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    • 7. 发明授权
    • Method of producing thin-film solar cell
    • 制造薄膜太阳能电池的方法
    • US5397713A
    • 1995-03-14
    • US993021
    • 1992-12-18
    • Satoshi HamamotoMikio DeGuchi
    • Satoshi HamamotoMikio DeGuchi
    • H01L21/02H01L31/04H01L31/048H01L31/18
    • H01L31/048H01L31/0445H01L31/1804H01L31/1872H01L31/1896Y02E10/547Y02P70/521Y10S148/135
    • In a method of producing a thin-film solar cell, a graphite sheet in which the breaking stress in a thickness direction is smaller than the breaking stress in a direction perpendicular to the thickness direction is adhered to a heat resistant substrate, a semiconductor thin film is formed on the graphite sheet in a high temperature process, a second substrate for supporting the semiconductor thin film is adhered to the semiconductor thin film, and the graphite sheet is broken by applying a mechanical stress to the heat resistant substrate and the second substrate. The semiconductor thin film is reliably supported by the heat resistant substrate during high temperature processing and easily removed from the heat resistant substrate by breaking the graphite sheet. In addition, since the graphite sheet has an anisotropic breaking stress, fragments of the graphite sheet remaining on the surface of the semiconductor thin film are easily removed. As a result, a high quality thin film solar cell is produced reliably at low cost.
    • 在制造薄膜太阳能电池的方法中,在厚度方向上的断裂应力小于在与厚度方向垂直的方向上的断裂应力的石墨片粘附到耐热基板上,半导体薄膜 在高温工艺中形成在石墨片上,用于支撑半导体薄膜的第二基板粘附到半导体薄膜上,并且通过对耐热基板和第二基板施加机械应力来破坏石墨片。 半导体薄膜在耐高温处理时被耐热基板可靠地支撑,并且通过破坏石墨片而容易地从耐热基板上去除。 此外,由于石墨片具有各向异性的断裂应力,因此易于除去残留在半导体薄膜的表面上的石墨片的碎片。 结果,以低成本可靠地生产高品质的薄膜太阳能电池。
    • 10. 发明授权
    • Semiconductor device having a polycide structure
    • 具有多晶硅结构的半导体器件
    • US5801427A
    • 1998-09-01
    • US873027
    • 1997-06-11
    • Shigeru ShiratakeKaoru MotonamiSatoshi Hamamoto
    • Shigeru ShiratakeKaoru MotonamiSatoshi Hamamoto
    • H01L21/027H01L21/28H01L21/336H01L21/768H01L29/423H01L29/49H01L29/78H01L29/94H01L31/062
    • H01L29/42376H01L21/0276H01L21/28123H01L21/76889H01L29/4933H01L29/6659H01L29/7833
    • In a semiconductor device having a polycide structure located on a stepped portion, halation during formation of a resist pattern is prevented, and oxidation of an upper surface of a high-melting-point metal silicide layer is prevented during formation of an interlayer insulating film on the polycide structure. In this semiconductor device, an upper layer which is formed of one layer selected from the group consisting of an amorphous silicon layer, a polycrystalline silicon layer, a TiN layer and a TiW layer is formed on the high-melting-point metal silicide layer forming the polycide structure. This effectively suppresses reflection of light beams by the upper layer located at the stepped portion during exposure for forming the resist pattern on the upper layer. Thereby, formation of a notch at the resist pattern is prevented, and the resist pattern is accurately formed to have a designed pattern. The upper layer made of the amorphous silicon layer or polycrystalline silicon layer prevents formation of an oxide layer at an upper surface of the high-melting-point metal silicide layer due to oxydation by Oxygen carried to the inside of the CVD furnace from the outside during formation of an interlayer insulating film covering the polycide structure.
    • 在具有位于阶梯部分上的多晶硅结构的半导体器件中,防止形成抗蚀剂图案期间的卤化,并且在层间绝缘膜形成期间防止高熔点金属硅化物层的上表面的氧化 多晶硅结构。 在该半导体器件中,在高熔点金属硅化物层形成中形成由选自非晶硅层,多晶硅层,TiN层和TiW层的一层形成的上层 多晶硅结构。 这在上层形成抗蚀剂图案的曝光期间有效地抑制位于台阶部分的上层的光束的反射。 由此,防止在抗蚀剂图案处形成切口,并且将抗蚀剂图形精确地形成为具有设计图案。 由非晶硅层或多晶硅层制成的上层防止在高熔点金属硅化物层的上表面形成氧化物层,这是由于氧化从CVD外部向内部送入CVD炉内 形成覆盖多晶硅化物结构的层间绝缘膜。