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1. 发明授权

US08618515B2 Lithography apparatus and device manufacturing method 失效
标题翻译：平版印刷设备和器件制造方法
公开(公告)号：US08618515B2
公开(公告)日：2013-12-31
申请号：US13162979
申请日：2011-06-17
申请人： Koichi Sentoku
发明人： Koichi Sentoku
IPC分类号： G21G1/10 , H01J37/08 , G02B27/42 , H01J37/317 , G03F9/00 , G03F7/20
CPC分类号： H01J37/3174 , B82Y10/00 , B82Y40/00 , G03F7/2059 , G03F9/7011 , G03F9/7019 , G03F9/7053 , H01J37/3045 , H01J37/3177 , H01J2237/24528 , H01J2237/2482
摘要： A lithography apparatus includes a first measurement device which measures a position of a mark on a substrate with light, a second measurement device which measures a position of a reference mark on a stage with a charged-particle, a detector which detects the position of the stage in a first direction parallel to the axis of a projection system and a second direction perpendicular to this axis, and a controller. The controller determines a charged-particle beam, in which the angle, with respect to the first direction, at which it is incident on the reference mark falls within a tolerance, and obtains a baseline for the first measurement device from the position of the reference mark measured by the second measurement device using the determined charged-particle beam and the position of the reference mark measured by the first measurement device.
摘要翻译：光刻设备包括：用光测量基板上的标记位置的第一测量装置，测量带有带电粒子的台上的参考标记的位置的第二测量装置;检测所述基板的位置的检测器; 在平行于投影系统的轴线的第一方向和垂直于该轴线的第二方向的第一方向上的台阶，以及控制器。控制器确定带电粒子束，其中相对于其入射到参考标记上的第一方向的角度落在公差内，并从参考点的位置获得第一测量装置的基线由第二测量装置使用确定的带电粒子束测量的标记和由第一测量装置测量的参考标记的位置。

2. 发明授权

US07771905B2 Method and program for calculating exposure dose and focus position in exposure apparatus, and device manufacturing method 失效
标题翻译：用于计算曝光装置中的曝光剂量和聚焦位置的方法和程序以及装置制造方法
公开(公告)号：US07771905B2
公开(公告)日：2010-08-10
申请号：US11618137
申请日：2006-12-29
申请人： Koichi Sentoku , Hideki Ina , Koji Mikami , Yoshiaki Sugimura , Hiroto Yoshii , Tomoyuki Miyashita
发明人： Koichi Sentoku , Hideki Ina , Koji Mikami , Yoshiaki Sugimura , Hiroto Yoshii , Tomoyuki Miyashita
IPC分类号： G03F9/00
CPC分类号： G03F7/70641 , G03F7/70625
摘要： A method for calculating an offset of an exposure dose and a focus position in an exposure apparatus that exposes a substrate via an original includes the steps of obtaining information of a shape of a pattern formed on the substrate using the exposure apparatus, calculating a shift amount between a critical dimension contained in the information of the shape of the pattern and a reference value of the critical dimension, and calculating an offset of the focus position based on the information of the shape of the pattern, and calculating the offset of the exposure dose based on the shift amount and the offset of the focus position.
摘要翻译：用于计算经由原稿曝光基板的曝光装置中的曝光剂量和聚焦位置的偏移量的方法包括以下步骤：使用曝光装置获得在基板上形成的图案的形状的信息，计算偏移量在包含在图案形状的信息和临界尺寸的参考值之间的临界尺寸之间，基于图案形状的信息计算焦点位置的偏移量，以及计算曝光剂量的偏移量基于偏移量和焦点位置的偏移。

