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1. 发明申请

US20080011334A1 SINGLE SIDE WORKPIECE PROCESSING 有权
标题翻译：单面工件加工
公开(公告)号：US20080011334A1
公开(公告)日：2008-01-17
申请号：US11782159
申请日：2007-07-24
申请人： Jason Rye , Kyle Hanson , Daniel Woodruff
发明人： Jason Rye , Kyle Hanson , Daniel Woodruff
IPC分类号： B08B3/08
CPC分类号： H01L21/68735 , H01L21/67051 , H01L21/67126 , H01L21/6719 , H01L21/67259 , H01L21/68728 , H01L21/68785 , H01L21/68792
摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas or air is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against an angled annular surface on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. Outlets through the rotor allow gas to flow out of the rotor.
摘要翻译：用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。头包括具有气体系统的转子。气体或空气从转子中的入口喷射或喷射以产生旋转气体流。旋转气流导致压力条件，其将工件的第一侧的边缘抵靠在转子上的成角度的环形表面上。转子和工件一起旋转。与周边相邻的导销可能有助于将工件与转子对准。通过转子的出口允许气体流出转子。

2. 发明申请

US20070193607A1 METHODS AND APPARATUS FOR CLEANING EDGES OF A SUBSTRATE 审中-公开
标题翻译：用于清洁基板边缘的方法和装置
公开(公告)号：US20070193607A1
公开(公告)日：2007-08-23
申请号：US11739201
申请日：2007-04-24
申请人： John Ghekiere , Aaron Arvidson , Bruce Fender , Craig Meuchel , Raoul Schroder , Brian Aegerter , Ron Flink , Jason Rye
发明人： John Ghekiere , Aaron Arvidson , Bruce Fender , Craig Meuchel , Raoul Schroder , Brian Aegerter , Ron Flink , Jason Rye
IPC分类号： C23G1/00 , B08B3/00 , B08B7/00
CPC分类号： H01L21/67051 , C23G5/00 , H01L21/02052
摘要： In methods and apparatus for cleaning a wafer, a cleaning liquid is sprayed or jetted in a direction generally tangent to the circular edge of a spinning wafer. This enhances removal of contaminants from areas near the edge. Re-deposition of contaminant pieces or particles back onto the wafer is reduced because the direction of the spray carries the contaminant off of the wafer. Insoluble contaminant films, such as post etch residue, may be removed via one or more of the pressure of the cleaning liquid, the effects of higher process temperatures from heating the cleaning liquid, and by the chemical composition of the cleaning liquid.
摘要翻译：在清洗晶片的方法和装置中，清洗液体在与旋转晶片的圆形边缘大致相切的方向上喷射或喷射。这增强了从边缘附近的区域去除污染物。由于喷射方向将污染物从晶片上脱落，所以将污染物片或颗粒重新沉积回到晶片上被减少。可以通过清洗液体的一个或多个压力，加热清洗液体中较高工艺温度的影响以及清洗液体的化学成分来除去不溶性污染物膜，例如后蚀刻残留物。

3. 发明申请

US20120138091A1 PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME 有权
标题翻译：半导体工件的加工组件及其加工方法
公开(公告)号：US20120138091A1
公开(公告)日：2012-06-07
申请号：US12960378
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： B08B3/04
CPC分类号： H01L21/67051 , H01L21/6719 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件可以包括构造成与转子组件一起旋转的堰。还提供了一种处理半导体工件的方法。

4. 发明申请

US20060141809A1 Single side workpiece processing 失效
标题翻译：单面工件加工
公开(公告)号：US20060141809A1
公开(公告)日：2006-06-29
申请号：US11359969
申请日：2006-02-22
申请人： Jason Rye , Daniel Woodruff
发明人： Jason Rye , Daniel Woodruff
IPC分类号： H01L21/00
CPC分类号： H01L21/67051 , H01L21/6708 , H01L21/6838
摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. The rotor may have cylindrical side walls joined to a top plate, and with the gas inlets located in the cylindrical sidewalls. The head is moveable into engagement with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece.
摘要翻译：用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。头包括具有气体系统的转子。气体从转子中的入口喷射或喷射以产生旋转气流。旋转气流引起压力条件，其保持工件的第一侧的边缘抵抗转子上的接触销。转子和工件一起旋转。与周边相邻的导销可能有助于将工件与转子对准。转子可以具有连接到顶板的圆柱形侧壁，并且气体入口位于圆柱形侧壁中。头部可移动成与碗接合。当工件旋转时，碗中的喷嘴将工艺液体喷射到工件的第二面上，以处理工件。

5. 发明申请

US20070261726A1 MULTIPLE WORKPIECE PROCESSOR 审中-公开
标题翻译：多工作处理器
公开(公告)号：US20070261726A1
公开(公告)日：2007-11-15
申请号：US11382893
申请日：2006-05-11
申请人： Jason Rye , Kyle Hanson
发明人： Jason Rye , Kyle Hanson
IPC分类号： B08B3/00
CPC分类号： H01L21/68771 , B08B3/02 , B08B11/02 , H01L21/68764
摘要： A wafer processor has a process head engageable with a process chamber. A rotor on the process head has multiple wafer holding positions offset from the rotor axis. A wafer retaining device holds the wafers in place, in the holding positions, during processing. As the rotor spins, wafers retained in the wafer holding positions revolve around the axis. Multiple smaller size wafers may be simultaneously processed within a single processor.
摘要翻译：晶片处理器具有可与处理室接合的处理头。处理头上的转子具有从转子轴线偏移的多个晶片保持位置。晶片保持装置在处理期间将晶片保持在保持位置的适当位置。当转子旋转时，保留在晶片保持位置的晶片围绕轴线旋转。可以在单个处理器内同时处理多个更小尺寸的晶片。

6. 发明授权

US09799537B2 Processing assembly for semiconductor workpiece and methods of processing same 有权
公开(公告)号：US09799537B2
公开(公告)日：2017-10-24
申请号：US12960378
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/02 , H01L21/67 , H01L21/687 , B08B3/04
CPC分类号： H01L21/67051 , H01L21/6719 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly may include a weir that is configured to spin with the rotor assembly. A method of processing a semiconductor workpiece is also provided.

