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    • 1. 发明授权
    • Apparatus for polishing peripheral portion of wafer
    • 用于抛光晶片周边部分的装置
    • US5928066A
    • 1999-07-27
    • US993989
    • 1997-12-18
    • Fumihiko HasegawaYasuyoshi KurodaToshihiro TsuchiyaKoichiro IchikawaYasuo Inada
    • Fumihiko HasegawaYasuyoshi KurodaToshihiro TsuchiyaKoichiro IchikawaYasuo Inada
    • B24B9/06B24D9/06B24B5/00
    • B24D9/06B24B9/065
    • A polishing apparatus of a peripheral chamfered portion of a semiconductor wafer is disclosed. The polishing apparatus comprises: a rotary drum around the periphery of which a tape having an abrasive layer thereon is wound; a first motor for rotating the rotary drum; a wafer holding mechanism which comprises a wafer holding member for holding a wafer, a second motor for rotating the wafer holding member, a supporting member for supporting the wafer holding member and the second motor, and a wafer inclining member for changing the tilt angle of the wafer with respect to the rotary drum by reciprocally rotating the supporting member on a first axis which is substantially parallel with the main surface of the wafer; and a moving member for bringing the wafer held on the supporting member into contact with or separating it from the tape wound around the rotary drum.
    • 公开了半导体晶片的外围倒角部分的抛光装置。 抛光装置包括:围绕其周边的旋转鼓,其上缠绕有其上的研磨层的带; 用于旋转所述旋转滚筒的第一马达; 晶片保持机构,其包括用于保持晶片的晶片保持部件,用于旋转晶片保持部件的第二电动机,用于支撑晶片保持部件和第二电动机的支撑部件,以及用于改变晶片保持部件的倾斜角度的晶片倾斜部件 所述晶片相对于所述旋转鼓通过使所述支撑构件在基本上平行于所述晶片的主表面的第一轴线上往复旋转; 以及移动构件,用于使保持在支撑构件上的晶片与缠绕在旋转鼓上的带接触或分离。
    • 8. 发明授权
    • Polishing apparatus
    • 抛光设备
    • US5549502A
    • 1996-08-27
    • US162679
    • 1993-12-06
    • Kohichi TanakaHiromasa HashimotoYasuo InadaMakoto Nakajima
    • Kohichi TanakaHiromasa HashimotoYasuo InadaMakoto Nakajima
    • B24B37/34B24B1/00
    • B24B37/345
    • A grinding method and apparatus having a position aligning mechanism to correctly achieve the centering of each work on a work table and locate an orientation flat part of each work at a predetermined position, and a displacing mechanism for reciprocally slidably displacing a top ring and the work table in order to assure that the center of each work is positionally aligned with the center of each top ring at an original position after completion of the centering of each work on the work table and the locating of the orientation flat part, and subsequently, centering each top ring with the gravitational center of each work so as to cancel a positional offset state prior to holding the work with the top ring to thrust the work against the grinding or polishing surface. The invention also includes a polishing method and apparatus in which both of a top ring and a rotary disc are reciprocally slidably displaced to improve the polishing efficiency of the device.
    • 一种磨削方法和装置,其具有位置对准机构,以正确地实现每个工件在工作台上的对中并将每个工件的定向平面部分定位在预定位置,以及位移机构,用于可往复地滑动地移动顶环和工件 以确保每个工件的中心在完成每个工件在工作台上的定心和定位平面部分的定位之后在原始位置与每个顶环的中心位置对准,然后定心 每个顶环具有每个工件的重力中心,以便在用顶环保持工件之前取消位置偏移状态,以将工件推向研磨或抛光表面。 本发明还包括抛光方法和装置,其中顶环和旋转盘都可往复滑动地移位,以提高装置的抛光效率。
    • 10. 发明授权
    • Abrasive system
    • 磨料系统
    • US06361418B1
    • 2002-03-26
    • US09547659
    • 2000-04-12
    • Yasuo Inada
    • Yasuo Inada
    • B24B700
    • B24B37/08B24B37/345B24B49/12
    • The abrasive system of the present invention is capable of automatically and efficiently feeding and discharging work pieces. In the abrasive system, an upper abrasive plate and a lower abrasive plate pinch the work pieces, which are provided in through-holes of a carrier and abrade both faces of each work piece. A carrier driving mechanism moves the carrier, along a circular orbit, without spinning, together with the work pieces. Stopping means stops the movement of the carrier at a predetermined position. The feeding-and-discharging means includes: an arm robot having a work holding unit, which is provided to a front end and capable of holding and releasing the work piece; and an image processing unit for recognizing shapes and positions of the through-holes of the carrier and the work pieces.
    • 本发明的磨料系统能够自动且有效地进给和排出工件。 在研磨系统中,上研磨板和下研磨板夹紧工件,其被设置在载体的通孔中并磨损每个工件的两个面。 载体驱动机构与工件一起沿着圆形轨道移动载体而不旋转。 停止装置停止载体在预定位置的移动。 送出装置包括:臂机器人,其具有工件保持单元,该工件保持单元设置在前端并能够保持和释放工件; 以及图像处理单元,用于识别载体和工件的通孔的形状和位置。