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    • 7. 发明授权
    • Method for forming low-k dielectric layer of semiconductor device
    • 用于形成半导体器件的低k电介质层的方法
    • US06987070B2
    • 2006-01-17
    • US10874928
    • 2004-06-23
    • Jong Sun Maeng
    • Jong Sun Maeng
    • H01L21/31
    • H01L21/02107C23C4/01C23C4/18C23C24/04H01L21/02203H01L21/02282H01L21/31695H01L21/7682
    • Disclosed is a method for forming a low-k dielectric layer of a semiconductor device. The method includes a step providing a semiconductor substrate having a predetermined pattern, a step coating porous powders having a micro size on the semiconductor by spraying the porous powders, and a step performing a heat treatment process with respect to a resultant structure, thereby forming the low-k dielectric layer. After micro-sized porous powders are coated on a semiconductor substrate, a heat treatment process is performed, so that powders are bonded to each other, thereby forming a low-k dielectric layer even if the dielectric layer has a dielectric constant equal to or less than 2.8. A signal delay time is reduced by depositing the low-k dielectric layer on the semiconductor substrate.
    • 公开了一种用于形成半导体器件的低k电介质层的方法。 该方法包括提供具有预定图案的半导体衬底的步骤,通过喷射多孔粉末在半导体上阶式涂覆具有微小尺寸的多孔粉末,以及对所得结构进行热处理工艺的步骤,从而形成 低k电介质层。 将微尺寸多孔粉末涂覆在半导体衬底上之后,进行热处理工艺,使得粉末彼此结合,从而形成低k电介质层,即使电介质层的介电常数等于或等于 比2.8。 通过在半导体衬底上沉积低k电介质层来减小信号延迟时间。