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1. 发明授权

US07094291B2 Semiconductor processing apparatus 失效
公开(公告)号：US07094291B2
公开(公告)日：2006-08-22
申请号：US09893316
申请日：2001-06-26
申请人： Timothy J. Reardon , Craig P. Meuchel , Thomas H. Oberlitner , Aleksander Owczarz , Raymon F. Thompson
发明人： Timothy J. Reardon , Craig P. Meuchel , Thomas H. Oberlitner , Aleksander Owczarz , Raymon F. Thompson
IPC分类号： B05C11/00 , B05B12/00 , B05B15/00
CPC分类号： H01L21/6715 , G11B7/26 , H01L21/67075 , H01L21/6708 , H01L21/67086 , H01L21/68707 , H01L21/68785 , Y10S134/902
摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

2. 发明授权

US06699373B2 Apparatus for processing the surface of a microelectronic workpiece 有权
标题翻译：用于处理微电子工件表面的装置
公开(公告)号：US06699373B2
公开(公告)日：2004-03-02
申请号：US09944152
申请日：2001-08-30
申请人： Daniel J. Woodruff , Kyle M. Hanson , Thomas H. Oberlitner , LinLin Chen , John M. Pedersen , Vladimir Zila
发明人： Daniel J. Woodruff , Kyle M. Hanson , Thomas H. Oberlitner , LinLin Chen , John M. Pedersen , Vladimir Zila
IPC分类号： C25D1700
CPC分类号： H01L21/68721 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/06 , H01L21/288 , H01L21/2885 , H01L21/687 , H01L21/68728 , H01L21/68735 , H01L21/68785
摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.
摘要翻译：阐述了将金属镀在工件表面上的反应器。反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。接触组件与反应器碗内的阳极间隔开。接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。当工件与其接合时，触头在工件的表面上执行擦拭动作。触头组件还包括设置在多个触点内部的屏障。阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。吹扫气体可用于帮助形成接触组件的屏障。还提出了组合电镀/无电镀工具和方法。

3. 发明授权

US06309524B1 Methods and apparatus for processing the surface of a microelectronic workpiece 有权
标题翻译：用于处理微电子工件表面的方法和装置
公开(公告)号：US06309524B1
公开(公告)日：2001-10-30
申请号：US09386610
申请日：1999-08-31
申请人： Daniel J. Woodruff , Kyle M. Hanson , Thomas H. Oberlitner , LinLin Chen , John M. Pedersen , Vladimir Zila
发明人： Daniel J. Woodruff , Kyle M. Hanson , Thomas H. Oberlitner , LinLin Chen , John M. Pedersen , Vladimir Zila
IPC分类号： C25D1704
CPC分类号： H01L21/2885 , A61K35/12 , C12N2500/25 , C12N2500/32 , C12N2500/34 , C12N2500/40 , C12N2501/11 , C12N2501/39 , C12N2501/395 , C12N2506/22 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/06
摘要： A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith. The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution. In one embodiment, the plurality of contacts are in the form of discrete flexures while in another embodiment the plurality of contacts are in the form of a Belleville ring contact. A flow path may be provided in the contact assembly for providing a purging gas to the plurality of contacts and the peripheral edge of the workpiece. The purging gas may be used to assist in the formation of the barrier of the contact assembly. A combined electroplating/electroless plating tool and method are also set forth.
摘要翻译：阐述了将金属镀在工件表面上的反应器。反应器包括反应器碗，其包括设置在其中的电镀溶液和设置在与电镀溶液接触的反应器碗中的阳极。接触组件与反应器碗内的阳极间隔开。接触组件包括多个触点，其设置成接触工件表面的周边边缘以向工件的表面提供电镀功率。当工件与其接合时，触头对工件的表面执行擦拭动作。接触组件还包括设置在多个触点内部的屏障。阻挡层包括设置成接合工件的表面以帮助将多个触点与电镀溶液隔离的构件。在一个实施例中，多个触点是离散弯曲的形式，而在另一个实施例中，多个触点是贝尔维尔环接触的形式。可以在接触组件中设置流路，以向多个触点和工件的周边边缘提供净化气体。吹扫气体可用于帮助形成接触组件的屏障。还提出了组合电镀/无电镀工具和方法。