3. 发明申请

US20100002215A1 IMAGING OPTICAL SYSTEM, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD 审中-公开
标题翻译：成像光学系统，曝光装置和装置制造方法
公开(公告)号：US20100002215A1
公开(公告)日：2010-01-07
申请号：US12496544
申请日：2009-07-01
申请人： Koichi Sentoku
发明人： Koichi Sentoku
IPC分类号： G03B27/52
CPC分类号： G03B27/52 , G03F9/7034
摘要： An optical system is used in a detection unit of an exposure apparatus that projects an original pattern by exposure onto a substrate via a projection optical system. The detection unit detects a position of the substrate in the optical axis direction of the projection optical system. The optical system includes a first imaging optical system configured to form an object image in the measurement region of the substrate by oblique light incidence, and a second imaging optical system configured to focus the object image onto a light receiving unit. The following relationship is satisfied: (α−1)×(γ−1)>0 where β represents an absolute value of a magnification of the first imaging optical system, α×L2 represents an image distance, γ/β represents an absolute value of a magnification of the second imaging optical system, L2 represents an object distance, and α and γ are positive real numbers.
摘要翻译：在曝光装置的检测单元中使用光学系统，通过投影光学系统将原始图案曝光于基板上。检测单元检测基板在投影光学系统的光轴方向上的位置。光学系统包括第一成像光学系统，被配置为通过倾斜光入射在基板的测量区域中形成物体图像;以及第二成像光学系统，被配置为将对象图像聚焦到光接收单元上。满足以下关系：（α-1）×（γ-1）> 0其中β表示第一成像光学系统的放大倍率的绝对值，alphaxL2表示图像距离，γ/β表示第二成像光学系统的倍率L2表示物体距离，α和γ是正实数。

4. 发明授权

US07531821B2 Imprint apparatus and imprint method including dual movable image pick-up device 有权
标题翻译：印刷装置和压印方法，包括双移动图像拾取装置
公开(公告)号：US07531821B2
公开(公告)日：2009-05-12
申请号：US11851006
申请日：2007-09-06
申请人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
发明人： Nobuhito Suehira , Junichi Seki , Hideki Ina , Koichi Sentoku
IPC分类号： G01N21/86
CPC分类号： G03F9/7088 , B82Y10/00 , B82Y40/00 , G03F7/0002 , G03F9/7003 , G03F9/7042 , G06K9/325
摘要： An imprint apparatus, comprising a first holder for holding a mold having an imprint pattern; a second holder for holding a workpiece to which the imprint pattern is transferred; a first illumination system for irradiating a mark for determining a position of the mold and a mark for determining a position of the workpiece with light; a first and second optical systems for imaging the marks for the mold and workpiece at a first and second observation points respectively; an imaging optical system; a first and second image pick-up devices for observing the marks for the mold and workpiece respectively; and at least one of a first drive mechanism for moving the first image pick-up device while following movement of the first observation point and a second drive mechanism for moving the second image pick-up device while following movement of the second observation point.
摘要翻译：一种压印装置，包括用于保持具有印记图案的模具的第一保持器; 用于保持印刷图案被转印到的工件的第二保持器; 用于照射用于确定模具的位置的标记的第一照明系统和用于用光确定工件的位置的标记; 第一和第二光学系统，用于分别在第一和第二观察点成像用于模具和工件的标记; 成像光学系统; 分别用于观察模具和工件的标记的第一和第二图像拾取装置; 以及用于在跟随第一观察点的移动的同时移动第一图像拾取装置的第一驱动机构和用于在第二观察点的移动之前移动第二图像拾取装置的第二驱动机构中的至少一个。

5. 发明授权

US07435984B2 Imaging optical system and exposure apparatus 有权
标题翻译：成像光学系统和曝光装置
公开(公告)号：US07435984B2
公开(公告)日：2008-10-14
申请号：US11456115
申请日：2006-07-07
申请人： Koichi Sentoku , Gaku Takahashi , Hideki Ina , Yoshinori Miwa
发明人： Koichi Sentoku , Gaku Takahashi , Hideki Ina , Yoshinori Miwa
IPC分类号： G01N21/86
CPC分类号： G03F7/70883 , G02B13/143 , G02B17/0844 , G03F7/70275 , G03F9/7096
摘要： An imaging optical system for imaging a pattern of an object plane onto an image plane includes a first imaging optical system for imaging at a first imaging position, the first imaging optical system having a magnification α in a vacuum atmosphere, and a second imaging optical system for imaging at a second imaging position, the second imaging optical system having a magnification β in the vacuum atmosphere, wherein when an environment in which the imaging optical system is placed changes from the vacuum atmosphere to an air atmosphere or vise versa, a direction of the first imaging position that moves along an optical axis is opposite to a direction of the second imaging position that moves along the optical axis.
摘要翻译：用于将物平面图案成像到图像平面上的成像光学系统包括用于在第一成像位置成像的第一成像光学系统，具有在真空气氛中的α倍的第一成像光学系统和第二成像光学系统为了在第二成像位置进行成像，第二成像光学系统在真空气氛中具有放大率β，其中当放置成像光学系统的环境从真空气氛改变到空气气氛或反之亦然时，方向沿着光轴移动的第一成像位置与沿着光轴移动的第二成像位置的方向相反。

