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    • 1. 发明授权
    • Method and apparatus for positioning and biasing an electro-optic
modulator of an electro-optic imaging system
    • 用于定位和偏移电光成像系统的电光调制器的方法和装置
    • US5212374A
    • 1993-05-18
    • US804257
    • 1991-12-04
    • James C. SpeedyFrancois J. HenleyHee-June ChoiMichael J. MillerYing-Moh Liu
    • James C. SpeedyFrancois J. HenleyHee-June ChoiMichael J. MillerYing-Moh Liu
    • G01R31/302G01R19/00G01R31/308G02F1/13G09G3/00H01L21/66
    • G09G3/006G01R31/308G02F1/1309
    • An imaging method creates a two-dimensional image of a voltage distribution or a capacitance distribution across a surface of a substrate under test using an electro-optic modulator which is positioned and biased with respect to the surface of the substrate. The method involves a first coarse offsite calibrating step to compensate for nonuniformities in the light emerging from the modulator. Then, for each successive portion of the substrate over which the modulator is to detect characteristics of the substrate, the system undergoes a modulator relocating step, a modulator levelling step, a modulator gapping step, a fine onsite calibrating step, and a measuring step. An apparatus is disclosed for levelling the bottom surface of a modulator into a substantially coplanar spacial relationship with a portion of top surface of the underlying substrate being tested monitors light emerging from at least three regions on the top surface of the modulator in order to determine the relative distances of three corresponding regions of the bottom surface of the modulator from the underlying top surface of the substrate being tested. In one embodiment, three transducers are used to control the spacial orientation of the modulator. The method and apparatus see special application in detecting defects in LCD display panels.
    • 成像方法使用相对于衬底的表面定位和偏置的电光调制器产生跨越被测衬底的表面的电压分布或电容分布的二维图像。 该方法涉及第一粗糙非现场校准步骤以补偿从调制器出射的光的不均匀性。 然后,对于调制器要在其上检测衬底的特性的衬底的每个连续部分,系统经历调制器重定位步骤,调制器调平步骤,调制器间隔步骤,精细现场校准步骤和测量步骤。 公开了一种用于将调制器的底表面平整为与待测试的下层基底的顶表面的一部分基本上共面的空间关系,监测从调制器顶表面上的至少三个区域出射的光,以便确定 调制器底表面的三个对应区域与正在测试的衬底的下表面之间的相对距离。 在一个实施例中,使用三个换能器来控制调制器的空间取向。 该方法和装置在液晶显示面板检测缺陷方面具有特殊应用。
    • 2. 发明授权
    • Method and apparatus for positioning and biasing an electro-optic
modulator of an electro-optic imaging system
    • 用于定位和偏置电光成像系统的电光调制器的方法和装置
    • US5387788A
    • 1995-02-07
    • US27210
    • 1993-03-05
    • Michael J. MillerGinetto AddiegoFrancois J. Henley
    • Michael J. MillerGinetto AddiegoFrancois J. Henley
    • G01R31/302G01R19/00G01R31/308G02F1/13G09G3/00H01L21/66G01J1/20
    • G09G3/006G01R31/308G02F1/1309
    • An imaging method creates a two-dimensional image of a voltage distribution or a capacitance distribution of a substrate under test using an electro-optic modulator. A coarse modulator calibration determines the effect of non-uniformities in the modulator and determines a look-up table relating the gap distance between the modulator and the substrate to the intensity of the light emerging from the modulator. A positioning means calibration determines a look-up table relating control voltage to response by the positioning means. The modulator is moved over a portion of the substrate and then undergoes a positioning step, a fine onsite calibrating step, and a measuring step. The positioning step can be accomplished using the intensity of emerging light to determine modulator gap distance, and the response verses control voltage look-up table to determine a control signal to vertically position the modulator. The look-up tables permit the modulator to be position substantially parallel to the substrate at a desired gap distance using one step positioning.
    • 成像方法使用电光调制器产生被测衬底的电压分布或电容分布的二维图像。 粗调制器校准确定调制器中的非均匀性的影响,并且确定将调制器和衬底之间的间隙距离与从调制器出射的光的强度相关联的查找表。 定位装置校准确定将控制电压与定位装置的响应相关联的查找表。 调制器在衬底的一部分上移动,然后进行定位步骤,精细的现场校准步骤和测量步骤。 可以使用出现的光的强度来确定调制器间隙距离并且响应与控制电压查找表的确定步骤,以确定控制信号以垂直定位调制器。 查找表允许调制器使用一步定位以所需的间隙距离基本上平行于基板平齐。
    • 4. 发明授权
    • Method and apparatus for testing LCD panel array
    • LCD面板阵列测试方法及装置
    • US5363037A
    • 1994-11-08
    • US83126
    • 1993-06-25
    • Francois J. HenleyMichael J. Miller
    • Francois J. HenleyMichael J. Miller
    • G01R31/02G01R31/308G01R31/317G02F1/13G09G3/00G09G3/36G01R31/28
    • G09G3/006G01R31/308G01R31/31724
    • A hierarchical testing method is implemented taking advantage of the nature of the most common defects in an LCD panel to achieve fast effective parametric testing of LCD panels and the like. At the first hierarchy of testing, the panel is logically divided into zones and each zone tested in isolation to identify zones having at least one defect. At the next hierarchy, electro-optic assisted zone inspection is performed to identify where within the zone the defects are located. Lastly, every pixel is inspected using a voltage imaging method to determine whether the switching integrity of the pixel is acceptable. The testing apparatus includes a plurality of panel interface devices coupling the panel under test's drive lines and gate lines to a precision measurement unit (PMU). A controller determines the PMU signals and configures the panel interface devices. The PMU monitors select drive lines and gate lines to isolate zones having defects. An electro-optic voltage measurement system is used to identify the location of defects within an isolated zone.
