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1. 发明授权

US07153087B2 Centering mechanism, centering unit, semiconductor manufacturing apparatus, and centering method 失效
公开(公告)号：US07153087B2
公开(公告)日：2006-12-26
申请号：US10351088
申请日：2003-01-27
申请人： Ki Sang Kang , Shuji Akiyama , Hiroki Hosaka
发明人： Ki Sang Kang , Shuji Akiyama , Hiroki Hosaka
IPC分类号： B65G47/24
CPC分类号： H01L21/68 , H01L21/67259 , H01L21/68735 , Y10S414/136 , Y10S414/141 , Y10T279/26
摘要： A centering unit comprises a plate, centering mechanism, link mechanism, and cylinder mechanism. The plate vertically divides the interior of a frame. The support table is located substantially on the center of the plate. The centering mechanism can center each wafer on the support table. Centering plates of the centering mechanism are located on either side of the support table and have engaging surfaces and that extend along the outer peripheral surface of the wafer. The link mechanism and the cylinder mechanism serve to extend and contract the space between the centering plates.

2. 外观设计

USD592230S1 Wafer carrying-in/out machine 有权
标题翻译：晶圆进/出机
公开(公告)号：USD592230S1
公开(公告)日：2009-05-12
申请号：US29297744
申请日：2007-11-16
申请人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
设计人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane

3. 发明授权

US07457680B2 Conveyance method for transporting objects 失效
标题翻译：输送物体运输方式
公开(公告)号：US07457680B2
公开(公告)日：2008-11-25
申请号：US11550433
申请日：2006-10-18
申请人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
发明人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
IPC分类号： G06F19/00 , G06F7/00 , G05B19/18
CPC分类号： H01L21/67276 , H01L21/67775 , H01L21/67778 , Y10S414/135
摘要： The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.
摘要翻译：本发明涉及用于在自动传送装置（AGV）和半导体制造装置（探测器）之间传送多个未处理物体的传送方法。探测器具有一个负载端口，从该对象从AGV传送对象。该方法包括以下步骤：在AGV与探测器之间进行通信，以确定与负载端口之间传送物体的相应定时; 并且经由装载端口在AGV和探测器之间传送对象，其中通过使用用于临时保持物体的保持位置，物体到/从装载端口的传送的定时彼此偏移。持有站点至少是AGV的组件和负载端口以外的探测器。

4. 发明授权

US5801527A Apparatus and method for testing semiconductor device 失效
标题翻译：半导体器件测试装置及方法
公开(公告)号：US5801527A
公开(公告)日：1998-09-01
申请号：US506819
申请日：1995-07-25
申请人： Takao Ishii , Shuji Akiyama , Hiroki Hosaka
发明人： Takao Ishii , Shuji Akiyama , Hiroki Hosaka
IPC分类号： G01R31/01 , G01R31/28 , G01R31/02
CPC分类号： G01R31/2893 , G01R31/01 , G01R31/2851
摘要： A tester apparatus comprising a loader/unloader unit including a loader section for carrying a device, which have been carried to a carry-in section to a device-charging and -aligning section, and an unloader section for carrying device, which have been tested, from a device-discharging and -aligning section to a carry-out section, and a tester unit including carrier for carrying devices, which have been aligned at the device-charging and -aligning section, to a test position while carrying device, which have been tested, from the test position to a device-discharging and -aligning section, and a test section for electrically testing device at the test position to find whether the device is good or fault ones, wherein the tester unit is detachably connected to the loader/unloader unit.
摘要翻译：一种测试仪装置，包括装载机/卸载机单元，该装载机/卸载机单元包括用于承载装置的装载部分，其已经被运送到装置充电和对准部分的进入部分，以及已经被测试的载运装置的卸载部分，从装置放电和对准部分到执行部分，以及包括已经在装置充电和对准部分对准的运载装置的载体的测试器单元到达运送装置的测试位置，已经从测试位置到装置放电和对准部分进行了测试，以及在测试位置处用于电测试装置的测试部分，以确定装置是好还是故障装置，其中测试器单元可拆卸地连接到装载机/卸载机组。

5. 发明申请

US20070264104A1 PROCESSING APPARATUS 有权
标题翻译：加工设备
公开(公告)号：US20070264104A1
公开(公告)日：2007-11-15
申请号：US11747646
申请日：2007-05-11
申请人： Hiroki HOSAKA , Shuji Akiyama , Tadashi Obikane
发明人： Hiroki HOSAKA , Shuji Akiyama , Tadashi Obikane
IPC分类号： B65G25/00 , B66C17/08
CPC分类号： H01L21/67775 , H01L21/67265 , H01L21/67766 , H01L21/68 , Y10S414/139
摘要： There is provided a processing apparatus capable of modifying an existing processing apparatus having a single loading port to one having dual loading ports by providing an additional loading port without increasing a foot print thereof and also capable of realizing a complete automation of a wafer transfer by utilizing an existing automatic transfer line. The processing apparatus includes a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon waters; a sub-chuck, disposed under the second loading port, for positioning the wafers; and a wafer transfer unit having a transfer arm for transferring the wafers between the sub-chuck and the prober chamber, the transfer arm being rotatable and movable vertically.
摘要翻译：提供了一种处理装置，其能够通过提供附加的加载端口而将具有单一加载端口的现有处理装置修改为具有双加载端口的处理装置，而不增加其脚印，并且还能够通过利用来实现晶片传送的完全自动化现有的自动传输线。所述加工设备包括装载室，所述装载室具有：第一和第二装载端口，其定位成在探测室侧面彼此间隔开，每个装载端口安装在水面上; 设置在所述第二装载口下方的用于定位所述晶片的副卡盘; 以及晶片转印单元，其具有用于在子卡盘和检测室之间传送晶片的转移臂，所述转移臂可旋转并可垂直移动。

