专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120138091A1 PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME 有权
标题翻译：半导体工件的加工组件及其加工方法
公开(公告)号：US20120138091A1
公开(公告)日：2012-06-07
申请号：US12960378
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/6719 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件可以包括构造成与转子组件一起旋转的堰。还提供了一种处理半导体工件的方法。

2. 发明授权

US09799537B2 Processing assembly for semiconductor workpiece and methods of processing same 有权
公开(公告)号：US09799537B2
公开(公告)日：2017-10-24
申请号：US12960378
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/02 , H01L21/67 , H01L21/687 , B08B3/04
CPC分类号： H01L21/67051 , H01L21/6719 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.

3. 发明授权

US08541309B2 Processing assembly for semiconductor workpiece and methods of processing same 有权
标题翻译：半导体工件加工组件及其加工方法
公开(公告)号：US08541309B2
公开(公告)日：2013-09-24
申请号：US12960372
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/302
CPC分类号： H01L21/6719 , H01L21/67051 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件包括围绕转子组件并具有多个堰的堰组件。用于处理半导体工件的方法通常包括移动转子组件和堰组件中的至少一个。

4. 发明申请

US20120142196A1 PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME 有权
标题翻译：半导体工件的加工组件及其加工方法
公开(公告)号：US20120142196A1
公开(公告)日：2012-06-07
申请号：US12960372
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/302 , B05D5/12
CPC分类号： H01L21/6719 , H01L21/67051 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件包括围绕转子组件并具有多个堰的堰组件。用于处理半导体工件的方法通常包括移动转子组件和堰组件中的至少一个。

5. 发明授权

US08808888B2 Flow battery systems 有权
标题翻译：流动电池系统
公开(公告)号：US08808888B2
公开(公告)日：2014-08-19
申请号：US12868489
申请日：2010-08-25
申请人： Gregory J. Wilson , Kyle M. Hanson
发明人： Gregory J. Wilson , Kyle M. Hanson
IPC分类号： H01M2/36
CPC分类号： H01M8/186 , H01M4/42 , H01M8/0232 , H01M8/0245 , H01M8/188 , H01M8/20 , H01M12/08 , H01M2250/00 , Y02E60/528
摘要： Embodiments of the invention generally provide for flow battery cells and systems containing a plurality of flow battery cells, and methods for improving metal plating within the flow battery cell, such as by flowing and exposing the catholyte to various types of cathodes. In one embodiment, a flow battery cell is provided which includes a cathodic half cell and an anodic half cell separated by an electrolyte membrane, wherein the cathodic half cell contains a plurality of cathodic wires extending perpendicular or substantially perpendicular to and within the catholyte pathway and in contact with the catholyte, and each of the cathodic wires extends parallel or substantially parallel to each other. In some examples, the plurality of cathodic wires may have at least two arrays of cathodic wires, each array contains at least one row of cathodic wires, and each row extends along the catholyte pathway.
摘要翻译：本发明的实施例通常提供了包含多个流动电池单元的流动电池单元和系统，以及用于改善流动电池单元内的金属电镀的方法，例如通过将阴极电解液流过和暴露于各种类型的阴极。在一个实施例中，提供了流动电池单元，其包括阴极半电池和由电解质膜分离的阳极半电池，其中阴极半电池包含垂直于或基本垂直于阴极电解液通道延伸的多个阴极线，与阴极电解液接触，并且每个阴极线彼此平行或基本平行延伸。在一些示例中，多个阴极线可以具有至少两个阴极线阵列，每个阵列包含至少一排阴极线，并且每排沿着阴极电解液通道延伸。

6. 发明申请

US20120037495A1 DEPLATING CONTACTS IN AN ELECTROCHEMICAL PLATING APPARATUS 有权
标题翻译：在电化学镀膜设备中去除接触
公开(公告)号：US20120037495A1
公开(公告)日：2012-02-16
申请号：US12856357
申请日：2010-08-13
申请人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson
发明人： Daniel J. Woodruff , Nolan L. Zimmerman , John L. Klocke , Klaus H. Pfeifer , Kyle M. Hanson
IPC分类号： C25D17/10
CPC分类号： C25D17/001
摘要： An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.
摘要翻译：具有改进的接触脱落特征的电镀设备包括具有用于保持电镀溶液的碗的碗组件。具有转子的头部包括接触环和用于使转子旋转的头马达在电镀操作期间与碗组件配合。可以使用提升/旋转致动器来移动头部以将接触环的扇形部分定位在凹槽或凹槽模块的开口中。由于脱模在脱模模块内进行，而不是在碗组件内进行，因此，碗组件中的电镀溶液不受脱铝过程的影响。