4. 发明授权

US07281741B2 End-effectors for handling microelectronic workpieces 有权
标题翻译：用于处理微电子工件的终端效应器
公开(公告)号：US07281741B2
公开(公告)日：2007-10-16
申请号：US10195137
申请日：2002-07-11
申请人： Daniel J. Woodruff , Thomas H. Oberlitner , Randy A. Harris , James J. Erickson , Douglas W. Carr
发明人： Daniel J. Woodruff , Thomas H. Oberlitner , Randy A. Harris , James J. Erickson , Douglas W. Carr
IPC分类号： B66C1/42
CPC分类号： H01L21/67259 , H01L21/68707 , Y10S294/907
摘要： End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of end-effectors and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutments. An alternative end-effector includes at least three abutments, at least one of which is resiliently connected to an actuator for movement between a retracted position and a deployed position wherein it engages a workpiece.
摘要翻译：终端效应器可用于掌握微电子工件以便通过自动运输装置进行处理。一个这样的端部执行器包括多个端部执行器和适于检测至少一个基台的工件的边缘的接合的检测器。替代的末端执行器包括至少三个邻接部分，其中至少一个邻接部分弹性地连接到致动器，用于在缩回位置和展开位置之间移动，其中它接合工件。

5. 发明授权

US06318951B1 Robots for microelectronic workpiece handling 失效
标题翻译：机器人用于微电子工件处理
公开(公告)号：US06318951B1
公开(公告)日：2001-11-20
申请号：US09386566
申请日：1999-08-31
申请人： Wayne J. Schmidt , Thomas H. Oberlitner
发明人： Wayne J. Schmidt , Thomas H. Oberlitner
IPC分类号： B25J1802
CPC分类号： H01L21/68707 , B25J5/02 , B25J9/042 , H01L21/67742 , Y10S414/135
摘要： An improved conveyor system for transporting a microelectronic workpiece within a processing tool is set forth. The conveyor system includes a transport unit slidably guided on a conveyor rail for transporting and manipulating the workpieces. The transport unit includes a vertical member which is connected to a base end of a two section robot arm. The robot arm includes an end effector at a distal end thereof which is actuated to grip a surrounding edge of a workpiece. A first rotary actuator is arranged to rotate the vertical member about its axis to rotate the entire robot arm. A second rotary actuator is positioned to rotate the second section of the robot arm, via a belt, with respect to the first section of the robot arm. A third rotary actuator is arranged to rotate the end effector about its horizontal axis. The third rotary actuator permits the end effector to flip the microelectronic workpiece between a face up and a face down orientation. In a further aspect of the invention, two transport units are mounted to slide laterally on the conveyor rail. The transport units include a vertical space between respective end effectors and the first sections of the robot arms to allow wafers carried by the end effectors to overlap in plan. Two different end effectors are disclosed, a plunger activated gripping device and a vacuum operated gripping device which uses raised pad areas, vacuum ports and locating pins.
摘要翻译：阐述了一种用于在处理工具内传送微电子工件的改进的输送系统。输送机系统包括在输送轨道上可滑动地引导以便运输和操纵工件的输送单元。输送单元包括连接到两段机器人手臂的基端的垂直构件。机器人臂包括在其远端处的端部执行器，其被致动以夹持工件的周围边缘。第一旋转致动器被布置成围绕其轴线旋转垂直构件以旋转整个机器人手臂。第二旋转致动器被定位成相对于机器人臂的第一部分经由带旋转机器人手臂的第二部分。第三旋转致动器被布置成使端部执行器围绕其水平轴线旋转。第三旋转致动器允许末端执行器在面朝上和朝下朝向之间翻转微电子工件。在本发明的另一方面，安装两个运输单元以在输送轨上横向滑动。运输单元包括相应的末端执行器和机器人臂的第一部分之间的垂直空间，以允许末端执行器承载的晶片在计划中重叠。公开了两种不同的端部执行器，柱塞活塞夹紧装置和使用凸起垫区域，真空端口和定位销的真空操作夹紧装置。

