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    • 2. 发明授权
    • Method for optically detecting height of a specimen and charged particle beam apparatus using the same
    • 用于光学检测样品的高度的方法和使用其的带电粒子束装置的方法
    • US07599076B2
    • 2009-10-06
    • US11591563
    • 2006-11-02
    • Keiya SaitoMasahiro WatanabeYasuhiro Yoshitake
    • Keiya SaitoMasahiro WatanabeYasuhiro Yoshitake
    • G01B11/28
    • G01B11/0608H01J37/20H01J37/21H01J37/265H01J37/28H01J2237/20292H01J2237/216H01J2237/2482H01J2237/2817
    • The present invention provides an optical height detection method and electron beam apparatus to which the method is applied, in which the focusing accuracy of the CD-SEM apparatus, a SEM inspection apparatus, and others is improved by reducing detection errors and improving detection accuracy so as to improve the accuracy of the optical height detection method, and throughput of a CD-SEM apparatus or others is improved by reducing the processing time of automatic focus control performed based on the detected height according to the optical height detection method. An optical detection optical system projects two-dimensional slit light to a measurement object from diagonally above it, detects the light reflected by the measurement object, converts a detected two-dimensional slit image into an electrical signal by a two-dimensional area sensor, eliminates slit parts having a large detection error from the electrical signal, and detects the height of the measurement object.
    • 本发明提供了采用该方法的光学高度检测方法和电子束装置,其中通过降低检测误差并提高检测精度来提高CD-SEM装置,SEM检查装置等的聚焦精度 为了提高光学高度检测方法的精度,通过根据光学高度检测方法减少基于检测到的高度进行的自动聚焦控制的处理时间来提高CD-SEM装置等的生产量。 光学检测光学系统将二维狭缝光从对角线投射到测量对象上,检测由测量对象反射的光,通过二维区域传感器将检测到的二维狭缝图像转换为电信号,消除 狭缝部分具有来自电信号的大的检测误差,并且检测测量对象的高度。
    • 6. 发明授权
    • Pattern inspection device of substrate surface and pattern inspection method of the same
    • 基板表面图案检查装置及图案检验方法相同
    • US08736830B2
    • 2014-05-27
    • US13145968
    • 2009-12-10
    • Masahiro WatanabeToshihiko NakataYasuhiro YoshitakeHideaki SasazawaMinoru Yoshida
    • Masahiro WatanabeToshihiko NakataYasuhiro YoshitakeHideaki SasazawaMinoru Yoshida
    • G01N21/00
    • G01Q60/22G01N21/95607G11B5/84
    • There is provided a pattern inspection device for a substrate surface which can inspect a substrate including a pattern whose size is equal to or smaller than light resolution limit at high speed. The pattern inspection device for the substrate surface includes: a near-field optical head 101 having a fine repetitive pattern; a θ driving unit 311 of scanning an inspected substrate 900 relatively to the near-field optical head 101; a space holding mechanism of holding a space between the near-field optical head 101 and the inspected substrate 900 constant; alight source 110 of irradiating light to the near-field optical head 101; a detection system 201 of detecting an intensity of scattered light generated by interaction between the fine repetitive pattern on the near-field optical head 101 and a fine pattern on a surface of the inspected substrate 900; and a signal processing unit 321 of inspecting the fine pattern on the inspected substrate 900 based on an output of the detection system 201.
    • 提供了一种用于基板表面的图案检查装置,其能够高速检查尺寸等于或小于光分辨率极限的图案的基板。 用于基板表面的图案检查装置包括:具有精细重复图案的近场光学头101; a&thetas; 驱动单元311,其相对于近场光学头101扫描被检查的基板900; 在近场光学头101和被检查基板900之间保持一定间隔的空间保持机构; 将光照射到近场光学头101的光源110; 检测系统201,用于检测由近场光学头101上的细重复图案与被检查基板900的表面上的微细图案之间的相互作用产生的散射光的强度; 以及基于检测系统201的输出来检查被检查基板900上的精细图案的信号处理单元321。
    • 7. 发明申请
    • PATTERN INSPECTION DEVICE OF SUBSTRATE SURFACE AND PATTERN INSPECTION METHOD OF THE SAME
    • 基板表面图案检测装置及其图案检测方法
    • US20120013890A1
    • 2012-01-19
    • US13145968
    • 2009-12-10
    • Masahiro WatanabeToshihiko NakataYasuhiro YoshitakeHideaki SasazawaMinoru Yoshida
    • Masahiro WatanabeToshihiko NakataYasuhiro YoshitakeHideaki SasazawaMinoru Yoshida
    • G01N21/956G01N21/47
    • G01Q60/22G01N21/95607G11B5/84
    • There is provided a pattern inspection device for a substrate surface which can inspect a substrate including a pattern whose size is equal to or smaller than light resolution limit at high speed. The pattern inspection device for the substrate surface includes: a near-field optical head 101 having a fine repetitive pattern; a θ driving unit 311 of scanning an inspected substrate 900 relatively to the near-field optical head 101; a space holding mechanism of holding a space between the near-field optical head 101 and the inspected substrate 900 constant; alight source 110 of irradiating light to the near-field optical head 101; a detection system 201 of detecting an intensity of scattered light generated by interaction between the fine repetitive pattern on the near-field optical head 101 and a fine pattern on a surface of the inspected substrate 900; and a signal processing unit 321 of inspecting the fine pattern on the inspected substrate 900 based on an output of the detection system 201.