7. 发明授权

US08541309B2 Processing assembly for semiconductor workpiece and methods of processing same 有权
标题翻译：半导体工件加工组件及其加工方法
公开(公告)号：US08541309B2
公开(公告)日：2013-09-24
申请号：US12960372
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/302
CPC分类号： H01L21/6719 , H01L21/67051 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件包括围绕转子组件并具有多个堰的堰组件。用于处理半导体工件的方法通常包括移动转子组件和堰组件中的至少一个。

8. 发明申请

US20120142196A1 PROCESSING ASSEMBLY FOR SEMICONDUCTOR WORKPIECE AND METHODS OF PROCESSING SAME 有权
标题翻译：半导体工件的加工组件及其加工方法
公开(公告)号：US20120142196A1
公开(公告)日：2012-06-07
申请号：US12960372
申请日：2010-12-03
申请人： Jason Rye , Kyle M. Hanson
发明人： Jason Rye , Kyle M. Hanson
IPC分类号： H01L21/302 , B05D5/12
CPC分类号： H01L21/6719 , H01L21/67051 , H01L21/68792
摘要： A processing assembly for a semiconductor workpiece generally includes a rotor assembly capable of spinning a workpiece, a chemistry delivery assembly for delivering chemistry to the workpiece, and a chemistry collection assembly for collecting spent chemistry from the workpiece. The chemistry collection assembly includes a weir assembly surrounding the rotor assembly and having a plurality of weirs. Methods for processing a semiconductor workpiece generally include moving at least one of the rotor assembly and the weir assembly.
摘要翻译：用于半导体工件的处理组件通常包括能够旋转工件的转子组件，用于将化学物质输送到工件的化学物质输送组件以及用于从工件收集废化学物质的化学收集组件。化学收集组件包括围绕转子组件并具有多个堰的堰组件。用于处理半导体工件的方法通常包括移动转子组件和堰组件中的至少一个。

9. 发明授权

US08082932B2 Single side workpiece processing 失效
标题翻译：单面工件加工
公开(公告)号：US08082932B2
公开(公告)日：2011-12-27
申请号：US11359969
申请日：2006-02-22
申请人： Jason Rye , Daniel J. Woodruff
发明人： Jason Rye , Daniel J. Woodruff
IPC分类号： B08B3/08
CPC分类号： H01L21/67051 , H01L21/6708 , H01L21/6838
摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. The rotor may have cylindrical side walls joined to a top plate, and with the gas inlets located in the cylindrical sidewalls. The head is moveable into engagement with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece.
摘要翻译：用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。头包括具有气体系统的转子。气体从转子中的入口喷射或喷射以产生旋转气流。旋转气流引起压力条件，其保持工件的第一侧的边缘抵抗转子上的接触销。转子和工件一起旋转。与周边相邻的导销可能有助于将工件与转子对准。转子可以具有连接到顶板的圆柱形侧壁，并且气体入口位于圆柱形侧壁中。头部可移动成与碗接合。当工件旋转时，碗中的喷嘴将工艺液体喷射到工件的第二面上，以处理工件。

10. 发明申请

US20070110895A1 SINGLE SIDE WORKPIECE PROCESSING 审中-公开
标题翻译：单面工件加工
公开(公告)号：US20070110895A1
公开(公告)日：2007-05-17
申请号：US11619515
申请日：2007-01-03
申请人： Jason Rye , Daniel Woodruff , Dana Scranton
发明人： Jason Rye , Daniel Woodruff , Dana Scranton
IPC分类号： B05C11/02 , B05D3/12 , C23C16/00 , B05B1/28
CPC分类号： H01L21/6723 , H01L21/67051 , H01L21/6708 , H01L21/67173 , H01L21/6719 , H01L21/68792
摘要： A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes pressure conditions which hold the edges of a first side of the workpiece against contact pins on the rotor. The rotor and the workpiece rotate together. Guide pins adjacent to a perimeter may help to align the workpiece with the rotor. An angled surface helps to deflect spent process liquid away from the workpiece. The head is moveable into multiple different engagement positions with a bowl. Spray nozzles in the bowl spray a process liquid onto the second side of the workpiece, as the workpiece is spinning, to process the workpiece. A moving end point detector may be used to detect an end point of processing.
摘要翻译：用于处理半导体晶片和类似工件的离心工件处理器包括保持和旋转工件的头部。头包括具有气体系统的转子。气体从转子中的入口喷射或喷射以产生旋转气流。旋转气流引起压力条件，其保持工件的第一侧的边缘抵抗转子上的接触销。转子和工件一起旋转。与周边相邻的导销可能有助于将工件与转子对准。有角度的表面有助于将废工艺液体偏离工件。头部可以与碗一起移动到多个不同的接合位置。当工件旋转时，碗中的喷嘴将工艺液体喷射到工件的第二面上，以处理工件。可以使用移动端点检测器来检测处理的终点。

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