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    • 2. 发明授权
    • Opto-semiconductor devices
    • 光电半导体器件
    • US07720127B2
    • 2010-05-18
    • US12232652
    • 2008-09-22
    • Yutaka InoueKazunori SaitohHiroshi HamadaMasato HagimotoSusumu Sorimachi
    • Yutaka InoueKazunori SaitohHiroshi HamadaMasato HagimotoSusumu Sorimachi
    • H01S3/097
    • H01S5/0224B82Y20/00H01S5/02212H01S5/02272H01S5/02476H01S5/0425H01S5/16H01S5/2081H01S5/22H01S5/34326H01S2301/14
    • An opto-semiconductor device. An opto-semiconductor element includes a semiconductor substrate, a multilayered semiconductor layer formed on a first surface of the semiconductor substrate and having a resonator, a first electrode with multiple conductive layers formed on the multilayered semiconductor layer, and a second electrode formed on a second surface of the semiconductor substrate. A support substrate has a first surface formed with a fixing portion having a conductive layer for fixing the first electrode connected thereto through a bonding material. Bonding material and conductive layers forming the first electrode react to form a reaction layer. The difference in thermal expansion coefficient between semiconductor substrate and support substrate is not more than ±50%. A second barrier metal layer not reactive with bonding material is formed inside the first electrode uppermost conductive layer, while uppermost layer reacts with the bonding material to form the reaction layer.
    • 光电半导体器件。 光半导体元件包括半导体衬底,形成在半导体衬底的第一表面上并具有谐振器的多层半导体层,形成在多层半导体层上的多个导电层的第一电极和形成在第二层上的第二电极 半导体衬底的表面。 支撑基板具有形成有固定部的第一表面,该固定部具有用于通过接合材料固定与其连接的第一电极的导电层。 形成第一电极的接合材料和导电层反应形成反应层。 半导体衬底和支撑衬底之间的热膨胀系数差不超过±50%。 在第一电极最上层的导电层的内部形成与接合材料不反应的第二阻挡金属层,而最上层与接合材料反应形成反应层。
    • 8. 发明授权
    • Manufacturing method of optical semiconductor device
    • 光学半导体器件的制造方法
    • US07674391B2
    • 2010-03-09
    • US11700215
    • 2007-01-31
    • Hiroshi HamadaKazunori Saitoh
    • Hiroshi HamadaKazunori Saitoh
    • B29D11/00
    • H01S5/22B82Y20/00H01S5/028H01S5/209H01S5/2201H01S5/2214H01S5/34326H01S2301/185
    • It is an objective to control the occurrence of the disorder of a far-field pattern and of an optical axial shift. A manufacturing method of a semiconductor laser device has the step for preparing a semiconductor substrate which has growth of a multi-layer including an active layer, the step for forming a mask over the growth of a multi-layer, and a step for forming a stripe-shaped ridge by dry etching and wet etching. A structure stacking a p-type AlGaInP layer, an etch-stop layer, a p-type Alx=0.7GaInP layer, a p-type Alx=0.6GaInP layer, a p-type GaAs layer, in order, over the active layer is taken in order to make the tailing part created in the dry etching process smaller by wet etching. The tailing part is composed of a p-type Alx=0.7GaInP layer including a high mixed crystal ratio of aluminum. Therefore, the p-type Alx=0.7GaInP layer is etched faster than the p-type Alx=0.6GaInP layer during wet etching, so that the tailing part becomes smaller, the far-field pattern of the semiconductor laser device is not disordered, and the optical axis shift does not occur.
