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1. 发明授权

US07458469B2 Substrate transfer apparatus and method, and storage medium 失效
标题翻译：基板转印装置和方法以及存储介质
公开(公告)号：US07458469B2
公开(公告)日：2008-12-02
申请号：US11227136
申请日：2005-09-16
申请人： Hiroki Hosaka , Toshihiko Iijima , Shinya Shimizu
发明人： Hiroki Hosaka , Toshihiko Iijima , Shinya Shimizu
IPC分类号： B65G49/07
CPC分类号： H01L21/67309 , Y10S414/137
摘要： In a substrate transfer apparatus, an adaptor unit 25 includes a box-shaped main body 40 having three open sides; and a plurality of stage arms 41 disposed in the main body 40, serving as substrate mounting members. Each of the stage arms 41 has a disc-shaped wafer supporting portion 411 disposed at an approximately central portion of the main body 40 and a flat body 412 disposed in the main body 40 so as not to interfere with the moving paths of transfer arms 241 and 341. Formed at a connecting portion of the wafer supporting portion 411 and the body 412 are cutout portions 413 for preventing interference between the stage arms 41 and two prongs of leading end portions of the transfer arms 241 and 341 introduced into the main body 40.
摘要翻译：在基板输送装置中，适配器单元25包括具有三个开口侧的箱形主体40; 以及设置在主体40中的用作基板安装构件的多个平台臂41。每个平台臂41具有设置在主体40的大致中央部的盘状晶片支撑部411和设置在主体40中的平坦体412，以便不干涉传送臂241的移动路径在晶片支撑部分411和主体412的连接部分处形成切口部分413，用于防止台臂41与引入主体40的转移臂241和341的前端部分的两个尖头之间的干涉。

2. 发明申请

US20070031222A1 Substrate transfer apparatus and method, and storage medium 失效
标题翻译：基板转印装置和方法以及存储介质
公开(公告)号：US20070031222A1
公开(公告)日：2007-02-08
申请号：US11227136
申请日：2005-09-16
申请人： Hiroki Hosaka , Toshihiko Iijima , Shinya Shimizu
发明人： Hiroki Hosaka , Toshihiko Iijima , Shinya Shimizu
IPC分类号： B65B69/00
CPC分类号： H01L21/67309 , Y10S414/137
摘要： In a substrate transfer apparatus, an adaptor unit 25 includes a box-shaped main body 40 having three open sides; and a plurality of stage arms 41 disposed in the main body 40, serving as substrate mounting members. Each of the stage arms 41 has a disc-shaped wafer supporting portion 411 disposed at an approximately central portion of the main body 40 and a flat body 412 disposed in the main body 40 so as not to interfere with the moving paths of transfer arms 241 and 341. Formed at a connecting portion of the wafer supporting portion 411 and the body 412 are cutout portions 413 for preventing interference between the stage arms 41 and two prongs of leading end portions of the transfer arms 241 and 341 introduced into the main body 40.
摘要翻译：在基板输送装置中，适配器单元25包括具有三个开口侧的箱形主体40; 以及设置在主体40中的用作基板安装构件的多个平台臂41。每个平台臂41具有设置在主体40的大致中央部的盘状晶片支撑部411和设置在主体40中的平坦体412，以便不干涉传送臂241的移动路径和341。在晶片支撑部分411和主体412的连接部分处形成切口部分413，用于防止台臂41与引入主体40的转移臂241和341的前端部分的两个尖头之间的干涉。

3. 发明申请

US20050209725A1 Conveyance system, conveyance method and vacuum holding apparatus for object to be processed, and centering method for wafer 审中-公开
标题翻译：传送系统，输送方法和待处理物体的真空保持装置以及晶圆的定心方法
公开(公告)号：US20050209725A1
公开(公告)日：2005-09-22
申请号：US11129313
申请日：2005-05-16
申请人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
发明人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
IPC分类号： G05B19/00 , G05B19/418 , H01L21/00 , H01L21/68 , G06F19/00
CPC分类号： H01L21/6835 , G05B19/00 , G05B19/41815 , G05B2219/31002 , G05B2219/45031 , H01L21/67276 , Y02P90/08 , Y02P90/285 , Y02P90/60
摘要： A conveyance system E for wafers W includes a host computer 1 for carrying out the management of the production of semiconductor devices, a plurality of probers 2 for inspecting the electric characteristics of the wafers W under the administration of the host computer 1, an AGV 3 for automatically transporting the wafers W in block of a carrier in order to deliver the wafers W one by one to these probers 2 according to respective demands and an AGV controller 4 for controlling the operation of the AGV 3 under the administration of the host computer 1.
摘要翻译：用于晶片W的输送系统E包括用于执行半导体器件的生产的管理的主计算机1，用于在主计算机1的管理下检查晶片W的电特性的多个探测器2，AGV 3 用于在载体的块中自动输送晶片W，以便根据各自的要求将晶片W一个一个地传送到这些探测器2;以及AGV控制器4，用于在主计算机1的管理下控制AGV 3的操作。

