and scatter preventive cup are vertically moved relative to each other to place the cup cleaner device at a cup cleaning height and to drivingly connect the cup cleaner device to the rotary shaft through a torque transmitter. In this state, the cup cleaner device is rotated to establish a centrifugal force that scatters a cleaning solution supplied to a cleaning solution guide of the cup cleaner device from cleaning solution supply nozzles, thereby cleaning inner surfaces of the scatter preventive cup.
摘要翻译：一种具有用于清洁散射防止杯的杯子清洁器装置的衬底旋转处理方法和装置，该清洁装置不需要附着和/或拆卸清洁夹具。清洁器装置通过与旋转卡盘啮合而被驱动，旋转卡盘以为正常的基底旋转处理操作提供的低扭矩操作。在正常的旋转处理操作期间，只有旋转卡盘由旋转轴驱动，杯子清洁器装置与旋转卡盘及其驱动旋转轴脱离。对于杯子清洁操作，旋转卡盘和防散射杯相对于彼此垂直移动，以将杯清洁器设备放置在杯清洁高度处，并且通过扭矩传递器驱动地将杯清洁器装置连接到旋转轴。在这种状态下，杯子清洁器装置被旋转以建立离心力，该离心力将供应到杯清洁器装置的清洁溶液引导件的清洁溶液从清洁溶液供应喷嘴分散，从而清洁防散射杯的内表面。

6. 发明授权

US5762709A Substrate spin coating apparatus 失效
标题翻译：基材旋涂装置
公开(公告)号：US5762709A
公开(公告)日：1998-06-09
申请号：US680983
申请日：1996-07-16
申请人： Kenji Sugimoto , Katsushi Yoshioka , Seiichiro Okuda , Tsuyoshi Mitsuhashi
发明人： Kenji Sugimoto , Katsushi Yoshioka , Seiichiro Okuda , Tsuyoshi Mitsuhashi
IPC分类号： G03F7/16 , B05C11/08 , B05D1/40 , H01L21/00 , H01L21/027 , B05C11/02
CPC分类号： H01L21/6715 , B05C11/08
摘要： A substrate spin coating apparatus for forming a coating film on the upper surface of a spinning substrate includes a spin chuck for supporting and spinning the substrate while holding same substantially in horizontal posture. A scatter preventive cup surrounds lateral and lower regions of the spin chuck, and defines an opening in an upper central region thereof for allowing entry of air flows. An exhaust vent is provided for downwardly exhausting the air flows, and a nozzle is provided for supplying a coating solution through the opening of the scatter preventive cup to the upper surface of the substrate. The scatter preventive cup includes an air passage formed in a bottom region thereof and opening toward a lower surface of the substrate. An air flow adjusting unit is connected to the air passage for adjusting an air flow to a predetermined temperature and supplying the adjusted air flow to the air passage.
摘要翻译：用于在纺丝基材的上表面上形成涂膜的基材旋涂装置包括：旋转卡盘，用于支撑和旋转基材，同时基本保持水平姿势。散射防止杯围绕旋转卡盘的横向和下部区域，并且在其上部中心区域中限定开口以允许空气流进入。设置有用于向下排出空气流的排气口，并且设置有用于通过散射防止杯的开口将涂布溶液供给到基板的上表面的喷嘴。散射防止杯包括形成在其底部区域中并且朝向基板的下表面开口的空气通道。气流调节单元连接到空气通道，用于将空气流调节到预定温度，并将经调节的空气流供应到空气通道。

7. 发明授权

US5639301A Processing apparatus having parts for thermal and non-thermal treatment of substrates 失效
标题翻译：具有用于基板的热和非热处理的部件的加工装置
公开(公告)号：US5639301A
公开(公告)日：1997-06-17
申请号：US461066
申请日：1995-06-05
申请人： Shigeru Sasada , Kaoru Aoki , Mitsumasa Kodama , Kenji Sugimoto , Yoshiteru Fukutomi , Hidekazu Inoue
发明人： Shigeru Sasada , Kaoru Aoki , Mitsumasa Kodama , Kenji Sugimoto , Yoshiteru Fukutomi , Hidekazu Inoue
IPC分类号： B23P19/00 , H01L21/00 , H01L21/677 , B05C5/00
CPC分类号： H01L21/67173 , H01L21/67178 , H01L21/67276 , Y10S414/135 , Y10S414/137
摘要： An apparatus including a structure which separates a first transport robot (high temperature robot), which accesses a first processing part group including the thermal processing parts, from a second transport robot (low temperature robot) which accesses the only non-thermal processing parts. During circulating transportation of substrates to be processed, heat created at thermal processing parts is prevented from flowing into non-thermal processing parts. Semiconductor wafers are circulated one by one between the first processing part group which includes a hot plate and a second processing part group which does not include a hot plate and processed one at a time at each processing part. The high temperature robot accesses the first processing part group while the low temperature robot accesses the second processing part group. Transfer of a semiconductor wafer between the two robots is performed at a transfer part which is formed using a cool plate. Since the low temperature robot is never subjected to heat, temperatures at the non-thermal processing parts which are included in the second processing part group remain stable even when the low temperature robot accesses the non-thermal processing parts.
摘要翻译：一种包括将第一输送机器人（高温机器人）从第二输送机器人（低温机器人）访问的非热处理部分分离的装置，该第一输送机器人从高温处理部进入第一处理部。在要处理的基板的循环运送期间，防止在热处理部件产生的热量流入非热处理部件。半导体晶片在包括热板的第一处理部分组和不包括热板的第二处理部分组之间逐个循环，并且在每个处理部分一次处理半导体晶片。高温机器人访问第一处理部分组，而低温机器人访问第二处理部分组。在两个机器人之间的半导体晶片的转移是在使用冷板形成的转印部分进行的。由于低温机器人不会受到热量的影响，即使在低温机器人进入非热处理部件时，包含在第二处理部件组中的非热处理部件的温度也保持稳定。

