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1. 发明授权

US5126113A Apparatus for producing czochralski-grown single crystals 失效
公开(公告)号：US5126113A
公开(公告)日：1992-06-30
申请号：US677172
申请日：1991-03-29
申请人： Hirotoshi Yamagishi , Kouji Mizuishi , Fumihiko Hasegawa
发明人： Hirotoshi Yamagishi , Kouji Mizuishi , Fumihiko Hasegawa
IPC分类号： C30B15/30
CPC分类号： C30B15/30 , Y10S117/90 , Y10S117/911 , Y10T117/1032 , Y10T117/1072
摘要： An apparatus for producing a single crystal ingot grown by the Czochralski method includes a plurality of grip arms each having a grip finger engageable with a downwardly facing engagement step formed on an upper part of the single crystal, and a ring slidably fitted around a plurality of grip arms to hold the grip arms in a closed position in which the engagement step of the single crystal is firmly gripped by the grip fingers against detachment. The apparatus having such a ring is particularly advantageous when used for the production of a heavy single crystal ingot in which the grip arms are forced to spread apart by the weight of the single crystal ingot.

2. 发明授权

US5860853A Apparatus for polishing wafers 失效
标题翻译：抛光晶圆的设备
公开(公告)号：US5860853A
公开(公告)日：1999-01-19
申请号：US769441
申请日：1996-12-19
申请人： Fumihiko Hasegawa , Makoto Kobayashi , Fumio Suzuki
发明人： Fumihiko Hasegawa , Makoto Kobayashi , Fumio Suzuki
IPC分类号： B24B37/04 , B24B37/27 , B24B37/28 , B24B37/30 , H01L21/304 , B24B7/22
CPC分类号： B24B37/107 , B24B37/30
摘要： An apparatus for polishing wafers comprising a turn table with a polishing pad fixedly extended thereon, at least one polishing head positioned above a point on the turn table spaced by a distance from its center, a plate mounted on a lower surface of the at least one polishing head, and a carrier, which is used for retaining the wafers, mounted on the plate in a manner such that the carrier is freely rotatable relative to the plate, wherein a backing pad which is used to press the wafers is fixed on the plate and the wafers are rotated around their respective centers, while being revolved around the center of the plate. According to the apparatus, polished wafers with an excellent flatness are obtained in a reliable manner.
摘要翻译：一种用于抛光晶片的装置，包括具有固定地延伸在其上的抛光垫的转台，至少一个抛光头，其位于与其中心间隔一定距离的转台上的点上方，安装在至少一个的下表面上的板抛光头和用于保持晶片的载体，其以相对于板自由旋转的方式安装在板上，其中用于将晶片推压的背衬垫固定在板上并且晶片绕其各自的中心旋转，同时围绕板的中心旋转。根据该设备，以可靠的方式获得具有优异平坦度的抛光晶片。

3. 发明授权

US5547415A Method and apparatus for wafer chamfer polishing 失效
标题翻译：晶圆倒角抛光方法及装置
公开(公告)号：US5547415A
公开(公告)日：1996-08-20
申请号：US72741
申请日：1993-06-07
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
IPC分类号： H01L21/304 , B24B9/00 , B24B9/06 , B24B37/00 , B24B41/00 , B24B41/06
CPC分类号： B24B9/065 , B24B37/00 , B24B41/005
摘要： A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.
摘要翻译：一种沿周边抛光倒角的方法和装置; 半导体晶片被设计成使得当晶片被传送机器人臂的旋转吸盘拾取时，晶片不会从吸盘释放直到整个抛光操作完成; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角，以转移晶片。

