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1. 发明申请

US20120138091A1 PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME 有权
标题翻译：半导体工件的加工组件及其加工方法
公开(公告)号：US20120138091A1
公开(公告)日：2012-06-07
申请号：US12960378
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/6719 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件可以包括构造成与转子组件一起旋转的堰。还提供了一种处理半导体工件的方法。

2. 发明授权

US09799537B2 Processing assembly for semiconductor workpiece and methods of processing same 有权
公开(公告)号：US09799537B2
公开(公告)日：2017-10-24
申请号：US12960378
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/02 , H01L21/67 , H01L21/687 , B08B3/04
CPC分类号： H01L21/67051 , H01L21/6719 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.

3. 发明授权

US08541309B2 Processing assembly for semiconductor workpiece and methods of processing same 有权
标题翻译：半导体工件加工组件及其加工方法
公开(公告)号：US08541309B2
公开(公告)日：2013-09-24
申请号：US12960372
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/302
CPC分类号： H01L21/6719 , H01L21/67051 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件包括围绕转子组件并具有多个堰的堰组件。用于处理半导体工件的方法通常包括移动转子组件和堰组件中的至少一个。

4. 发明申请

US20120142196A1 PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME 有权
标题翻译：半导体工件的加工组件及其加工方法
公开(公告)号：US20120142196A1
公开(公告)日：2012-06-07
申请号：US12960372
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/302 , B05D5/12
CPC分类号： H01L21/6719 , H01L21/67051 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件包括围绕转子组件并具有多个堰的堰组件。用于处理半导体工件的方法通常包括移动转子组件和堰组件中的至少一个。

5. 发明申请

US20120292181A1 ELECTROCHEMICAL PROCESSOR 失效
标题翻译：电化学处理器
公开(公告)号：US20120292181A1
公开(公告)日：2012-11-22
申请号：US13110728
申请日：2011-05-18
申请人： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson
发明人： Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson
IPC分类号： C25D17/00
CPC分类号： C25D17/001 , C25D5/08 , C25D17/005 , C25D17/007 , C25D17/008 , C25D17/12
摘要： An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and outer anolyte chambers within the vessel. An upper cup in the vessel, has a curved upper surface and inner and outer catholyte chambers. A current thief is located adjacent to the curved upper surface. Annular slots in the curved upper curved surface connect into passageways, such as tubes, leading into the outer catholyte chamber. Membranes may separate the inner and outer anolyte chambers from the inner and outer catholyte chambers, respectively.
摘要翻译：电化学处理器可以包括具有被配置为保持工件的转子的头部，头部可移动以将转子定位在容器中。内阳极和外阳极在容器内部和外部阳极电解液室中。容器中的上杯具有弯曲的上表面和内部和外部阴极电解液室。目前的小偷位于弯曲的上表面附近。弯曲的上曲面中的环形槽连接到通道，例如管，通向外阴极室。膜可以分别将内部和外部阳极电解液室与内部和外部阴极电解液室分开。

6. 发明申请

US20120152751A1 ELECTROLYTIC COPPER PROCESS USING ANION PERMEABLE BARRIER 有权
标题翻译：电解铜工艺使用阴离子渗透性阻挡层
公开(公告)号：US20120152751A1
公开(公告)日：2012-06-21
申请号：US13406387
申请日：2012-02-27
申请人： Rajesh Baskaran , Robert W. Batz, JR. , Bioh Kim , Tom L. Ritzdorf , John Lee Klocke , Kyle M. Hanson
发明人： Rajesh Baskaran , Robert W. Batz, JR. , Bioh Kim , Tom L. Ritzdorf , John Lee Klocke , Kyle M. Hanson
IPC分类号： C25D21/00
CPC分类号： C25D5/028 , C25D3/12 , C25D3/20 , C25D3/30 , C25D3/34 , C25D3/38 , C25D3/46 , C25D3/54 , C25D5/022 , C25D17/001 , C25D17/002 , C25D21/12 , C25F3/02 , H01L21/2885 , H01L21/76846 , H01L21/76868 , H01L21/76873 , H05K3/423
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and a counter electrode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, a counter electrode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. Some of the described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.
摘要翻译：描述了利用第一处理流体和对电极对微特征工件进行电解处理的工艺和系统。使用第一处理流体，对电极，第二处理流体和阴离子可渗透阻挡层对微特征工件进行电解处理。阴离子可渗透阻挡层将第一处理流体与第二处理流体分离，同时允许某些阴离子物质在两种流体之间转移。所描述的一些方法中的一些在反复电镀循环中产生沉积物，其显示出所需范围内的电阻率值。

