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1. 发明授权

US07514654B2 Glass article with metal member joined thereto, and junction structure using the same 有权
标题翻译：与其连接的金属构件的玻璃制品以及使用其的结构结构
公开(公告)号：US07514654B2
公开(公告)日：2009-04-07
申请号：US10506385
申请日：2003-03-11
申请人： Ichiro Okajima , Hideki Watanabe , Kazuo Yamada
发明人： Ichiro Okajima , Hideki Watanabe , Kazuo Yamada
IPC分类号： H05B3/06 , B05D1/02
CPC分类号： H05B3/84 , B23K1/0008 , B23K1/20 , B23K35/262 , B23K2103/12 , B23K2103/16 , B23K2103/18 , B23K2103/54 , H01R4/02 , H01R4/04 , H01R4/62 , H01R4/625 , H01R4/64 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： The present invention is intended to provide a glass article with a metal member joined thereto in which an electroconductive coating film is formed on at least a part of the surface of the glass article by baking a silver paste that includes Ag particles and a glass frit, a joining plane of the metal member is fixed onto the electroconductive coating film with a lead-free solder alloy containing Sn as a main component, and the lead-free solder alloy contains at least 1.5 mass % of Ag, which prevents the appearance of the electroconductive coating film and the bonding strength from degrading. Furthermore, in the present invention, when using a metal member having at least two joining planes, the total area of the joining planes is set within a range of 37 mm2 to 50 mm2, which allows high bonding strength between the glass article and metal member to be maintained while using the lead-free solder alloy. Moreover, in the present invention, the volume of the lead-free solder alloy to be provided on each joining plane is set to be 1.0 to 2.0 times the product of the area of the joining plane concerned and the thickness of the lead-free solder alloy, which prevents cracks from occurring in the glass article.
摘要翻译：本发明旨在提供一种具有连接到其上的金属部件的玻璃制品，其中通过烘烤包括Ag颗粒和玻璃料的银膏在玻璃制品的至少一部分表面上形成导电涂层，使用含有Sn作为主要成分的无铅焊料将金属构件的接合面固定在导电性涂膜上，无铅焊料合金含有Ag的1.5质量％以上，防止了导电涂膜和粘合强度降低。此外，在本发明中，当使用具有至少两个接合面的金属构件时，接合面的总面积设定在37mm 2〜50mm 2的范围内，这允许玻璃制品和金属构件之间的高的接合强度在使用无铅焊料合金时进行维护。此外，在本发明中，设置在各接合面上的无铅焊料合金的体积设定为所涉接合面积的面积与无铅焊料的厚度的1.0〜2.0倍合金，其防止在玻璃制品中发生裂纹。

2. 发明申请

US20050112291A1 Glass fixture-joined glass article and joint structure using this 有权
标题翻译：玻璃夹具接合玻璃制品和使用这种连接结构
公开(公告)号：US20050112291A1
公开(公告)日：2005-05-26
申请号：US10506385
申请日：2003-03-11
申请人： Ichiro Okajima , Hideki Watanabe , Kazuo Yamada
发明人： Ichiro Okajima , Hideki Watanabe , Kazuo Yamada
IPC分类号： B23K1/00 , B23K1/20 , B23K35/26 , H01R4/02 , H01R4/04 , H01R4/62 , H01R4/64 , H05B3/84 , B05D1/02
CPC分类号： H05B3/84 , B23K1/0008 , B23K1/20 , B23K35/262 , B23K2103/12 , B23K2103/16 , B23K2103/18 , B23K2103/54 , H01R4/02 , H01R4/04 , H01R4/62 , H01R4/625 , H01R4/64 , H01R2201/02 , H01R2201/26 , H05B2203/016
摘要： The present invention is intended to provide a glass article with a metal member joined thereto in which an electroconductive coating film is formed on at least a part of the surface of the glass article by baking a silver paste that includes Ag particles and a glass frit, a joining plane of the metal member is fixed onto the electroconductive coating film with a lead-free solder alloy containing Sn as a main component, and the lead-free solder alloy contains at least 1.5 mass % of Ag, which prevents the appearance of the electroconductive coating film and the bonding strength from degrading. Furthermore, in the present invention, when using a metal member having at least two joining planes, the total area of the joining planes is set within a range of 37 mm2 to 50 mm2, which allows high bonding strength between the glass article and metal member to be maintained while using the lead-free solder alloy. Moreover, in the present invention, the volume of the lead-free solder alloy to be provided on each joining plane is set to be 1.0 to 2.0 times the product of the area of the joining plane concerned and the thickness of the lead-free solder alloy, which prevents cracks from occurring in the glass article.
摘要翻译：本发明旨在提供一种具有连接到其上的金属构件的玻璃制品，其中通过烘烤包括Ag颗粒和玻璃料的银膏在玻璃制品的至少一部分表面上形成导电涂层，使用含有Sn作为主要成分的无铅焊料将金属构件的接合面固定在导电性涂膜上，无铅焊料合金含有Ag的1.5质量％以上，防止了导电涂膜和粘合强度降低。此外，在本发明中，当使用具有至少两个接合面的金属构件时，接合面的总面积设定在37mm×2mm〜50mm的范围内， / SUP>，其在使用无铅焊料合金的同时保持玻璃制品和金属构件之间的高粘结强度。此外，在本发明中，设置在各接合面上的无铅焊料合金的体积设定为所涉接合面积的面积与无铅焊料的厚度的1.0〜2.0倍合金，其防止在玻璃制品中发生裂纹。