8. 发明授权

US5792259A Substrate processing apparatus and air supply method in substrate processing apparatus 失效
标题翻译：基板处理装置和基板处理装置中的供气方法
公开(公告)号：US5792259A
公开(公告)日：1998-08-11
申请号：US749348
申请日：1996-11-21
申请人： Katsushi Yoshioka , Yoshiteru Fukutomi , Kenji Sugimoto
发明人： Katsushi Yoshioka , Yoshiteru Fukutomi , Kenji Sugimoto
IPC分类号： G03F7/16 , B05C11/08 , B05C15/00 , H01L21/027 , B05C5/00
CPC分类号： B05C15/00 , B05C11/08
摘要： A velocity adjusting plate is provided above a substrate processing part in the interior of a substrate processing apparatus which is isolated from the external air. Thus, a downflow which is formed by conditioned air in the interior of the apparatus is separated into downflows having high and low velocities to be supplied to the substrate processing part and the periphery of the substrate processing part respectively. Consequently, the former downflow has a velocity which is suitable for controlling the temperature-humidity on the substrate surface and preventing the substrate from adhesion of particles and fine grains of a processing solution scattered from the substrate, while the latter downflow is suppressed to the minimum velocity which is necessary for preventing dusts and particles from creeping up by dispersion. Thus, it is possible to reduce consumption of air which is adjusted in temperature-humidity while isolating the interior of the apparatus from the external air.
摘要翻译：速度调节板设置在与外部空气隔离的基板处理装置的内部的基板处理部的上方。因此，在设备内部由调节空气形成的下降流被分离成具有高和低速度的下流，以分别供应到基板处理部分和基板处理部分的周边。因此，前一下降流具有适合于控制基板表面的温度湿度的速度，并且防止基板粘附从基板散射的处理溶液的颗粒和细晶粒，同时将下降流抑制到最小防止灰尘和颗粒通过分散而爬行所需的速度。因此，可以在将设备的内部与外部空气隔离的同时降低在温度湿度下调节的空气的消耗。

9. 发明申请

US20070183775A1 DEVELOPING APPARATUS AND DEVELOPING METHOD 有权
标题翻译：开发设备和开发方法
公开(公告)号：US20070183775A1
公开(公告)日：2007-08-09
申请号：US11671581
申请日：2007-02-06
申请人： Tsuyoshi Mitsuhashi , Kenji Sugimoto
发明人： Tsuyoshi Mitsuhashi , Kenji Sugimoto
IPC分类号： G03D5/00
CPC分类号： G03F7/3021 , H01L21/67051 , H01L21/67253
摘要： A joint nozzle that delivers a developer, a rinsing liquid and nitrogen gas is disposed adjacent the spin center of a substrate in plan view. A controller operates electromagnetic switch valves to continue supply of the developer, while spinning the substrate, in a developing process, and to start supply of the rinsing liquid in a rinsing process, immediately after the supply of the developer ends, thereby achieving a shortened period of the developing process. A switching is made to a drying process by starting supply of the nitrogen gas immediately after completion of the rinsing process. Thus, even if the substrate has a large angle of contact, formation of droplets of the rinsing liquid is inhibited to prevent post-develop defects.
摘要翻译：在平面图中，与基板的旋转中心相邻地设置输送显影剂，冲洗液和氮气的接合喷嘴。控制器在显影过程中操作电磁切换阀以继续供应显影剂，同时旋转基底，并且在显影剂供应结束后立即在漂洗过程中开始供应冲洗液，从而实现缩短的周期的发展过程。通过在完成漂洗处理之后立即开始供应氮气，进行干燥过程的切换。因此，即使基板具有大的接触角，也可以抑制漂洗液的液滴的形成，防止显影后的缺陷。

10. 发明授权

US07922405B2 Developing apparatus and developing method 有权
标题翻译：开发设备和开发方法
公开(公告)号：US07922405B2
公开(公告)日：2011-04-12
申请号：US11671581
申请日：2007-02-06
申请人： Tsuyoshi Mitsuhashi , Kenji Sugimoto
发明人： Tsuyoshi Mitsuhashi , Kenji Sugimoto
IPC分类号： G03D5/00
CPC分类号： G03F7/3021 , H01L21/67051 , H01L21/67253
摘要： A joint nozzle that delivers a developer, a rinsing liquid and nitrogen gas is disposed adjacent the spin center of a substrate in plan view. A controller operates electromagnetic switch valves to continue supply of the developer, while spinning the substrate, in a developing process, and to start supply of the rinsing liquid in a rinsing process, immediately after the supply of the developer ends, thereby achieving a shortened period of the developing process. A switching is made to a drying process by starting supply of the nitrogen gas immediately after completion of the rinsing process. Thus, even if the substrate has a large angle of contact, formation of droplets of the rinsing liquid is inhibited to prevent post-develop defects.
摘要翻译：在平面图中，与基板的旋转中心相邻地设置输送显影剂，冲洗液和氮气的接合喷嘴。控制器在显影过程中操作电磁切换阀以继续供应显影剂，同时旋转基底，并且在显影剂供应结束后立即在漂洗过程中开始供应冲洗液，从而实现缩短的周期的发展过程。通过在完成漂洗处理之后立即开始供应氮气，进行干燥过程的切换。因此，即使基板具有大的接触角，也可以抑制漂洗液的液滴的形成，防止显影后的缺陷。

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