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    • 3. 发明授权
    • Method of manufacturing light emitting diode and light emitting diode manufactured thereby
    • 由此制造发光二极管和发光二极管的方法
    • US08685772B2
    • 2014-04-01
    • US13344298
    • 2012-01-05
    • Dong Ju LeeHeon Ho LeeHyun Wook ShimYoung Sun Kim
    • Dong Ju LeeHeon Ho LeeHyun Wook ShimYoung Sun Kim
    • H01L33/02
    • H01L33/0075H01L33/007H01L33/32
    • There is provided a method of manufacturing a light emitting diode and a light emitting diode manufactured by the same. The method includes growing a first conductivity type nitride semiconductor layer and an undoped nitride semiconductor layer on a substrate sequentially in a first reaction chamber; transferring the substrate having the first conductivity type nitride semiconductor layer and the undoped nitride semiconductor layer grown thereon to a second reaction chamber; growing an additional first conductivity type nitride semiconductor layer on the undoped nitride semiconductor layer in the second reaction chamber; growing an active layer on the additional first conductivity type nitride semiconductor layer; and growing a second conductivity type nitride semiconductor layer on the active layer.
    • 提供了一种制造发光二极管的方法和由其制造的发光二极管。 该方法包括在第一反应室中顺序地在衬底上生长第一导电型氮化物半导体层和未掺杂的氮化物半导体层; 将具有第一导电型氮化物半导体层和其上生长的未掺杂氮化物半导体层的衬底转移到第二反应室; 在第二反应室中的未掺杂的氮化物半导体层上生长附加的第一导电型氮化物半导体层; 在附加的第一导电型氮化物半导体层上生长活性层; 以及在所述有源层上生长第二导电型氮化物半导体层。
    • 8. 发明授权
    • Method of fabricating semiconductor light emitting device
    • 制造半导体发光器件的方法
    • US08709839B2
    • 2014-04-29
    • US13493342
    • 2012-06-11
    • Jong Hyun LeeDong Ju LeeYoung Sun Kim
    • Jong Hyun LeeDong Ju LeeYoung Sun Kim
    • H01L21/00
    • H01L33/0079
    • There is provided a method of fabricating a semiconductor light emitting device, including: forming a sacrificial layer having a plurality of nanostructures on a growth substrate; forming a protective layer to cover the sacrificial layer; forming a light emitting structure by allowing a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer to be sequentially grown on the protective layer; etching the protective layer to expose the nanostructures; and separating the light emitting structure from the growth substrate by etching the exposed nanostructures, whereby damage and degradation of a light emitting structure at the time of the separation thereof may be prevented.
    • 提供一种制造半导体发光器件的方法,包括:在生长衬底上形成具有多个纳米结构的牺牲层; 形成保护层以覆盖牺牲层; 通过允许第一导电半导体层,有源层和第二导电半导体层在保护层上顺序生长来形成发光结构; 蚀刻保护层以暴露纳米结构; 并且通过蚀刻暴露的纳米结构将发光结构与生长衬底分离,从而可以防止发光结构在其分离时的损坏和劣化。
    • 10. 发明申请
    • METHOD OF FABRICATING SEMICONDUCTOR LIGHT EMITTING DEVICE
    • 制造半导体发光器件的方法
    • US20120322191A1
    • 2012-12-20
    • US13493342
    • 2012-06-11
    • Jong Hyun LeeDong Ju LeeYoung Sun Kim
    • Jong Hyun LeeDong Ju LeeYoung Sun Kim
    • H01L33/06
    • H01L33/0079
    • There is provided a method of fabricating a semiconductor light emitting device, including: forming a sacrificial layer having a plurality of nanostructures on a growth substrate; forming a protective layer to cover the sacrificial layer; forming a light emitting structure by allowing a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer to be sequentially grown on the protective layer; etching the protective layer to expose the nanostructures; and separating the light emitting structure from the growth substrate by etching the exposed nanostructures, whereby damage and degradation of a light emitting structure at the time of the separation thereof may be prevented.
    • 提供一种制造半导体发光器件的方法,包括:在生长衬底上形成具有多个纳米结构的牺牲层; 形成保护层以覆盖牺牲层; 通过允许第一导电半导体层,有源层和第二导电半导体层在保护层上顺序生长来形成发光结构; 蚀刻保护层以暴露纳米结构; 并且通过蚀刻暴露的纳米结构将发光结构与生长衬底分离,从而可以防止发光结构在其分离时的损坏和劣化。