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1. 发明授权

US07806168B2 Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange 有权
标题翻译：最优的撒布机系统，流体冷却微型热交换的装置和方法
公开(公告)号：US07806168B2
公开(公告)日：2010-10-05
申请号：US10698180
申请日：2003-10-30
申请人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson , James Hom
发明人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson , James Hom
IPC分类号： F28F7/00
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled micro-scaled heat exchanger is disclosed. The fluid cooled micro-scaled heat exchanger utilizes a micro-scaled region and a spreader region with a highly thermally conductive material and sized to yield high heat dissipation and transfer area per unit volume from a heat source. The micro-scaled region preferably comprises microchannels.
摘要翻译：公开了一种用于流体冷却的微型热交换器的装置，方法和系统。流体冷却的微型热交换器利用具有高导热性材料的微尺度区域和扩散器区域，并且其尺寸适于从热源产生高的每单位体积的散热和转移面积。微尺度区域优选地包括微通道。

2. 发明授权

US06988535B2 Channeled flat plate fin heat exchange system, device and method 有权
标题翻译：通风平板翅片换热系统，装置及方法
公开(公告)号：US06988535B2
公开(公告)日：2006-01-24
申请号：US10699505
申请日：2003-10-30
申请人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson
发明人： Girish Upadhya , Richard Herms , Peng Zhou , Kenneth Goodson
IPC分类号： F28F7/00
CPC分类号： F28F3/02 , F04B17/00 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F2210/10 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A device, method, and system for a fluid cooled channeled heat exchange device is disclosed. The fluid cooled channeled heat exchange device utilizes fluid circulated through a channel heat exchanger for high heat dissipation and transfer area per unit volume. The device comprises a highly thermally conductive material, preferably with less than 200 W/m-K. The preferred channel heat exchanger comprises two coupled flat plates and a plurality of fins coupled to the flat plates. At least one of the plates preferably to receive flow of a fluid in a heated state. The fluid preferably carries heat from a heat source (such as a CPU, for example). Specifically, at least one of the plates preferably comprises a plurality of condenser channels configured to receive, to condense, and to cool the fluid in the heated state. The fluid in a cooler state is preferably carried from the device to the heat source, thereby cooling the heat source.
摘要翻译：公开了一种用于流体冷却通道式热交换装置的装置，方法和系统。流体冷却通道热交换装置利用通过通道热交换器循环的流体，用于高散热和每单位体积的传递面积。该装置包括高导热性材料，优选小于200W / m-K。优选的通道热交换器包括两个联接的平板和耦合到平板的多个翅片。至少一个板优选地接收处于加热状态的流体的流动。流体优选地承载来自热源（例如CPU）的热量。具体地，至少一个板优选地包括多个冷凝器通道，其构造成在加热状态下接收，冷凝和冷却流体。处于较冷状态的流体优选从装置运送到热源，从而冷却热源。

3. 发明授权

US07090001B2 Optimized multiple heat pipe blocks for electronics cooling 有权
标题翻译：优化多个热管块用于电子冷却
公开(公告)号：US07090001B2
公开(公告)日：2006-08-15
申请号：US10440363
申请日：2003-05-16
申请人： Peng Zhou , Dolf van Der Heide , Kenneth Goodson , Girish Upadhya
发明人： Peng Zhou , Dolf van Der Heide , Kenneth Goodson , Girish Upadhya
IPC分类号： F28D15/00 , F28F7/00
CPC分类号： F04B17/00 , F28D15/0266 , F28D20/026 , F28F23/00 , F28F2210/08 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A plate is thermally coupled to a heat generating device and thermally coupled to two heat pipes. Each heat pipe is configured to have a predetermined boiling point temperature selected according to design criteria. One or more additional heat pipes can be coupled to the plate. A heat spreader can be in thermal contact with the heat generating device and with at least one of the heat pipes. The heat pipes can differ in outer cross-sectional dimensions depending on thermal distance position relative to the heat generating device, such that the heat pipes located a farther thermal distance from the heat generating device have smaller outer cross-sectional dimensions than the heat pipes located a shorter thermal distance from the heat generating device.
摘要翻译：板被热耦合到发热装置并且热耦合到两个热管。每个热管被配置成具有根据设计标准选择的预定沸点温度。一个或多个额外的热管可以联接到板上。散热器可以与发热装置和至少一个热管热接触。热管可以根据相对于发热装置的热距离位置的外截面尺寸不同，使得位于与发热装置更远的热距离的热管具有比位于的热管更小的外横截面尺寸距离发热装置的热距离更短。