6. 发明授权

US07271882B2 Shape measuring apparatus, shape measuring method, and aligning method 有权
标题翻译：形状测量装置，形状测量方法和对准方法
公开(公告)号：US07271882B2
公开(公告)日：2007-09-18
申请号：US11130073
申请日：2005-05-17
申请人： Hideki Ina , Koichi Sentoku , Takahiro Matsumoto
发明人： Hideki Ina , Koichi Sentoku , Takahiro Matsumoto
IPC分类号： G01N21/00
CPC分类号： G01Q30/02 , B24B37/005 , B24B37/042 , B24B49/10 , B24B49/12 , G01B11/2441 , G01B21/20 , Y10S977/868
摘要： A shape measuring method for measuring a shape of a surface of an object. The method includes a first measuring step for measuring the surface of the object by detecting light from the object, and a second measuring step for measuring the surface of the object by relatively scanning a probe and the object. A scanning speed changes on the basis of the result of the first measurement step.
摘要翻译：一种用于测量物体表面形状的形状测量方法。该方法包括：第一测量步骤，用于通过检测来自物体的光来测量物体的表面;以及第二测量步骤，用于通过相对扫描探针和物体来测量物体的表面。基于第一测量步骤的结果，扫描速度改变。

7. 发明申请

US20050270504A1 Measurement method and apparatus, exposure apparatus, and device fabrication method 有权
标题翻译：测量方法和装置，曝光装置和装置制造方法
公开(公告)号：US20050270504A1
公开(公告)日：2005-12-08
申请号：US11142964
申请日：2005-06-01
申请人： Atsushi Takagi , Hideki Ina , Koichi Sentoku , Hiroshi Morohoshi
发明人： Atsushi Takagi , Hideki Ina , Koichi Sentoku , Hiroshi Morohoshi
IPC分类号： G03F7/20 , G03B27/68 , H01L21/027
CPC分类号： G03F7/706
摘要： A measurement method for measuring a distortion of a projection optical system that projects a pattern, used by an exposure apparatus that exposes the reticle pattern onto an object to be exposed, the measurement method includes the steps of a first exposing step for exposing a mark pattern onto the object to be exposed, the mark pattern having a mark on or near an optical axis of the projection optical system and a mark beside the optical axis, and being arranged at a position of the reticle, a second exposing step for only exposing a mark on or near the optical axis of the projection optical system in the mark pattern, measuring step for measuring a shape of the mark formed on the object to be exposed via the first and second exposing steps, and calculating step for calculating the distortion of the projection optical system from the shape of the mark measured by the measuring step.
摘要翻译：一种测量方法，用于测量投影光学系统的变形，所述投影光学系统将曝光所述掩模版图案的曝光装置所使用的图案投影到待曝光的物体上，所述测量方法包括以下步骤：第一曝光步骤，用于曝光标记图案在待曝光的物体上，标记图案在投影光学系统的光轴上或其附近具有标记，并且在光轴旁边具有标记，并且被布置在光罩的位置处，第二曝光步骤仅用于曝光在标记图案中的投影光学系统的光轴上或附近标记的测量步骤，用于测量经由第一和第二曝光步骤在待曝光的物体上形成的标记的形状的测量步骤，以及用于计算第投影光学系统从由测量步骤测量的标记的形状。