4. 发明授权

US07283890B2 Work convey system, unmanned convey vehicle system, unmanned convey vehicle, and work convey method 失效
标题翻译：工作传送系统，无人驾驶车辆系统，无人驾驶车辆和工作传送方式
公开(公告)号：US07283890B2
公开(公告)日：2007-10-16
申请号：US10485969
申请日：2002-12-27
申请人： Toshihiko Iijima , Shuji Akiyama , Hiroki Hosaka , Takashi Nakao
发明人： Toshihiko Iijima , Shuji Akiyama , Hiroki Hosaka , Takashi Nakao
IPC分类号： G06F7/00
CPC分类号： H01L21/67763 , G05B19/41865 , G05B2219/31429 , G05B2219/32107 , G05B2219/32252 , G05B2219/32283 , G05B2219/45031 , G06Q10/06 , H01L21/67754 , Y02P90/08 , Y02P90/20
摘要： There is a jump in the number of devices formed on a single wafer, and it takes a lot of time to inspect a single wafer. In addition, if wafers are inspected every lot, detected wafers remain in staying in a prober until the inspection of all of the wafers is completed. Therefore, the time required to transfer the wafers of each lot to the subsequent step is delayed. As a result, it is difficult to shorten TAT (Turn-Around-Time), and it is difficult to flexibly operate the prober.A transfer system E according to the present invention includes: a host computer 1; a plurality of probers 2 under the control of the host computer 1; a plurality of RGVs 4 for delivering a wafer W to each of the probers 2, one by one, at its request; and a transfer operating unit 5, associated with the host computer, for operating the RGVs 4. The transfer operating unit 5 has a scheduler 54A and a dispatcher 54B, for preparing an operating schedule for each of the RGVs 4 on the basis of the relationship in position between each of the probers 2 and each of the RGVs 4, and for determining optimum transfer paths for the RGVs 4, to assign a corresponding one of the RGVs 4 to a corresponding one of the optimum transfer paths.
摘要翻译：在单个晶片上形成的器件数量有所跳跃，检查单个晶片花费大量时间。另外，如果每批次检查晶片，检测到的晶片保留在探针中，直到完成所有晶片的检查。因此，将每个批次的晶片转移到随后的步骤所需的时间被延迟。因此，难以缩短TAT（周转时间），难以灵活操作探测器。根据本发明的传送系统E包括：主计算机1; 在主计算机1的控制下的多个探测器2; 多个RGV4，用于根据要求一个接一个地将晶片W传送到每个探测器2; 以及与主计算机相关联的用于操作RGV 4的传送操作单元5。传送操作单元5具有调度器54A和调度器54B，用于根据每个探测器2和每个RGV 4之间的位置关系来准备每个RGV4的操作时间表，并且为了确定RGV4的最佳传输路径，以将RGV4中的相应一个分配给最佳传输路径中的相应一个。

5. 发明申请

US20070150085A1 CONVEYANCE METHOD FOR TRANSPORTING OBJECTS 失效
标题翻译：运输对象的输送方法
公开(公告)号：US20070150085A1
公开(公告)日：2007-06-28
申请号：US11550433
申请日：2006-10-18
申请人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
发明人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
IPC分类号： G06F19/00
CPC分类号： H01L21/67276 , H01L21/67775 , H01L21/67778 , Y10S414/135
摘要： The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.
摘要翻译：本发明涉及用于在自动传送装置（AGV）和半导体制造装置（探测器）之间传送多个未处理物体的传送方法。探测器具有一个负载端口，从该对象从AGV传送对象。该方法包括以下步骤：在AGV与探测器之间进行通信，以确定与负载端口之间传送物体的相应定时; 并且经由装载端口在AGV和探测器之间传送对象，其中通过使用用于临时保持物体的保持位置，物体到/从装载端口的传送的定时彼此偏移。持有站点至少是AGV的组件和负载端口以外的探测器。