4. 发明授权

US06988534B2 Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 有权
标题翻译：用于冷却发热装置中所需热点的柔性流体输送的方法和装置
公开(公告)号：US06988534B2
公开(公告)日：2006-01-24
申请号：US10439635
申请日：2003-05-16
申请人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , David Corbin
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , David Corbin
IPC分类号： F28F7/00
CPC分类号： G06Q20/20 , F04B17/00 , F04B19/006 , F28D15/0266 , F28D21/0015 , F28F3/12 , F28F13/06 , F28F2210/10 , F28F2260/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
摘要翻译：一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

5. 发明授权

US07000684B2 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 有权
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US07000684B2
公开(公告)日：2006-02-21
申请号：US10680584
申请日：2003-10-06
申请人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas W. Kenny , Mark Munch , Peng Zhou , James Gill Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F28F7/00
CPC分类号： F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2245/04 , F28F2260/02 , G06Q20/20 , H01L23/473 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

6. 发明授权

US07104312B2 Method and apparatus for achieving temperature uniformity and hot spot cooling in a heat producing device 有权
标题翻译：用于在发热装置中实现温度均匀性和热点冷却的方法和装置
公开(公告)号：US07104312B2
公开(公告)日：2006-09-12
申请号：US10698304
申请日：2003-10-30
申请人： Kenneth Goodson , Thomas Kenny , Peng Zhou , Girish Upadhya , Mark Munch , Mark McMaster , James Horn
发明人： Kenneth Goodson , Thomas Kenny , Peng Zhou , Girish Upadhya , Mark Munch , Mark McMaster , James Horn
IPC分类号： F28F7/00
CPC分类号： F28F3/048 , F04B19/006 , F28D15/00 , F28F3/12 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method of controlling temperature of a heat source in contact with a heat exchanging surface of a heat exchanger, wherein the heat exchanging surface is substantially aligned along a plane. The method comprises channeling a first temperature fluid to the heat exchanging surface, wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface. The method comprises channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. The temperature differences are minimized by optimizing and controlling the fluidic and thermal resistances in the heat exchanger. The resistances to the fluid are influenced by size, volume and surface area of heat transferring features, multiple pumps, fixed and variable valves and flow impedance elements in the fluid path, pressure and flow rate control of the fluid, and other factors.
摘要翻译：一种控制与热交换器的热交换表面接触的热源的温度的方法，其中所述热交换表面沿着平面基本上对齐。该方法包括将第一温度流体引导到热交换表面，其中第一温度流体沿着热交换表面与热源进行热交换。该方法包括从热交换表面引导第二温度流体，其中流体被引导以最小化沿着热源的温度差。通过优化和控制热交换器中的流体和热电阻来最小化温差。对流体的阻力受传热特征，多个泵，固定和可变阀以及流体路径中的流量阻抗元件，流体的压力和流量控制等因素的尺寸，体积和表面积的影响。

7. 发明授权

US06986382B2 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers 有权
标题翻译：用于微通道热交换器中压降降低的交错歧管
公开(公告)号：US06986382B2
公开(公告)日：2006-01-17
申请号：US10439912
申请日：2003-05-16
申请人： Girish Upadhya , Thomas W. Kenny , Peng Zhou , Mark Munch , James Gill Shook , Kenneth Goodson , David Corbin
发明人： Girish Upadhya , Thomas W. Kenny , Peng Zhou , Mark Munch , James Gill Shook , Kenneth Goodson , David Corbin
IPC分类号： F28F7/00
CPC分类号： F28D15/0266 , F04B19/006 , F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.
摘要翻译：耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动，在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。微通道热交换器包括具有热交换区域的界面层。优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

8. 发明申请

US20050211427A1 Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device 审中-公开
标题翻译：用于冷却发热装置中所需热点的柔性流体输送的方法和装置
公开(公告)号：US20050211427A1
公开(公告)日：2005-09-29
申请号：US10882142
申请日：2004-06-29
申请人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin
发明人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin
IPC分类号： G05D23/00
CPC分类号： F28F3/048 , F28D15/0266 , F28F3/12 , F28F2260/02 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger apparatus and method of manufacturing comprising: an interface layer for cooling a heat source and configured to pass fluid therethrough, the interface layer having an appropriate thermal conductivity and a manifold layer for providing fluid to the interface layer, wherein the manifold layer is configured to achieve temperature uniformity in the heat source preferably by cooling interface hot spot regions. A plurality of fluid ports are configured to the heat exchanger such as an inlet port and outlet port, whereby the fluid ports are configured vertically and horizontally. The manifold layer circulates fluid to a predetermined interface hot spot region in the interface layer, wherein the interface hot spot region is associated with the hot spot. The heat exchanger preferably includes an intermediate layer positioned between the interface and manifold layers and optimally channels fluid to the interface hot spot region.
摘要翻译：一种热交换器装置和制造方法，包括：用于冷却热源并被配置为使流体通过其中的界面层，所述界面层具有适当的导热性和用于向界面层提供流体的歧管层，其中所述歧管层为被配置为优选地通过冷却界面热点区域来实现热源中的温度均匀性。多个流体端口被配置到诸如入口和出口的热交换器，由此流体端口被垂直和水平地配置。歧管层将流体循环到界面层中的预定界面热点区域，其中界面热点区域与热点相关联。热交换器优选地包括位于界面和歧管层之间的中间层，并且将流体最佳地通向界面热点区域。