8. 发明申请

US20050211918A1 Alignment apparatus, exposure apparatus using same, and method of manufacturing devices 失效
标题翻译：对准装置，使用其的曝光装置以及制造装置的方法
公开(公告)号：US20050211918A1
公开(公告)日：2005-09-29
申请号：US11132260
申请日：2005-05-19
申请人： Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku
发明人： Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku
IPC分类号： G02B17/08 , G03F1/22 , G03F1/24 , G03F7/20 , G03F9/00 , H01L21/027 , H01L21/68 , G01J1/00 , A61N5/00 , G01N21/00
CPC分类号： G03F9/7065 , G03F7/70233 , G03F7/70283 , G03F9/7011 , G03F9/7015 , G03F9/7088
摘要： An alignment apparatus for aligning a reflective reticle includes a light source for emitting alignment light, an optical alignment mark provided on the reticle, and a reference mark provided on a reticle stage that holds the reticle. A detecting unit detects the alignment light reflected from the alignment mark and the reference mark, and the reticle is aligned on the basis of the result of detection by the detection unit.
摘要翻译：用于对准反射标线的对准装置包括用于发射对准光的光源，设置在光罩上的光学对准标记，以及设置在保持光罩的标线片台上的参考标记。检测单元检测从对准标记和参考标记反射的对准光，并且基于检测单元的检测结果对准标线。

9. 发明授权

US06950179B2 Shape measuring apparatus, shape measuring method, and aligning method 失效
标题翻译：形状测量装置，形状测量方法和对准方法
公开(公告)号：US06950179B2
公开(公告)日：2005-09-27
申请号：US10156921
申请日：2002-05-30
申请人： Hideki Ina , Koichi Sentoku , Takahiro Matsumoto
发明人： Hideki Ina , Koichi Sentoku , Takahiro Matsumoto
IPC分类号： G01B11/22 , B24B49/10 , B24B49/12 , G01B11/24 , G01B21/00 , G01B21/02 , G01B21/20 , G01Q10/02 , G01Q30/02 , G01Q60/00 , G01Q60/24 , G01Q60/34 , G01Q60/38 , G01Q80/00 , G03F9/00 , G01N21/00 , G01N23/00
CPC分类号： G01Q30/02 , B24B37/005 , B24B37/042 , B24B49/10 , B24B49/12 , G01B11/2441 , G01B21/20 , Y10S977/868
摘要： A shape measuring method for measuring a shape of a surface of an object. The method includes a first measuring step for measuring the surface of the object by detecting light from the object, and a second measuring step for measuring the surface of the object by relatively scanning a probe and the object. A scanning speed changes on the basis of the result of the first measurement step.
摘要翻译：一种用于测量物体表面形状的形状测量方法。该方法包括：第一测量步骤，用于通过检测来自物体的光来测量物体的表面;以及第二测量步骤，用于通过相对扫描探针和物体来测量物体的表面。基于第一测量步骤的结果，扫描速度改变。

10. 发明申请

US20050137837A1 Management system and apparatus method therefor, and device manufacturing method 有权
标题翻译：管理系统及其装置方法及装置制造方法
公开(公告)号：US20050137837A1
公开(公告)日：2005-06-23
申请号：US10901106
申请日：2004-07-29
申请人： Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku , Takahiro Matsumoto
发明人： Satoru Oishi , Hideki Ina , Takehiko Suzuki , Koichi Sentoku , Takahiro Matsumoto
IPC分类号： G03F9/00 , G03F7/20 , G05B19/418 , H01L21/027 , G06F17/50
CPC分类号： G03F7/70633 , G03F7/705 , G03F7/70525 , G03F9/7092 , G05B2219/32018 , Y02P90/22
摘要： A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3σ) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.
摘要翻译：管理工业设备的参数的管理装置获取通过操作工作装置具有操作作业参数值和非操作作业参数值而获得的AGA测量结果。检查装置获取通过检查操作工作中的工业装置的操作结果而获得的“检查结果”。根据AGA测量结果和检查结果估计参数值变化时检查结果的变化。将待处理对象（例如，晶片）之间的参数值和检查结果中的变化（3sigma）的检查结果的灵敏度（斜率）两者或至少一个最小化（极端）的变量设置为最优参数。

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