    • 提供了一种用于基板表面的图案检查装置,其能够高速检查尺寸等于或小于光分辨率极限的图案的基板。 用于基板表面的图案检查装置包括:具有精细重复图案的近场光学头101; a&thetas; 驱动单元311,其相对于近场光学头101扫描被检查的基板900; 在近场光学头101和被检查基板900之间保持一定间隔的空间保持机构; 将光照射到近场光学头101的光源110; 检测系统201,用于检测由近场光学头101上的细重复图案与被检查基板900的表面上的微细图案之间的相互作用产生的散射光的强度; 以及基于检测系统201的输出来检查被检查基板900上的精细图案的信号处理单元321。
    • 9. 发明申请
    • Method and apparatus for inspecting defects of patterns formed on a hard disk medium
    • 用于检查形成在硬盘介质上的图案的缺陷的方法和装置
    • US20090161244A1
    • 2009-06-25
    • US12314938
    • 2008-12-19
    • Takenori HiroseMasahiro WatanabeYasuhiro Yoshitake
    • Takenori HiroseMasahiro WatanabeYasuhiro Yoshitake
    • G11B27/36
    • G11B5/82B82Y10/00G01N21/55G01N21/95607G01N2021/95615G11B5/743G11B5/855G11B20/18G11B2220/2516
    • If an inspection method for inspecting a patterned medium is intended for the nanoimprint process control, it is necessary to measure a correct shape of each pattern element. On the other hand, if the inspection method is intended for the quality control of products, it is necessary to inspect the products on a 100 percent basis. However, the conventional method which uses SEM or AFM could not satisfy these requirements.According to the present invention, 100-percent inspection of products becomes possible by a method including the steps of: irradiating a surface of a hard disk medium, on which a magnetic material pattern is formed, with a light beam including a plurality of wavelengths; detecting the intensity of a reflected light beam from the hard disk medium on a wavelength basis; calculating a spectral reflectance from the detected intensity of the reflected light beam; and detecting a shape of each pattern element formed on the hard disk medium on the basis of the calculated spectral reflectance.
    • 如果用于检查图案化介质的检查方法用于纳米压印过程控制,则需要测量每个图案元件的正确形状。 另一方面,如果检验方法是用于产品的质量控制,则必须以100%的价格检查产品。 然而,使用SEM或AFM的常规方法不能满足这些要求。 根据本发明,通过包括以下步骤的方法可以对产品进行100%的检查:用包括多个波长的光束照射形成有磁性材料图案的硬盘介质的表面; 以波长为基础检测来自硬盘介质的反射光束的强度; 根据所检测的反射光束的强度计算光谱反射率; 并根据计算出的光谱反射率检测形成在硬盘介质上的每个图形元素的形状。
    • 10. 发明授权
    • Method and apparatus for inspecting defects of patterns formed on a hard disk medium
    • 用于检查形成在硬盘介质上的图案的缺陷的方法和装置
    • US08148705B2
    • 2012-04-03
    • US12314938
    • 2008-12-19
    • Takenori HiroseMasahiro WatanabeYasuhiro Yoshitake
    • Takenori HiroseMasahiro WatanabeYasuhiro Yoshitake
    • G01N21/86G01V8/00
    • G11B5/82B82Y10/00G01N21/55G01N21/95607G01N2021/95615G11B5/743G11B5/855G11B20/18G11B2220/2516
    • If an inspection method for inspecting a patterned medium is intended for the nanoimprint process control, it is necessary to measure a correct shape of each pattern element. On the other hand, if the inspection method is intended for the quality control of products, it is necessary to inspect the products on a I00 percent basis. However, the conventional method which uses SEM or AFM could not satisfy these requirements. According to the present invention, IO0-percent inspection of products becomes possible by a method including the steps of: irradiating a surface of a hard disk medium, on which a magnetic material pattern is formed, with a light beam including a plurality of wavelengths; detecting the intensity of a reflected light beam from the hard disk medium on a wavelength basis; calculating a spectral reflectance from the detected intensity of the reflected light beam; and detecting a shape of each pattern element formed on the hard disk medium on the basis of the calculated spectral reflectance.
    • 如果用于检查图案化介质的检查方法用于纳米压印过程控制,则需要测量每个图案元件的正确形状。 另一方面,如果检验方法是为了产品的质量控制,则以百分之百为基础检查产品是必要的。 然而,使用SEM或AFM的常规方法不能满足这些要求。 根据本发明,通过包括以下步骤的方法可以进行产品的IO0百分比检查:用形成有多个波长的光束照射形成有磁性材料图案的硬盘介质的表面; 以波长为基础检测来自硬盘介质的反射光束的强度; 根据所检测的反射光束的强度计算光谱反射率; 并根据计算出的光谱反射率检测形成在硬盘介质上的每个图形元素的形状。