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    • 1. 发明授权
    • Semiconductor device with negative differential resistance characteristics
    • 具有负差分电阻特性的半导体器件
    • US06690030B2
    • 2004-02-10
    • US09798923
    • 2001-03-06
    • Junji KogaKen UchidaRyuji OhbaAkira Toriumi
    • Junji KogaKen UchidaRyuji OhbaAkira Toriumi
    • H01L2940
    • H01L27/1104H01L21/28273H01L27/115H01L29/42324H01L29/511H01L29/7881
    • A gate oxide film formed on the surface of a silicon substrate is partly reduced in thickness or “thinned” at its specified part overlying a source region. In a gate region, a multilayer structure is formed which includes a first polycrystalline silicon or “polysilicon” film of a p-type conductivity, a tunnel oxide film, and a second p-type polysilicon film in this order of lamination. The source region and the first polysilicon film make up a high-concentration impurity-doped pn junction with a thin silicon oxide film laid therebetween, providing a tunnel diode also known as Esaki diode. The diode is used for a negative differential resistance. Further, a portion between the first and second polysilicon films is a non-linear tunnel resistor, which serves as a load. The negative differential resistance and the load are serially connected together between a low-voltage power supply (ground potential) Vss and a high-voltage power supply Vdd, thus enabling forming a transistor with a built-in bistable circuit. Potential information of the first polysilicon film for use as a data storage node is read with a transistor amplification applied thereto. Thus, data read is performed at high speeds. Simultaneously, a current flowing between the power supplies is suppressed to a lower level, thereby minimizing power consumption in wait modes.
    • 形成在硅衬底表面上的栅极氧化膜的厚度部分地减小或者在其源区域上的指定部分“薄化”。 在栅极区域中,以层叠的顺序形成包括p型导电体的第一多晶硅或“多晶硅”膜,隧道氧化物膜和第二p型多晶硅膜的多层结构。 源极区域和第一多晶硅膜构成了高浓度杂质掺杂的pn结,其间铺设有薄的氧化硅膜,提供了也称为Esaki二极管的隧道二极管。 二极管用于负差分电阻。 此外,第一和第二多晶硅膜之间的部分是用作负载的非线性隧道电阻器。 负的差分电阻和负载在低压电源(接地电位)Vss和高压电源Vdd之间串联连接在一起,从而能够形成具有内置双稳态电路的晶体管。 读取用作数据存储节点的第一多晶硅膜的电位信息,并施加晶体管放大。 因此,高速执行数据读取。 同时,在电源之间流动的电流被抑制到较低的电平,从而使等待模式中的功耗最小化。
    • 5. 发明授权
    • Field effect transistor and manufacturing method thereof
    • 场效应晶体管及其制造方法
    • US06208002B1
    • 2001-03-27
    • US09229567
    • 1999-01-13
    • Hideki SatakeAkira Toriumi
    • Hideki SatakeAkira Toriumi
    • H01L31119
    • H01L21/28185H01L21/28202H01L21/3003H01L29/518
    • In the manufacturing process of a field effect transistor, the main surface of the semiconductor layer is exposed to the atmosphere containing oxygen atoms and nitrogen atoms at first. Then, the gate insulating film is formed by introducing heavy hydrogen atoms therein such that the concentration of heavy hydrogen atoms in the interface of a gate insulating film and the gate electrode is higher than that of a middle portion of the gate insulating film located in the middle of the gate insulating film in the direction of the thickness of the gate insulating film. Subsequently, the gate electrode is formed on the gate insulating film. Then, source and drain regions are formed on the main surface of the semiconductor layer to sandwich the gate electrode therebetween. By virtue of the above-mentioned method, a gate insulating film having a small thickness and high electric stability can be obtained.
    • 在场效晶体管的制造过程中,首先将半导体层的主表面暴露于含有氧原子和氮原子的气氛中。 然后,通过在其中引入重氢原子形成栅极绝缘膜,使得栅极绝缘膜和栅电极的界面中的重氢原子的浓度高于位于栅极绝缘膜中的栅极绝缘膜的中间部分 栅极绝缘膜的中间在栅极绝缘膜的厚度方向上。 随后,在栅极绝缘膜上形成栅电极。 然后,在半导体层的主表面上形成源极和漏极区,以将栅电极夹在其间。 通过上述方法,可以获得厚度小,电稳定性高的栅极绝缘膜。