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    • 5. 发明授权
    • Mask structure exposure method
    • 面膜结构曝光方法
    • US06337161B2
    • 2002-01-08
    • US09161372
    • 1998-09-28
    • Keiko ChibaHideo KatoHiroshi Maehara
    • Keiko ChibaHideo KatoHiroshi Maehara
    • G03F900
    • G03F1/22G03F1/62
    • A mask structure to be used for X-ray exposure or the like in manufacturing semiconductor devices prevents contaminants from adhering and accumulating on the surface of a mask, thereby extending the life of the mask. In this mask structure, titanium oxide films are formed on front and back pellicles that protect a mask, composed of a support film and an X-ray absorber, from dust or the like. Titanium oxide decomposes contaminants by functioning as a photocatalyst, and prevents the adhesion and accumulation of contaminants by an antistatic function based on photoconductivity. When a titanium oxide film is formed on the surface of the mask itself, it is preferable that the film be formed outside the exposure area or the like.
    • 在制造半导体器件中用于X射线曝光等的掩模结构防止污染物粘附并积聚在掩模的表面上,从而延长掩模的使用寿命。 在该掩模结构中,在保护由支撑膜和X射线吸收体构成的掩模的灰尘等上的前面和后面防护薄膜上形成氧化钛膜。 氧化钛通过作为光催化剂起作用来分解污染物,并且通过基于光电导性的抗静电功能来防止污染物的粘附和积累。 当在掩模本身的表面上形成氧化钛膜时,优选将膜形成在曝光区域等之外。
    • 7. 发明授权
    • X-ray mask structure, process for production thereof, apparatus and
method for X-ray exposure with the X-ray mask structure, and
semiconductor device produced by the X-ray exposure method
    • X射线掩模结构,其制造方法,用X射线掩模结构X射线曝光的装置和方法以及通过X射线曝光方法制造的半导体器件
    • US5553110A
    • 1996-09-03
    • US345395
    • 1994-11-18
    • Koichi SentokuKenji SaitoKeiko ChibaHiroshi Maehara
    • Koichi SentokuKenji SaitoKeiko ChibaHiroshi Maehara
    • G03F7/20C30B33/00G03F1/22H01L21/027H01L21/302H01L21/3065H01L39/00
    • G03F1/22Y10S430/167Y10S430/168
    • An X-ray mask structure for X-ray lithography comprises a pattern, an X-ray transmissive film for holding the pattern, and a frame for supporting the X-ray transmissive film, wherein a light-scattering prevention film is formed on at least a part of the surface of the X-ray transmissive film and/or of the pattern, and the light scattering prevention film may be a flat coating film formed on at least one of the top face and the back face of the X-ray transmissive film and having a refractive index substantially equal to the refractive index of the X-ray transmissive film. A process for producing the X-ray mask structure comprises steps of forming a flat coating film having a refractive index substantially the same as that of the X-ray transmissive film on at least one of the top face and the back face of the X-ray transmissive film, and forming a pattern at least on the top face of the X-ray transmissive film. An X-ray exposure apparatus comprises an X-ray source, and the X-ray mask structure, and conducts transcription of the pattern formed on the x-ray mask structure onto a transcription-receiving member by projecting X-rays through the X-ray mask structure to the transcription receiving member.
    • 用于X射线光刻的X射线掩模结构包括图案,用于保持图案的X射线透射膜和用于支撑X射线透射膜的框架,其中至少形成光散射防止膜 X射线透过膜表面的一部分和/或图案的一部分,光散射防止膜可以是形成在X射线透射性的上表面和背面的至少一面上的平坦的涂膜 并且具有基本上等于X射线透射膜的折射率的折射率。 一种X射线掩模结构体的制造方法,其特征在于,在上述X射线掩模结构的上表面和背面的至少一面上,形成与X射线透过膜的折射率基本相同的折射率的平面涂膜, 并且至少在X射线透射膜的顶面上形成图案。 X射线曝光装置包括X射线源和X射线掩模结构,并且通过X射线X射线透过X射线掩模结构将X射线掩模结构上形成的图案转印到转录接收部件上, 射线掩模结构。
    • 8. 发明授权
    • X-ray mask and fabrication process using it
    • X射线掩模和使用它的制作工艺
    • US5870448A
    • 1999-02-09
    • US855473
    • 1997-05-13
    • Hiroshi MaeharaKeiko Chiba
    • Hiroshi MaeharaKeiko Chiba
    • G03F1/22G21K1/10H01L21/027G21K5/00
    • G03F1/22G21K1/10
    • The present X-ray mask comprises an X-ray transmitting film, and a mask pattern formed on the X-ray transmitting film, wherein the mask pattern includes a mixture of a high-contrast pattern and a low-contrast pattern against X-rays and wherein the high-contrast pattern is comprised of stacked films the number of which is larger than that of the low-contrast pattern and which are made of different kinds of materials. A fabrication process of this X-ray mask comprises a step of forming a first metal film; a step of forming a second metal film of a different kind of material from the first metal film, thereon; and a step of successively performing a resist application process and an etching process to form a portion where the both first and second metal films are removed, a portion where only the first metal layer is left, and a portion where the both first and second metal layers are left, thereby forming a mask pattern.
    • 本X射线掩模包括X射线透射膜和形成在X射线透射膜上的掩模图案,其中掩模图案包括针对X射线的高对比度图案和低对比度图案的混合物 并且其中所述高对比度图案包括数量大于所述低对比度图案并且由不同种类的材料制成的堆叠薄膜。 该X射线掩模的制造工艺包括形成第一金属膜的步骤; 在其上形成与第一金属膜不同种类的材料的第二金属膜的步骤; 以及连续进行抗蚀剂涂布处理和蚀刻工序以形成去除了第一和第二金属膜两者的部分,仅剩下第一金属层的部分,以及第一和第二金属 留下层,从而形成掩模图案。