3. 发明授权

US09148713B2 Television and electronic device 有权
标题翻译：电视和电子设备
公开(公告)号：US09148713B2
公开(公告)日：2015-09-29
申请号：US13489648
申请日：2012-06-06
申请人： Tomofumi Miyamoto , Hideki Watanabe
发明人： Tomofumi Miyamoto , Hideki Watanabe
IPC分类号： H04R1/02 , H04R5/02
CPC分类号： H04R1/02 , H04R1/025
摘要： According to at least one embodiment, a television includes a housing further including a pair of corner portions and an enclosed space on an inner side thereof, a pair of speaker boxes housed in the enclosed space in vicinities of the corner portions, a pair of speakers housed in the speaker boxes respectively in a direction which crosses a thickness direction of the housing, and each of the speaker boxes further includes a first duct to guide sounds from a first side of the respective speaker to the respective first opening portion and a second duct to guide sounds from a second side of the respective speaker towards the enclosed space.
摘要翻译：根据至少一个实施例，电视机包括还包括一对角部和在其内侧上的封闭空间的壳体，一对容纳在角部附近的封闭空间中的扬声器箱，一对扬声器分别沿着与壳体的厚度方向交叉的方向容纳在扬声器箱中，并且每个扬声器盒还包括第一导管，用于将声音从相应扬声器的第一侧引导到相应的第一开口部分，第二导管以将声音从相应扬声器的第二侧引向封闭空间。

4. 发明申请

US20150131425A9 OPTICAL OSCILLATION DEVICE AND RECORDING APPARATUS 审中-公开
标题翻译：光学振荡装置和记录装置
公开(公告)号：US20150131425A9
公开(公告)日：2015-05-14
申请号：US13545688
申请日：2012-07-10
申请人： Goro Fujita , Tsutomu Maruyama , Masaru Kuramoto , Hideki Watanabe
发明人： Goro Fujita , Tsutomu Maruyama , Masaru Kuramoto , Hideki Watanabe
IPC分类号： G11B7/126 , G11B7/1374 , H01S5/065 , H01S5/0625 , H01S5/026 , G11B7/1275 , H01S5/34 , H01S5/343
CPC分类号： G11B7/126 , B82Y20/00 , G11B7/127 , G11B7/1275 , G11B7/128 , G11B2007/00457 , H01S5/0261 , H01S5/0602 , H01S5/06253 , H01S5/06255 , H01S5/0658 , H01S5/34333
摘要： Provided is a recording apparatus including a self-excited oscillation semiconductor laser that has a double quantum well separate confinement heterostructure and includes a saturable absorber section to which a negative bias voltage is applied and a gain section into which a gain current is injected, an optical separation unit, an objective lens, a light reception element, a pulse detection unit, a reference signal generation unit, a phase comparison unit, a recording signal generation unit, and a control unit.
摘要翻译：提供了一种记录装置，其包括具有双量子阱分离限制异质结构的自激振荡半导体激光器，并且包括施加负偏置电压的可饱和吸收部分和注入增益电流的增益部分，光学分离单元，物镜，光接收元件，脉冲检测单元，参考信号生成单元，相位比较单元，记录信号生成单元和控制单元。