6. 发明授权

US5658387A Semiconductor processing spray coating apparatus 失效
标题翻译：半导体加工喷涂设备
公开(公告)号：US5658387A
公开(公告)日：1997-08-19
申请号：US422485
申请日：1995-04-12
申请人： Timothy J. Reardon , Craig P. Meuchel , Thomas H. Oberlitner
发明人： Timothy J. Reardon , Craig P. Meuchel , Thomas H. Oberlitner
IPC分类号： G11B7/26 , H01L21/00 , B05B3/12
CPC分类号： H01L21/6715 , G11B7/26
摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.
摘要翻译：一种用于喷涂硅片或其他半导体产品的半导体处理器。处理器具有隔室，其中安装有晶片转移，涂覆站和热处理站。涂装站具有喷雾处理容器，其中可移动喷头和可转动的晶片保持器。喷涂站具有涂层粘度控制功能。超声波共振喷头从计量泵精确地提供涂层。热处理站热固化涂层，然后冷却晶片。该系统允许在不规则表面上以相对均匀的构象层施加涂层。

7. 发明授权

US5584310A Semiconductor processing with non-jetting fluid stream discharge array 失效
标题翻译：具有非喷射流体流放电阵列的半导体处理
公开(公告)号：US5584310A
公开(公告)日：1996-12-17
申请号：US484788
申请日：1995-06-07
申请人： Eric J. Bergman , Thomas H. Oberlitner
发明人： Eric J. Bergman , Thomas H. Oberlitner
IPC分类号： H01L21/00 , B08B3/04
CPC分类号： H01L21/67023
摘要： A semiconductor processor and methods using pillar shaped liquid emitters. The emitters have emission ports upon which liquid domes of processing chemicals are formed. The domes are applied to the surface of a wafer to wash discrete areas and thereby allow gases evolved from the reaction to easily escape about the domes and through gas passageways existing about the pillars. The wafer is rotated to provide even processing of the treated surface.
摘要翻译：半导体处理器和使用柱状液体发射器的方法。发射器具有形成处理化学品液体圆顶的排放口。将圆顶应用于晶片的表面以洗涤不连续的区域，从而允许从反应放出的气体容易地绕着圆顶逸出并且通过存在于柱上的气体通道。旋转晶片以提供经处理的表面的均匀加工。

8. 发明授权

US07294244B2 Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece 失效
标题翻译：微电子工件加工工具包括具有用于搅拌靠近工件的处理流体的桨组件的处理反应器
公开(公告)号：US07294244B2
公开(公告)日：2007-11-13
申请号：US10367100
申请日：2003-02-14
申请人： Thomas H. Oberlitner , Kyle M. Hanson
发明人： Thomas H. Oberlitner , Kyle M. Hanson
IPC分类号： C25F3/12 , C25B9/12
CPC分类号： H01L21/67086 , C25D5/08 , C25D7/123 , C25D17/001 , C25D17/007 , C25D21/10 , H01L21/67005 , H01L21/67023 , H01L21/67057 , H01L21/6723
摘要： An integrated tool is provided including at least one workpiece processing station having a paddle assembly. In accordance with another independent aspect of the present invention, the workpiece processing station is adapted for adjusting the level of the processing fluid relative to a workpiece, wherein the portion of the workpiece to be processed and possibly the paddle is selectively immersed within the processing fluid. In accordance with a further independent aspect of the present invention, a paddle is provided for use proximate to a workpiece in a workpiece processing station. The paddle includes a one or more sets of delivery ports and one or more sets of fluid recovery ports. In at least one embodiment, the paddle provides for agitation of a processing fluid proximate to the surface of the workpiece. In at least another embodiment, the paddle provides for the delivery and/or recovery of one or more fluids to the portion of the workpiece to be processed. One aspect of the present invention enables the fluids supplied to the workpiece by the paddle to be limited to the space located between the workpiece and the paddle, thus avoiding mixing of these fluids with the processing fluid located within the bowl assembly not supplied by the paddle.
摘要翻译：提供了一种集成工具，其包括具有桨组件的至少一个工件处理站。根据本发明的另一个独立方面，工件加工站适于调节加工流体相对于工件的水平，其中待加工的工件和可能的桨叶的部分选择性地浸入处理流体。根据本发明的另一独立方面，提供了一种在工件处理站中靠近工件使用的桨叶。桨叶包括一组或多组输送口和一组或多组流体回收口。在至少一个实施例中，桨叶用于搅拌靠近工件表面的处理流体。在至少另一个实施例中，桨叶用于将待处理的工件的一个或多个流体递送和/或回收。本发明的一个方面使得通过桨将供应到工件的流体限于位于工件和桨之间的空间，从而避免这些流体与位于碗组件内的处理流体混合，而不是由桨供应。