    • 利用LCD面板中最常见缺陷的性质实现分层测试方法,以实现LCD面板等的快速有效参数测试。 在第一层测试中,面板在逻辑上分为区域和每个区域隔离测试,以识别具有至少一个缺陷的区域。 在下一层次,执行电光辅助区域检查以识别缺陷位于该区域内的哪里。 最后,使用电压成像方法检查每个像素,以确定像素的切换完整性是否可接受。 测试装置包括多个面板接口装置,将面板被测试的驱动线和栅极线耦合到精密测量单元(PMU)。 控制器确定PMU信号并配置面板接口设备。 PMU监视选择驱动线路和栅线以隔离具有缺陷的区域。 电光电压测量系统用于识别隔离区内缺陷的位置。
    • 6. 发明授权
    • Integrated circuit package with segregated Tx and Rx data channels
    • 集成电路封装,具有隔离的Tx和Rx数据通道
    • US08368217B2
    • 2013-02-05
    • US13541658
    • 2012-07-03
    • Michael J. MillerMark William BaumannRichard S. Roy
    • Michael J. MillerMark William BaumannRichard S. Roy
    • H01L23/48
    • H01L23/50H01L2924/0002H01L2924/00
    • A chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. Tx terminals are grouped contiguously to each other, and are segregated as a group to a given edge of the package, Rx terminals are similarly grouped and segregated to a different edge of the package. Tx and Rx data channels are disposed in a respective single layer of the package, or both are disposed in a same single layer of the package. Rx ports and Tx ports are located at an approximate center of the package, with Tx and Rx ports disposed on respective opposite sides of an axis bisecting the package. Data signals received by, and transmitted from, the chip flow in a same direction, from a first edge of the package to the center of the package and from the center of the package to a second edge of the package, respectively.
    • 芯片布局将Rx端子和Rx端口与Tx端子和Tx端口隔离。 Tx端子彼此连续分组,并且作为组分离到包装的给定边缘,Rx端子被类似地分组并分离到包装的不同边缘。 Tx和Rx数据通道设置在封装的相应单层中,或者两者都被布置在封装的相同的单层中。 Rx端口和Tx端口位于封装的大致中心处,Tx和Rx端口设置在平分封装的轴的相应相对两侧。 分别从包装的第一边缘到包装的中心以及从包装的中心到包装的第二边缘的相同方向从芯片流接收和传输的数据信号。
    • 7. 发明申请
    • INTEGRATED CIRCUIT PACKAGE WITH SEGREGATED TX AND RX DATA CHANNELS
    • 集成电路封装与分离的TX和RX数据通道
    • US20120267769A1
    • 2012-10-25
    • US13541658
    • 2012-07-03
    • Michael J. MillerMark BaumannRichard S. Roy
    • Michael J. MillerMark BaumannRichard S. Roy
    • H01L23/58
    • H01L23/50H01L2924/0002H01L2924/00
    • A chip layout isolates Rx terminals and Rx ports from Tx terminals and Tx ports. Tx terminals are grouped contiguously to each other, and are segregated as a group to a given edge of the package, Rx terminals are similarly grouped and segregated to a different edge of the package. Tx and Rx data channels are disposed in a respective single layer of the package, or both are disposed in a same single layer of the package. Rx ports and Tx ports are located at an approximate center of the package, with Tx and Rx ports disposed on respective opposite sides of an axis bisecting the package. Data signals received by, and transmitted from, the chip flow in a same direction, from a first edge of the package to the center of the package and from the center of the package to a second edge of the package, respectively.
    • 芯片布局将Rx端子和Rx端口与Tx端子和Tx端口隔离。 Tx端子彼此连续分组,并且作为组分离到包装的给定边缘,Rx端子被类似地分组并分离到包装的不同边缘。 Tx和Rx数据通道设置在封装的相应单层中,或者两者都被布置在封装的相同的单层中。 Rx端口和Tx端口位于封装的大致中心处,Tx和Rx端口设置在平分封装的轴的相应相对两侧。 分别从包装的第一边缘到包装的中心以及从包装的中心到包装的第二边缘的相同方向从芯片流接收和传输的数据信号。