4. 发明授权

US6017497A Atomizing roasting furnace for producing ferrite raw material powder 失效
标题翻译：用于生产铁氧体原料粉末的雾化炉
公开(公告)号：US6017497A
公开(公告)日：2000-01-25
申请号：US918571
申请日：1997-08-22
申请人： Katsushige Matsuzaki , Tatsunori Sunagawa , Kenji Kawahito , Junji Omori , Yoshitaka Yamana , Shoichi Osada , Kiyoshi Aritome , Yoshimasa Ikeda , Izumi Matsushita , Wataru Ohashi , Kaoru Ito , Fumihiko Hasegawa , Shinya Nariki , Michimasa Sasaki , Noritane Tsugane , Toshiaki Kurihara
发明人： Katsushige Matsuzaki , Tatsunori Sunagawa , Kenji Kawahito , Junji Omori , Yoshitaka Yamana , Shoichi Osada , Kiyoshi Aritome , Yoshimasa Ikeda , Izumi Matsushita , Wataru Ohashi , Kaoru Ito , Fumihiko Hasegawa , Shinya Nariki , Michimasa Sasaki , Noritane Tsugane , Toshiaki Kurihara
IPC分类号： C01G49/00 , C04B35/26 , C04B35/626 , H01F1/34 , B01J19/26 , F27B1/00
CPC分类号： C04B35/2658 , C01G49/009 , C04B35/26 , C04B35/626 , H01F1/344 , C01P2004/61 , C01P2006/12
摘要： An atomization roasting furnace for producing ferrite raw material powder includes an elongated roasting furnace body with a center burner located at the top end thereof. At least three liquid spray nozzles are located in an expansion slope portion below the center burner circumferentially with respect to the center burner. A quencher, located below the elongated roasting furnace body, has a top end connected to a bottom end of the elongated roasting furnace body. Quencher nozzles are located adjacent the top end of the quencher.
摘要翻译：一种用于生产铁氧体原料粉末的雾化焙烧炉包括具有位于其顶端的中心燃烧器的细长焙烧炉体。至少三个液体喷嘴位于相对于中心燃烧器周向的中心燃烧器下方的膨胀斜面部分中。位于细长焙烧炉体下方的淬火器具有连接到细长焙烧炉体的底端的顶端。猝灭剂喷嘴位于猝灭剂顶端附近。

5. 发明授权

US5928066A Apparatus for polishing peripheral portion of wafer 失效
标题翻译：用于抛光晶片周边部分的装置
公开(公告)号：US5928066A
公开(公告)日：1999-07-27
申请号：US993989
申请日：1997-12-18
申请人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Yasuyoshi Kuroda , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B9/06 , B24D9/06 , B24B5/00
CPC分类号： B24D9/06 , B24B9/065
摘要： A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
摘要翻译：公开了半导体晶片的外围倒角部分的抛光装置。抛光装置包括：围绕其周边的旋转鼓，其上缠绕有其上的研磨层的带; 用于旋转所述旋转滚筒的第一马达; 晶片保持机构，其包括用于保持晶片的晶片保持部件，用于旋转晶片保持部件的第二电动机，用于支撑晶片保持部件和第二电动机的支撑部件，以及用于改变晶片保持部件的倾斜角度的晶片倾斜部件所述晶片相对于所述旋转鼓通过使所述支撑构件在基本上平行于所述晶片的主表面的第一轴线上往复旋转; 以及移动构件，用于使保持在支撑构件上的晶片与缠绕在旋转鼓上的带接触或分离。

6. 发明授权

US5733181A Apparatus for polishing the notch of a wafer 失效
标题翻译：用于抛光晶片凹口的装置
公开(公告)号：US5733181A
公开(公告)日：1998-03-31
申请号：US329952
申请日：1994-10-27
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B1/04 , B24B9/00 , B24B9/06 , B24B21/00 , B24B21/22 , H01L21/304 , B24B7/00
CPC分类号： B24B21/002 , B24B9/065
摘要： An apparatus for polishing the notch of a wafer in an effective and efficient way, which comprises: a flexible tape carrying abrasive grains in the working face thereof; an infeed reel for feeding the tape stored thereon: a take-up reel for taking up the tape fed from the infeed reel; a motor for driving to rotate the take-up reel; a means for blowing a fluid to the backside surface to the edge portion of the notch to be in direct contact along the full periphery of the notch; and a means for oscillating the tape sideways.
摘要翻译：一种用于以有效和有效的方式抛光晶片的凹口的装置，其包括：在其工作面中承载磨料颗粒的柔性带; 用于馈送存储在其上的带的进给卷轴;卷取卷轴，用于卷取从进料卷轴进给的带; 用于驱动旋转卷取卷轴的马达; 用于将流体吹送到所述凹口的所述边缘部分的所述后侧表面沿着所述凹口的整个周边直接接触的装置; 以及用于横向摆动带的装置。

7. 发明授权

US5476413A Apparatus for polishing the periphery portion of a wafer 失效
标题翻译：用于抛光晶圆周边部分的装置
公开(公告)号：US5476413A
公开(公告)日：1995-12-19
申请号：US306439
申请日：1994-09-19
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B9/00 , B24B9/06 , B24B21/00 , B24D9/06 , H01L21/304
CPC分类号： B24B9/065 , B24B21/002 , B24B21/004 , B24D9/06
摘要： An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.
摘要翻译：抛光晶片周边部分的装置可以进行研磨速度的改善，并且除了可以更有效地利用砂带工作层的空间使用之外，还包括在其上保持固定磨粒的带; 用于馈送通过缠绕自身而存储的带的馈送卷轴; 用于卷绕磁带的卷取卷轴; 其中两个卷盘的两个卷轴被安装成可安装或拆卸的旋转滚筒，其中从进给卷轴到卷取卷轴的带的一部分适于卷绕旋转滚筒其圆柱形表面紧密接触螺旋形状并且晶片的主面之一被定位成与旋转鼓的中心轴线成一定角度的平面。