5. 发明授权

US08672049B2 Vibration drill unit 失效
标题翻译：振动钻机
公开(公告)号：US08672049B2
公开(公告)日：2014-03-18
申请号：US11480974
申请日：2006-07-06
申请人： Junichi Tokairin , Kenji Kataoka , Yukio Terunuma , Hideki Watanabe , Shigeru Ishikawa , Shinki Ohtsu
发明人： Junichi Tokairin , Kenji Kataoka , Yukio Terunuma , Hideki Watanabe , Shigeru Ishikawa , Shinki Ohtsu
IPC分类号： E02D7/02
CPC分类号： B25D11/106 , B25D16/006 , B25D17/24 , B25D2250/345 , B25D2250/371
摘要： A vibration drill unit capable of obtaining an intensive drilling force. The vibration drill unit includes a first ratchet, anon-rotatable second ratchet having a claw engageable with the claw of the first ratchet, and a main body frame for accommodating a motor, a spindle, the first ratchet and the second ratchet. The respective claws of the first ratchet and the second ratchet include the first inclined surfaces formed so as to be engaged in the rotation direction by rotations of the first ratchet and so as to be separated from each other, the second inclined surfaces having greater inclination in the reversed direction than the first inclined surfaces, top parts that link the upper parts of both inclined surfaces to each other, and flat parts that link the bottom parts of both inclined surfaces to each other.
摘要翻译：一种能够获得强力钻井力的振动钻机。所述振动钻单元包括具有与所述第一棘轮的爪接合的爪的第一棘轮，可旋转的第二棘轮，以及用于容纳马达，主轴，所述第一棘轮和所述第二棘轮的主体框架。第一棘轮和第二棘轮的各个爪包括形成为通过第一棘轮的旋转而沿旋转方向接合并且彼此分离的第一倾斜表面，与第一倾斜表面相反的方向，将两个倾斜表面的上部彼此连接的顶部以及将两个倾斜表面的底部彼此连接的平坦部分。

6. 发明授权

US08442079B2 Mode-locked semiconductor laser device and driving method thereof 有权
标题翻译：锁模半导体激光器件及其驱动方法
公开(公告)号：US08442079B2
公开(公告)日：2013-05-14
申请号：US13035540
申请日：2011-02-25
申请人： Tomoyuki Oki , Masaru Kuramoto , Masao Ikeda , Takao Miyajima , Hideki Watanabe , Hiroyuki Yokoyama
发明人： Tomoyuki Oki , Masaru Kuramoto , Masao Ikeda , Takao Miyajima , Hideki Watanabe , Hiroyuki Yokoyama
IPC分类号： H01S3/098
摘要： Provided is a driving method of a mode-locked semiconductor laser device comprising a laminated structure in which a first compound semiconductor layer, a third compound semiconductor layer having an emission region and a second compound semiconductor layer are successively laminated, a second electrode, and a first electrode. The laminated structure is formed on a compound semiconductor substrate having polarity, the third compound semiconductor layer includes a quantum well structure having a well layer and a barrier layer. The well layer has a depth of 1 nm or more and 10 nm or less. The barrier layer has an impurity doping density of 2×1018 cm−3 or more and 1×1020 cm−3 or less. An optical pulse is generated in the emission region by passing a current from the second electrode to the first electrode via the laminated structure.
摘要翻译：提供了一种锁模半导体激光器件的驱动方法，其包括层叠结构，其中第一化合物半导体层，具有发射区域的第三化合物半导体层和第二化合物半导体层被连续层压，第二电极和第一电极。层叠结构形成在具有极性的化合物半导体基板上，第三化合物半导体层包括具有阱层和阻挡层的量子阱结构。阱层的深度为1nm以上且10nm以下。势垒层的杂质掺杂密度为2×1018cm-3以上且1×1020cm-3以下。通过将电流从第二电极通过层压结构传递到第一电极，在发射区域中产生光脉冲。

7. 发明授权

US08401311B2 Image processing device, method, and program 失效
标题翻译：图像处理装置，方法和程序
公开(公告)号：US08401311B2
公开(公告)日：2013-03-19
申请号：US12400936
申请日：2009-03-10
申请人： Koji Aoyama , Hideki Watanabe , Hiroaki Yamajo , Masuyoshi Kurokawa
发明人： Koji Aoyama , Hideki Watanabe , Hiroaki Yamajo , Masuyoshi Kurokawa
IPC分类号： G06K9/62
CPC分类号： H04N19/117 , H04N19/137 , H04N19/14 , H04N19/142 , H04N19/176 , H04N19/86
摘要： An image processing device includes: a step calculator configured to calculate, as a step, a difference in pixel values of pixels in a neighborhood with respect to each pixel in an image; a classifier configured to classify the pixels into classes for areas of the steps; a boundary ratio calculator configured to calculate, as a boundary ratio, a ratio of the number of pixels at a block boundary for each of the classes; and a block noise strength determinator configured to determine, as a block noise strength of the image, the step that is larger than a predetermined threshold and that is at a class having a largest value.
摘要翻译：一种图像处理装置，包括：步骤计算器，被配置为相对于图像中的每个像素计算邻域中的像素的像素值的差分，作为步骤; 配置为将像素分类为步骤区域的分类器; 边界比率计算器，被配置为计算每个类别的块边界处的像素数的比例作为边界比; 以及块噪声强度判定器，被配置为将所述图像的块噪声强度确定为大于预定阈值并且处于具有最大值的类的步长。