7. 发明申请

US20080110751A1 Microelectronic Workpiece Processing Tool Including A Processing Reactor Having A Paddle Assembly for Agitation of a Processing Fluid Proximate to the Workpiece 审中-公开
标题翻译：微电子工件加工工具包括一个加工反应器，具有用于搅拌加工液体的工件的桨式组件
公开(公告)号：US20080110751A1
公开(公告)日：2008-05-15
申请号：US11838453
申请日：2007-08-14
申请人： Thomas H. Oberlitner , Kyle M. Hanson
发明人： Thomas H. Oberlitner , Kyle M. Hanson
IPC分类号： C25B9/00
CPC分类号： H01L21/67086 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/007 , C25D21/10 , H01L21/67005 , H01L21/67023 , H01L21/67057 , H01L21/6723
摘要： An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.
摘要翻译：提供了一种集成工具，其包括具有桨组件的至少一个工件处理站。根据本发明的另一个独立方面，工件加工站适于调节加工流体相对于工件的水平，其中待加工的工件和可能的桨叶的部分选择性地浸入处理流体。根据本发明的另一独立方面，提供了一种在工件处理站中靠近工件使用的桨叶。桨叶包括一组或多组输送口和一组或多组流体回收口。在至少一个实施例中，桨叶用于搅拌靠近工件表面的处理流体。在至少另一个实施例中，桨叶用于将待处理的工件的一个或多个流体递送和/或回收。本发明的一个方面使得通过桨将供应到工件的流体限于位于工件和桨之间的空间，从而避免这些流体与位于碗组件内的处理流体混合，而不是由桨供应。

8. 发明授权

US07357850B2 Electroplating apparatus with segmented anode array 有权
标题翻译：具有分段阳极阵列的电镀设备
公开(公告)号：US07357850B2
公开(公告)日：2008-04-15
申请号：US10234638
申请日：2002-09-03
申请人： Daniel J. Woodruff , Kyle M. Hanson
发明人： Daniel J. Woodruff , Kyle M. Hanson
IPC分类号： C25D17/12 , C25D17/00 , C25B9/00 , C25D3/38
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001
摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.
摘要翻译：电镀设备包括反应器容器，其具有定位在其中的分段阳极阵列，用于实现诸如半导体晶片的相关工件的电镀。阳极阵列包括多个环形阳极段，其优选地彼此以同心的，共面的关系定位。阳极段可以独立地操作以产生与相关联的工件的变化的电势，以促进电镀金属在工件表面上的均匀沉积。

9. 发明授权

US07264698B2 Apparatus and methods for electrochemical processing of microelectronic workpieces 有权
标题翻译：微电子工件电化学处理的装置和方法
公开(公告)号：US07264698B2
公开(公告)日：2007-09-04
申请号：US09872151
申请日：2001-05-31
申请人： Kyle M. Hanson , Thomas L. Ritzdorf , Gregory J. Wilson , Paul R. McHugh
发明人： Kyle M. Hanson , Thomas L. Ritzdorf , Gregory J. Wilson , Paul R. McHugh
IPC分类号： C25D17/00 , C25D17/02 , C25D7/12
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.
摘要翻译：用于反应容器中微电子工件的电化学处理的装置和方法。在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流流。

10. 发明授权

US07150816B2 Apparatus and method for deposition of an electrophoretic emulsion 有权
公开(公告)号：US07150816B2
公开(公告)日：2006-12-19
申请号：US10234982
申请日：2002-09-03
申请人： John L. Klocke , Kyle M. Hanson
发明人： John L. Klocke , Kyle M. Hanson
IPC分类号： C25D13/00 , C25D13/04
CPC分类号： G03F7/164 , C25D7/12 , C25D13/00 , C25D13/12 , C25D13/22 , C25D17/001
摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.

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