7. 发明授权

US07938942B2 Single side workpiece processing 失效
标题翻译：单面工件加工
公开(公告)号：US07938942B2
公开(公告)日：2011-05-10
申请号：US11678931
申请日：2007-02-26
申请人： Jason A. Rye , Kyle M. Hanson
发明人： Jason A. Rye , Kyle M. Hanson
IPC分类号： C25B9/02 , C25B9/12
CPC分类号： H01L21/6719 , C25D17/001 , C25D17/06 , H01L21/67051 , H01L21/67748 , H01L21/67751
摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins or surfaces on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.
摘要翻译：用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。头包括具有气体系统的转子。气体从转子中的入口喷射或喷射以产生旋转气流。旋转气流导致压力条件，其保持工件的第一面的边缘抵靠转子上的接触销或表面。转子和工件一起旋转。与周边相邻的导销可能有助于将工件与转子对准。有角度的表面有助于将废工艺液体偏离工件。头部可以与碗一起移动到多个不同的接合位置。当工件旋转时，碗中的喷嘴将工艺液体喷射到工件的第二面上，以处理工件。可以使用移动端点检测器来检测处理的终点。

8. 发明授权

US07909967B2 Electro-chemical processor 失效
标题翻译：电化学处理器
公开(公告)号：US07909967B2
公开(公告)日：2011-03-22
申请号：US11457192
申请日：2006-07-13
申请人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
发明人： Daniel J. Woodruff , Paul R. McHugh , Gregory J. Wilson , Kyle M. Hanson , Erik Lund , Steven L. Peace
IPC分类号： C25F7/00
CPC分类号： C25F7/00
摘要： An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.
摘要翻译：用于制造多孔硅或处理其它衬底的电化学处理器具有第一和第二室组件。第一和第二室组件包括分别用于密封晶片的第一和第二密封件以及第一和第二电极。第一密封件可朝向和远离处理器中的晶片移动，以在晶片装载/卸载位置与晶片工艺位置之间移动。第一电极可以与第一密封件一起移动。处理器可以从用于加载和卸载晶片的基本上水平的方向枢转到基本垂直的取向，用于处理晶片。

9. 发明授权

US07628898B2 Method and system for idle state operation 有权
标题翻译：空闲状态操作的方法和系统
公开(公告)号：US07628898B2
公开(公告)日：2009-12-08
申请号：US11198905
申请日：2005-08-05
申请人： John Klocke , Kyle M. Hanson , Rajesh Baskaran
发明人： John Klocke , Kyle M. Hanson , Rajesh Baskaran
IPC分类号： C25D17/02 , C25D21/00 , C25D7/12
CPC分类号： C23C18/1632 , C25D7/123 , C25D17/001 , C25D17/002 , C25D21/12 , C25F7/00
摘要： Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a processing unit separated from an electrode unit by an ion-permeable barrier is described. The process involves an idle stage wherein during the idle stage, processing fluid components are prevented from transferring between the first processing fluid and the second processing fluid. The described system includes a flow control system for controlling the flow of processing fluid to achieve separation of a processing fluid from the barrier during the idle stage.
摘要翻译：本文描述了用于电化学处理微特征工件的方法和系统。在一个实施例中，描述了一种用于电化学处理电化学处理室中的多个微特征工件的表面的方法，其包括通过离子可渗透屏障与电极单元分离的处理单元。该过程包括空闲阶段，其中在空闲阶段期间，防止处理流体组分在第一处理流体和第二处理流体之间传递。所描述的系统包括流量控制系统，用于控制处理流体的流动，以在空转阶段期间实现处理流体与屏障的分离。

10. 发明授权

US07585398B2 Chambers, systems, and methods for electrochemically processing microfeature workpieces 有权
公开(公告)号：US07585398B2
公开(公告)日：2009-09-08
申请号：US10861899
申请日：2004-06-03
申请人： Kyle M. Hanson , John L. Klocke
发明人： Kyle M. Hanson , John L. Klocke
IPC分类号： C25D7/12 , C25D17/02
CPC分类号： C25D17/002 , C25D3/02 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/008 , C25F7/00
摘要： Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpiece. The chamber further includes an electrode unit having an electrode and a second flow system configured to convey a flow of a second processing fluid at least proximate to the electrode. The chamber further includes a nonporous barrier between the processing unit and the electrode unit to separate the first and second processing fluids. The nonporous barrier is configured to allow cations or anions to flow through the barrier between the first and second processing fluids.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式