9. 发明授权

US06322119B1 Robots for microelectronic workpiece handling 失效
公开(公告)号：US06322119B1
公开(公告)日：2001-11-27
申请号：US09386590
申请日：1999-08-31
申请人： Wayne J. Schmidt , Thomas H. Oberlitner
发明人： Wayne J. Schmidt , Thomas H. Oberlitner
IPC分类号： B66C142
CPC分类号： H01L21/68707 , B25J5/02 , B25J9/042 , B25J18/02 , H01L21/67742 , Y10S294/907
摘要： An improved conveyor system for transporting a microelectronic workpiece within a processing tool is set forth. The conveyor system includes a transport unit slidably guided on a conveyor rail for transporting and manipulating the workpieces. The transport unit includes a vertical member which is connected to a base end of a two section robot arm. The robot arm includes an end effector at a distal end thereof which is actuated to grip a surrounding edge of a workpiece. A first rotary actuator is arranged to rotate the vertical member about its axis to rotate the entire robot arm. A second rotary actuator is positioned to rotate the second section of the robot arm, via a belt, with respect to the first section of the robot arm. A third rotary actuator is arranged to rotate the end effector about its horizontal axis. The third rotary actuator permits the end effector to flip the microelectronic workpiece between a face up and a face down orientation. In a further aspect of the invention, two transport units are mounted to slide laterally on the conveyor rail. The transport units include a vertical space between respective end effectors and the first sections of the robot arms to allow wafers carried by the end effectors to overlap in plan. Two different end effectors are disclosed, a plunger activated gripping device and a vacuum operated gripping device which uses raised pad areas, vacuum ports and locating pins.

10. 发明授权

US6066575A Semiconductor processing spray coating apparatus 失效
公开(公告)号：US6066575A
公开(公告)日：2000-05-23
申请号：US883393
申请日：1997-06-26
申请人： Timothy J. Reardon , Craig P. Meuchel , Thomas H. Oberlitner
发明人： Timothy J. Reardon , Craig P. Meuchel , Thomas H. Oberlitner
IPC分类号： G11B7/26 , H01L21/00 , H01L21/4763 , B05D1/02 , B05D3/02 , B05D3/12
CPC分类号： H01L21/6715 , G11B7/26
摘要： A semiconductor processor for spray coating wafers or other semiconductor articles. The processor has a compartment in which are mounted a wafer transfer, coating station and thermal treatment station. The coating station has a spray processing vessel in which a movable spray-head and rotatable wafer holder. The spray station has coating viscosity control features. An ultrasonic resonating spray-head is precisely supplied with coating from a metering pump. The heat treatment station heat cures the coating and then cools the wafer. The system allows coatings to be applied in relatively uniform conformational layers upon irregular surfaces.

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