8. 发明授权

US5404678A Wafer chamfer polishing apparatus with rotary circular dividing table 失效
标题翻译：晶圆倒角抛光装置带旋转圆形分割台
公开(公告)号：US5404678A
公开(公告)日：1995-04-11
申请号：US72776
申请日：1993-06-07
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
IPC分类号： H01L21/304 , B24B9/00 , B24B9/06 , B24B27/00 , B24B41/00 , B24B41/06 , B25B5/00
CPC分类号： B24B9/065 , B24B27/0023 , B24B41/005
摘要： A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.
摘要翻译：具有旋转圆形分割台的晶片倒角抛光装置，其中用于气动激活晶片吸盘的真空泵安装在旋转圆形分割台的一体部分上，用于动态启动晶片吸盘的驱动马达安装在独立静止体。

9. 发明授权

US06234879B1 Method and apparatus for wafer chamfer polishing 失效
标题翻译：晶圆倒角抛光方法及装置
公开(公告)号：US06234879B1
公开(公告)日：2001-05-22
申请号：US08619882
申请日：1996-03-20
申请人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
发明人： Fumihiko Hasegawa , Tatsuo Ohtani , Yasuyoshi Kuroda
IPC分类号： B24B900
CPC分类号： B24B9/065 , B24B37/00 , B24B41/005
摘要： A method and apparatus for polishing chamfers made along the periphery of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60° to transfer the wafers.
摘要翻译：一种用于抛光沿半导体晶片的周边形成的倒角的方法和装置，其设计成使得当晶片被传送机器人臂的旋转吸盘一次拾取时，晶片不会从吸盘释放直到整个抛光操作完成了; 在一个实施例中，使用具有六个晶片吸盘的圆形转台，其适于逐步转动，每个步骤包括60°的转角以转移晶片。

10. 发明授权

US6113463A Method of and apparatus for mirror-like polishing wafer chamfer with orientation flat 失效
标题翻译：具有取向平面的镜面抛光晶圆倒角的方法和装置
公开(公告)号：US6113463A
公开(公告)日：2000-09-05
申请号：US623771
申请日：1996-03-29
申请人： Fumihiko Hasegawa , Yasuyoshi Kuroka , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
发明人： Fumihiko Hasegawa , Yasuyoshi Kuroka , Toshihiro Tsuchiya , Koichiro Ichikawa , Yasuo Inada
IPC分类号： B24B9/00 , B24B9/06 , B24B49/02 , B24B49/12 , B34B49/00 , B34B9/02
CPC分类号： B24B49/12 , B24B49/02 , B24B9/065
摘要： A method for chamfer mirror-like polishing a wafer having an orientation flat by rotating the wafer in a state of being pressed by a rotating buffering wheel with a predetermined pressure, is disclosed. Mirror-surface polishing a stable wafer chamfer can be obtained with a relatively simple control system. The invention is predicated in the fact that the wafer rotation speed N.sub.s has low inertial mass and low rotation speed so that the wafer rotation speed control can be obtained with high response property and high accuracy compared to pressing pressure control and buffering wheel control, and it features detecting intrinsic peripheral part, corners and orientation flat part of wafer according to a detection signal of detection means for detecting the wafer mirror-like polishing position and controlling the wafer rotation speed N.sub.s according to the detected wafer mirror-like polishing position.
摘要翻译：公开了一种通过在被预定压力的旋转缓冲轮按压的状态下旋转晶片而具有取向平坦的晶片的倒角镜状抛光方法。用相对简单的控制系统可以获得镜面抛光稳定的晶圆倒角。本发明的前提是，晶片旋转速度Ns具有低惯性质量和低转速，因此与按压压力控制和缓冲轮控制相比，可以获得具有高响应特性和高精度的晶片转速控制，并且根据检测晶片反射镜抛光位置的检测装置的检测信号，根据检测到的晶片反射镜抛光位置来控制晶片转速Ns，检测晶片的固有外围部分，拐角和定向平面部分。

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