    • 目的是控制远场图案和光轴向偏移的发生。 半导体激光器件的制造方法具有制备半导体衬底的步骤,该半导体衬底具有包括有源层的多层的生长,用于在多层生长上形成掩模的步骤,以及用于形成 通过干蚀刻和湿蚀刻形成条形脊。 在有源层上依次堆叠p型AlGaInP层,蚀刻停止层,p型Al x = 0.7GaInP层,p型Al x = 0.6 GaInP层,p型GaAs层的结构 是为了使通过湿法蚀刻在干式蚀刻工艺中产生的拖尾部分变得更小。 尾部由包含铝的高混合比的p型Al x = 0.7GaInP层构成。 因此,在湿蚀刻期间,p型Al x = 0.7GaInP层比p型Al x = 0.6GaInP层蚀刻得更快,使得尾部变小,半导体激光器件的远场图案不会紊乱, 并且不发生光轴偏移。
    • 9. 发明申请
    • Manufacturing method of optical semiconductor device
    • 光学半导体器件的制造方法
    • US20070284336A1
    • 2007-12-13
    • US11700215
    • 2007-01-31
    • Hiroshi HamadaKazunori Saitoh
    • Hiroshi HamadaKazunori Saitoh
    • C03C15/00C03C25/68
    • H01S5/22B82Y20/00H01S5/028H01S5/209H01S5/2201H01S5/2214H01S5/34326H01S2301/185
    • It is an objective to control the occurrence of the disorder of a far-field pattern and of an optical axial shift. A manufacturing method of a semiconductor laser device has the step for preparing a semiconductor substrate which has growth of a multi-layer including an active layer, the step for forming a mask over the growth of a multi-layer, and a step for forming a stripe-shaped ridge by dry etching and wet etching. A structure stacking a p-type AlGaInP layer, an etch-stop layer, a p-type Alx=0.7GaInP layer, a p-type Alx=0.6GaInP layer, a p-type GaAs layer, in order, over the active layer is taken in order to make the tailing part created in the dry etching process smaller by wet etching. The tailing part is composed of a p-type Alx=0.7GaInP layer including a high mixed crystal ratio of aluminum. Therefore, the p-type Alx=0.7GaInP layer is etched faster than the p-type Alx=0.6GaInP layer during wet etching, so that the tailing part becomes smaller, the far-field pattern of the semiconductor laser device is not disordered, and the optical axis shift does not occur.
    • 目的是控制远场图案和光轴向偏移的发生。 半导体激光器件的制造方法具有制备半导体衬底的步骤,该半导体衬底具有包括有源层的多层的生长,用于在多层生长上形成掩模的步骤,以及用于形成 通过干蚀刻和湿蚀刻形成条形脊。 堆叠p型AlGaInP层,蚀刻停止层,p型Al x = 0.7 GaInP层,p型Al x = 0.6 GaInP的结构 层,p型GaAs层,依次在有源层上,以使得在干式蚀刻工艺中产生的拖尾部分通过湿蚀刻较小。 尾部由包含铝的高混合比的p型Al x = 0.7 GaInP层构成。 因此,在湿蚀刻期间,p型Al x = 0.7 GaInP层比p型Al x = 0.6 GaInP层蚀刻得更快,使得尾部变成 较小的半导体激光器件的远场图案不会发生紊乱,并且不发生光轴偏移。
    • 10. 发明申请
    • Opto-semiconductor devices
    • 光电半导体器件
    • US20060222031A1
    • 2006-10-05
    • US11387986
    • 2006-03-24
    • Yutaka InoueKazunori SaitohHiroshi HamadaMasato HagimotoSusumu Sorimachi
    • Yutaka InoueKazunori SaitohHiroshi HamadaMasato HagimotoSusumu Sorimachi
    • H01S5/00H01S3/04
    • H01S5/0224B82Y20/00H01S5/02212H01S5/02272H01S5/02476H01S5/0425H01S5/16H01S5/2081H01S5/22H01S5/34326H01S2301/14
    • An opto-semiconductor device. An opto-semiconductor element includes a semiconductor substrate, a multilayered semiconductor layer formed on a first surface of the semiconductor substrate and having a resonator, a first electrode with multiple conductive layers formed on the multilayered semiconductor layer, and a second electrode formed on a second surface of the semiconductor substrate. A support substrate has a first surface formed with a fixing portion having a conductive layer for fixing the first electrode connected thereto through a bonding material. Bonding material and conductive layers forming the first electrode react to form a reaction layer. The difference in thermal expansion coefficient between semiconductor substrate and support substrate is not more than ±50%. A second barrier metal layer not reactive with bonding material is formed inside the first electrode uppermost conductive layer, while uppermost layer reacts with the bonding material to form the reaction layer.
    • 光电半导体器件。 光半导体元件包括半导体衬底,形成在半导体衬底的第一表面上并具有谐振器的多层半导体层,形成在多层半导体层上的多个导电层的第一电极和形成在第二层上的第二电极 半导体衬底的表面。 支撑基板具有形成有固定部的第一表面,该固定部具有用于通过接合材料固定与其连接的第一电极的导电层。 形成第一电极的接合材料和导电层反应形成反应层。 半导体衬底和支撑衬底之间的热膨胀系数差不超过±50%。 在第一电极最上层的导电层的内部形成与接合材料不反应的第二阻挡金属层,而最上层与接合材料反应形成反应层。