8. 发明授权

US08290005B2 Method of driving a laser diode 失效
公开(公告)号：US08290005B2
公开(公告)日：2012-10-16
申请号：US13212244
申请日：2011-08-18
申请人： Hiroyuki Yokoyama , Shunsuke Kono , Tomoyuki Oki , Masao Ikeda , Takao Miyajima , Hideki Watanabe
发明人： Hiroyuki Yokoyama , Shunsuke Kono , Tomoyuki Oki , Masao Ikeda , Takao Miyajima , Hideki Watanabe
IPC分类号： H01S3/13
CPC分类号： H01S5/06216 , H01S5/0428
摘要： An ultrashort pulse/ultra-high power laser diode with a simple structure and configuration is provided. In a method of driving a laser diode, the laser diode is driven by a pulse current which is 10 or more times higher than a threshold current value. The width of the pulse current is preferably 10 nanoseconds or less, and the value of the pulse current is specifically 0.4 amperes or over.

9. 发明申请

US20120236886A1 LASER DIODE ELEMENT ASSEMBLY AND METHOD OF DRIVING THE SAME 有权
标题翻译：激光二极管元件组件及其驱动方法
公开(公告)号：US20120236886A1
公开(公告)日：2012-09-20
申请号：US13417998
申请日：2012-03-12
申请人： Tomoyuki Oki , Masaru Kuramoto , Rintaro Koda , Hideki Watanabe , Hiroyuki Yokoyama
发明人： Tomoyuki Oki , Masaru Kuramoto , Rintaro Koda , Hideki Watanabe , Hiroyuki Yokoyama
IPC分类号： H01S5/062 , H01S5/028
CPC分类号： H01S5/0602 , B82Y20/00 , H01S5/0425 , H01S5/0625 , H01S5/1064 , H01S5/3063 , H01S5/34333 , H01S2301/166
摘要： A laser diode element assembly includes: a laser diode element; and a light reflector, in which the laser diode element includes (a) a laminate structure body configured by laminating, in order, a first compound semiconductor layer of a first conductivity type made of a GaN-based compound semiconductor, a third compound semiconductor layer made of a GaN-based compound semiconductor and including a light emission region, and a second compound semiconductor layer of a second conductivity type made of a GaN-based compound semiconductor, the second conductivity type being different from the first conductivity type, (b) a second electrode formed on the second compound semiconductor layer, and (c) a first electrode electrically connected to the first compound semiconductor layer, the laminate structure body includes a ridge stripe structure, and a minimum width Wmin and a maximum width Wmax of the ridge stripe structure satisfy 1
摘要翻译：激光二极管元件组件包括：激光二极管元件; 和光反射器，其中激光二极管元件包括（a）层叠结构体，其按顺序层叠由GaN基化合物半导体制成的第一导电类型的第一化合物半导体层，第三化合物半导体层由GaN系化合物半导体构成的发光区域和由GaN系化合物半导体构成的第二导电型的第二化合物半导体层，第二导电型与第一导电型不同，（b）形成在所述第二化合物半导体层上的第二电极，和（c）与所述第一化合物半导体层电连接的第一电极，所述层叠结构体包括脊条结构，并且所述脊的最小宽度Wmin和最大宽度Wmax 条纹结构满足1

10. 发明授权

US08218312B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08218312B2
公开(公告)日：2012-07-10
申请号：US12953966
申请日：2010-11-24
申请人： Hideki Watanabe , Shigeo Hayashi
发明人： Hideki Watanabe , Shigeo Hayashi
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , F28D15/0233 , F28D15/0275
摘要： According to one embodiment, an electronic apparatus includes a printed circuit board, a heat pipe, a fan unit and a fixing unit. The heat pipe has a first end physically fixed to and thermally connected to a first circuit component, and a second end opposite to the first end. The fan unit is provided in the vicinity of the second end of the heat pipe, and cools the second end. The fixing unit fixes the position of the heat pipe at a position different from the position of the first circuit component.
摘要翻译：根据一个实施例，电子设备包括印刷电路板，热管，风扇单元和定影单元。热管具有物理地固定并热连接到第一电路部件的第一端和与第一端相对的第二端。风扇单元设置在热管的第二端附近，并冷却第二端。固定单元将热管的位置固定在与第一电路部件的位置不同的位置处。

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