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    • 3. 发明授权
    • Memory cell and method for fabricating same
    • 存储单元及其制造方法
    • US07462533B2
    • 2008-12-09
    • US11330660
    • 2006-01-12
    • Jae-Hwang KimHee-Seog Jeon
    • Jae-Hwang KimHee-Seog Jeon
    • H01L21/8238
    • H01L29/792H01L21/28282H01L29/66833H01L29/7923
    • A method for fabricating a memory cell includes forming a stacked insulating layer, and a lower conductive layer on a semiconductor substrate, patterning the lower conductive layer and the insulating layer to form a gap region, forming a gate insulating layer on exposed surfaces of the semiconductor substrate and the lower conductive layer in the gap region, forming a gate pattern on the gate insulating layer for filling the gap region, the gate pattern protruded upward to have sidewall portions exposed above the lower conductive layer, forming an upper sidewall pattern on each exposed sidewall portion of the gate pattern, patterning the lower conductive layer and the insulating layer to form a lower sidewall pattern and a charge storage layer under each upper sidewall pattern, wherein the gate pattern and each upper sidewall pattern are used as an etching mask.
    • 一种用于制造存储单元的方法包括在半导体衬底上形成堆叠的绝缘层和下导电层,图案化下导电层和绝缘层以形成间隙区,在半导体的暴露表面上形成栅极绝缘层 基板和下导电层,在栅极绝缘层上形成用于填充间隙区域的栅极图案,栅极图案向上突出,以使侧壁部分暴露在下导电层的上方,在每个暴露的 栅极图案的侧壁部分,图案化下导电层和绝缘层以在每个上侧壁图案下形成下侧壁图案和电荷存储层,其中栅极图案和每个上侧壁图案用作蚀刻掩模。
    • 4. 发明申请
    • Flash memory device and method of manufacturing the same
    • 闪存装置及其制造方法
    • US20070111451A1
    • 2007-05-17
    • US11650237
    • 2007-01-05
    • Jae-Hwang KimYong-Suk ChoiSeung-Beom YoonYong-Tae KimYoung-Sam Park
    • Jae-Hwang KimYong-Suk ChoiSeung-Beom YoonYong-Tae KimYoung-Sam Park
    • H01L21/336
    • H01L27/11521H01L27/115H01L29/40114H01L29/42328
    • A flash memory device including a tunnel dielectric layer, a floating gate layer, an interlayer dielectric layer and at least two mold layers formed on a semiconductor substrate and a method of manufacturing the same are provided. By sequentially patterning the layers, a first mold layer pattern and a floating gate layer pattern aligned with each other are formed. Exposed portions of side surfaces of the first mold layer pattern are selectively lateral etched, thereby forming a first mold layer second pattern having grooves in its sidewalls. A gate dielectric layer is formed on the semiconductor substrate adjacent to the floating gate layer pattern. A control gate having a width that is determined by the grooves in the second mold layer pattern is formed on the gate dielectric layer. By removing the first mold layer second pattern, spacers are formed on sidewalls of the control gate. Exposed portions of the interlayer dielectric layer and the floating gate layer pattern are selectively etched, using the spacer as an etch mask to form a floating gate having a width defined by the widths of the groove and spacer.
    • 提供一种包括隧道介电层,浮栅,层间电介质层和形成在半导体衬底上的至少两个模层的闪存器件及其制造方法。 通过顺序地图案化这些层,形成彼此对准的第一模具层图案和浮动栅极层图案。 选择性地横向蚀刻第一模具层图案的侧表面的暴露部分,从而在其侧壁中形成具有凹槽的第一模具层第二图案。 栅极电介质层形成在与浮动栅层图案相邻的半导体衬底上。 具有由第二模层图案中的凹槽确定的宽度的控制栅极形成在栅介质层上。 通过去除第一模具层第二图案,在控制门的侧壁上形成间隔物。 使用间隔物作为蚀刻掩模来选择性地蚀刻层间电介质层和浮栅层图案的暴露部分,以形成具有由沟槽和间隔物的宽度限定的宽度的浮动栅极。