6. 发明授权

US07457680B2 Conveyance method for transporting objects 失效
标题翻译：输送物体运输方式
公开(公告)号：US07457680B2
公开(公告)日：2008-11-25
申请号：US11550433
申请日：2006-10-18
申请人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
发明人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
IPC分类号： G06F19/00 , G06F7/00 , G05B19/18
CPC分类号： H01L21/67276 , H01L21/67775 , H01L21/67778 , Y10S414/135
摘要： The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.
摘要翻译：本发明涉及用于在自动传送装置（AGV）和半导体制造装置（探测器）之间传送多个未处理物体的传送方法。探测器具有一个负载端口，从该对象从AGV传送对象。该方法包括以下步骤：在AGV与探测器之间进行通信，以确定与负载端口之间传送物体的相应定时; 并且经由装载端口在AGV和探测器之间传送对象，其中通过使用用于临时保持物体的保持位置，物体到/从装载端口的传送的定时彼此偏移。持有站点至少是AGV的组件和负载端口以外的探测器。

7. 发明授权

US07583096B2 Probing apparatus and probing method 失效
标题翻译：探测仪器和探测方法
公开(公告)号：US07583096B2
公开(公告)日：2009-09-01
申请号：US11747559
申请日：2007-05-11
申请人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
发明人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2893
摘要： There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.
摘要翻译：提供了一种探测装置，其能够将具有单个装载端口的现有探测装置修改为具有双重加载端口的探测装置，同时节省空间而不增加其脚印，并且还能够通过与自动传送线协作来提高检查效率，该装置具有单个装载口。探测装置包括探测室，其中检查晶片，并且装载器室具有：第一和第二装载端口，定位成在探测室侧面彼此间隔开，其中每个装载端口安装在其上在其中容纳多个水的盒; 以及用于在装载端口和探测室之间传送晶片的晶片传送单元。装载端口沿着通过自动传送装置传送盒的路线布置。

8. 发明授权

US07153087B2 Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method 失效
公开(公告)号：US07153087B2
公开(公告)日：2006-12-26
申请号：US10351088
申请日：2003-01-27
申请人： Ki Sang Kang , Shuji Akiyama , Hiroki Hosaka
发明人： Ki Sang Kang , Shuji Akiyama , Hiroki Hosaka
IPC分类号： B65G47/24
CPC分类号： H01L21/68 , H01L21/67259 , H01L21/68735 , Y10S414/136 , Y10S414/141 , Y10T279/26
摘要： A centering unit comprises a plate, centering mechanism, link mechanism, and cylinder mechanism. The plate vertically divides the interior of a frame. The support table is located substantially on the center of the plate. The centering mechanism can center each wafer on the support table. Centering plates of the centering mechanism are located on either side of the support table and have engaging surfaces and that extend along the outer peripheral surface of the wafer. The link mechanism and the cylinder mechanism serve to extend and contract the space between the centering plates.

9. 发明授权

US08149313B2 Photographic apparatus, setting method of photography conditions, and recording medium 有权
标题翻译：摄影装置，摄影条件的设定方法以及记录介质
公开(公告)号：US08149313B2
公开(公告)日：2012-04-03
申请号：US12473470
申请日：2009-05-28
申请人： Makoto Watanabe , Hiroki Hosaka , Yuichi Onumata
发明人： Makoto Watanabe , Hiroki Hosaka , Yuichi Onumata
IPC分类号： H04N5/222
CPC分类号： H04N5/23293 , H04N5/23219 , H04N5/23245
摘要： In a digital camera 1, when a shutter button is pressed halfway, then a photographic scene is evaluated until the shutter button is fully depressed, and based on automatic parameters corresponding to the evaluated photographic scene which are set, each portion is controlled in accordance with the set automatic parameters (Step S3). Furthermore, tags for manual setting corresponding to the photographic scene evaluated in Step S2 are superimposed on a live view image (Step S5). Whether a touch for any of the tags has been detected is determined (Step S9). If a touch has been detected, manual parameters corresponding to the touched tag in the automatic parameters stored in RAM in Step S3 are changed by one level and updated (Step S13). If the shutter key has been operated, still image photographic processing is performed with the parameters updated and stored in RAM in Step S13 (Step S23).
摘要翻译：在数码相机1中，当半按下快门按钮时，评估摄影场景，直到快门按钮被完全按下，并且基于与设定的评估的拍摄场景相对应的自动参数，每个部分根据设置自动参数（步骤S3）。此外，将与步骤S2中评估的拍摄场景相对应的手动设置的标签叠加在实时取景图像上（步骤S5）。确定是否检测到任何标签的触摸（步骤S9）。如果检测到触摸，则在步骤S3中存储在RAM中的自动参数中的触摸标签对应的手动参数被改变一级并被更新（步骤S13）。如果已经操作了快门键，则在步骤S13中随机更新并存储在RAM中执行静止图像拍摄处理（步骤S23）。

10. 外观设计

USD571740S1 Semiconductor wafer delivery apparatus 有权
公开(公告)号：USD571740S1
公开(公告)日：2008-06-24
申请号：US29242546
申请日：2005-11-14
申请人： Hiroki Hosaka
设计人： Hiroki Hosaka

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