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    • 8. 发明授权
    • Vapor deposition process
    • 气相沉积工艺
    • US06790486B2
    • 2004-09-14
    • US10064887
    • 2002-08-27
    • Boris A. MovchanIrene SpitsbergRamgopal Darolia
    • Boris A. MovchanIrene SpitsbergRamgopal Darolia
    • C08J718
    • C23C14/083C23C14/30C23C14/548C23C28/321C23C28/3215C23C28/325C23C28/345C23C28/3455
    • A process for depositing a ceramic coating on a component. The process involves a technique for evaporating an evaporation source containing multiple different oxide compounds, at least one of the oxide compounds having a vapor pressure that is higher than the remaining oxide compounds, to deposit a coating of the multiple oxide compounds. A high energy beam is projected onto the evaporation source to melt and form a vapor cloud of the oxide compounds of the evaporation source, while preventing the vapor cloud from contacting and condensing on the component during an initial phase in which the relative amount of the one oxide compound in the vapor cloud is greater than its relative amount in the evaporation source. During a subsequent phase in which the relative amount of the one oxide compound in the vapor cloud has decreased to something approximately equal to its relative amount in the evaporation source, the vapor cloud is allowed to contact and condense on the component to form the coating.
    • 用于在组件上沉积陶瓷涂层的方法。 该方法涉及一种用于蒸发含有多种不同氧化物化合物的蒸发源的技术,至少一种具有高于其余氧化物化合物的蒸汽压的氧化物化合物沉积多种氧化物化合物的涂层。 将高能量束投影到蒸发源上以熔化并形成蒸发源的氧化物化合物的蒸汽云,同时防止蒸气云在初始阶段期间在组分上接触和冷凝,其中相对量 蒸汽云中的氧化物化合物大于其在蒸发源中的相对量。 在蒸发云中的一种氧化物化合物的相对量已经降低到与蒸发源中的相对量近似相似的量的后续阶段中,允许蒸汽云接触并冷凝在组分上以形成涂层。