9. 发明申请

US20050211418A1 Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device 审中-公开
标题翻译：用于冷却发热装置的有效的垂直流体输送的方法和装置
公开(公告)号：US20050211418A1
公开(公告)日：2005-09-29
申请号：US10882132
申请日：2004-06-29
申请人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
发明人： Thomas Kenny , Mark Munch , Peng Zhou , James Shook , Girish Upadhya , Kenneth Goodson , Dave Corbin , Mark McMaster , James Lovette
IPC分类号： F04B17/00 , F04B19/00 , F28D15/00 , F28D15/02 , F28F3/02 , F28F3/08 , F28F3/12 , F28F13/18 , G06Q20/00 , H01L23/473 , H04L29/06 , F28F7/00
CPC分类号： H01L23/4735 , F04B17/00 , F04B19/006 , F28D15/00 , F28D15/0266 , F28D21/0015 , F28D2021/0029 , F28F3/02 , F28F3/086 , F28F3/12 , F28F7/02 , F28F13/06 , F28F13/185 , F28F2210/10 , F28F2260/02 , G06F1/20 , G06Q20/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat exchanger and method of manufacturing thereof comprises an interface layer for cooling a heat source. The interface layer is coupled to the heat source and is configured to pass fluid therethrough. The heat exchanger further comprises a manifold layer that is coupled to the interface layer. The manifold layer includes at least one first port that is coupled to a first set of individualized holes which channel fluid through the first set. The manifold layer includes at least one second port coupled to a second set of individualized holes which channel fluid through the second set. The first set of holes and second set of holes are arranged to provide a minimized fluid path distance between the first and second ports to adequately cool the heat source. Preferably, each hole in the first set is positioned a closest optimal distance to an adjacent hole the second set.
摘要翻译：热交换器及其制造方法包括用于冷却热源的界面层。界面层耦合到热源并被配置成使流体从中流过。热交换器还包括耦合到界面层的歧管层。歧管层包括至少一个第一端口，其耦合到第一组个体化的孔，其将流体通过第一组。歧管层包括耦合到第二组个体化孔的至少一个第二端口，其将流体通过第二组。第一组孔和第二组孔布置成在第一和第二端口之间提供最小化的流体路径距离，以充分冷却热源。优选地，第一组中的每个孔定位成与第二组的相邻孔最接近的最佳距离。

10. 发明申请

US20050211417A1 Interwoven manifolds for pressure drop reduction in microchannel heat exchangers 审中-公开
标题翻译：用于微通道热交换器中压降降低的交错歧管
公开(公告)号：US20050211417A1
公开(公告)日：2005-09-29
申请号：US10881980
申请日：2004-06-29
申请人： Girish Upadhya , Thomas Kenny , Peng Zhou , Mark Munch , James Shook , Kenneth Goodson , David Corbin
发明人： Girish Upadhya , Thomas Kenny , Peng Zhou , Mark Munch , James Shook , Kenneth Goodson , David Corbin
IPC分类号： F04B19/00 , F28D15/02 , F28F3/12 , H01L23/473 , F28F7/00
CPC分类号： H01L23/473 , F04B19/006 , F28D15/0266 , F28F3/12 , F28F13/185 , F28F2260/02 , H01L2924/0002 , H01L2924/00
摘要： A microchannel heat exchanger coupled to a heat source and configured for cooling the heat source comprising a first set of fingers for providing fluid at a first temperature to a heat exchange region, wherein fluid in the heat exchange region flows toward a second set of fingers and exits the heat exchanger at a second temperature, wherein each finger is spaced apart from an adjacent finger by an appropriate dimension to minimize pressure drop in the heat exchanger and arranged in parallel. The microchannel heat exchanger includes an interface layer having the heat exchange region. Preferably, a manifold layer includes the first set of fingers and the second set of fingers configured within to cool hot spots in the heat source. Alternatively, the interface layer includes the first set and second set of fingers configured along the heat exchange region.
摘要翻译：耦合到热源并被构造用于冷却热源的微通道热交换器，其包括用于将第一温度下的流体提供给热交换区域的第一组指状物，其中热交换区域中的流体朝向第二组手指流动，在第二温度下离开热交换器，其中每个指状物与相邻手指分开适当的尺寸，以最小化热交换器中的压力降并平行布置。微通道热交换器包括具有热交换区域的界面层。优选地，歧管层包括第一组指状物，并且第二组指状物构造成用于冷却热源中的热点。或者，界面层包括沿着热交换区域配置的第一组和第二组手指。

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