6. 发明授权

US07283890B2 Work convey system, unmanned convey vehicle system, unmanned convey vehicle, and work convey method 失效
标题翻译：工作传送系统，无人驾驶车辆系统，无人驾驶车辆和工作传送方式
公开(公告)号：US07283890B2
公开(公告)日：2007-10-16
申请号：US10485969
申请日：2002-12-27
申请人： Toshihiko Iijima , Shuji Akiyama , Hiroki Hosaka , Takashi Nakao
发明人： Toshihiko Iijima , Shuji Akiyama , Hiroki Hosaka , Takashi Nakao
IPC分类号： G06F7/00
CPC分类号： H01L21/67763 , G05B19/41865 , G05B2219/31429 , G05B2219/32107 , G05B2219/32252 , G05B2219/32283 , G05B2219/45031 , G06Q10/06 , H01L21/67754 , Y02P90/08 , Y02P90/20
摘要： There is a jump in the number of devices formed on a single wafer, and it takes a lot of time to inspect a single wafer. In addition, if wafers are inspected every lot, detected wafers remain in staying in a prober until the inspection of all of the wafers is completed. Therefore, the time required to transfer the wafers of each lot to the subsequent step is delayed. As a result, it is difficult to shorten TAT (Turn-Around-Time), and it is difficult to flexibly operate the prober.A transfer system E according to the present invention includes: a host computer 1; a plurality of probers 2 under the control of the host computer 1; a plurality of RGVs 4 for delivering a wafer W to each of the probers 2, one by one, at its request; and a transfer operating unit 5, associated with the host computer, for operating the RGVs 4. The transfer operating unit 5 has a scheduler 54A and a dispatcher 54B, for preparing an operating schedule for each of the RGVs 4 on the basis of the relationship in position between each of the probers 2 and each of the RGVs 4, and for determining optimum transfer paths for the RGVs 4, to assign a corresponding one of the RGVs 4 to a corresponding one of the optimum transfer paths.
摘要翻译：在单个晶片上形成的器件数量有所跳跃，检查单个晶片花费大量时间。另外，如果每批次检查晶片，检测到的晶片保留在探针中，直到完成所有晶片的检查。因此，将每个批次的晶片转移到随后的步骤所需的时间被延迟。因此，难以缩短TAT（周转时间），难以灵活操作探测器。根据本发明的传送系统E包括：主计算机1; 在主计算机1的控制下的多个探测器2; 多个RGV4，用于根据要求一个接一个地将晶片W传送到每个探测器2; 以及与主计算机相关联的用于操作RGV 4的传送操作单元5。传送操作单元5具有调度器54A和调度器54B，用于根据每个探测器2和每个RGV 4之间的位置关系来准备每个RGV4的操作时间表，并且为了确定RGV4的最佳传输路径，以将RGV4中的相应一个分配给最佳传输路径中的相应一个。

7. 发明授权

US08310261B2 Probing apparatus and probing method 失效
标题翻译：探测仪器和探测方法
公开(公告)号：US08310261B2
公开(公告)日：2012-11-13
申请号：US12488186
申请日：2009-06-19
申请人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
发明人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
IPC分类号： G01R31/20 , G01R31/10
CPC分类号： G01R31/2893
摘要： There is provided a probing apparatus capable of modifying an existing probing apparatus having a single loading port to one having dual loading ports while saving the space without increasing a foot print thereof and also capable of increasing an inspection efficiency by cooperating with an automatic transfer line for the apparatus having a single loading port. The probing apparatus includes a prober chamber in which a wafer is inspected and a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon a cassette accommodating therein a plurality of waters; and a wafer transfer unit for transferring the wafers between the loading ports and the prober chamber. The loading ports are arranged along a route where the cassette is transferred by an automatic transfer device.
摘要翻译：提供了一种探测装置，其能够将具有单个装载端口的现有探测装置修改为具有双重加载端口的探测装置，同时节省空间而不增加其脚印，并且还能够通过与自动传送线协作来提高检查效率，该装置具有单个装载口。探测装置包括探测室，其中检查晶片，并且装载器室具有：第一和第二装载端口，定位成在探测室侧面彼此间隔开，其中每个装载端口安装在其上在其中容纳多个水的盒; 以及用于在装载端口和探测室之间传送晶片的晶片传送单元。装载端口沿着通过自动传送装置传送盒的路线布置。

8. 发明授权

US07887280B2 Processing apparatus 有权
标题翻译：处理装置
公开(公告)号：US07887280B2
公开(公告)日：2011-02-15
申请号：US11747646
申请日：2007-05-11
申请人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
发明人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
IPC分类号： G01R31/28
CPC分类号： H01L21/67775 , H01L21/67265 , H01L21/67766 , H01L21/68 , Y10S414/139
摘要： There is provided a processing apparatus capable of modifying an existing processing apparatus having a single loading port to one having dual loading ports by providing an additional loading port without increasing a foot print thereof and also capable of realizing a complete automation of a wafer transfer by utilizing an existing automatic transfer line. The processing apparatus includes a loader chamber having: a first and a second loading ports positioned to be spaced apart from each other at the side of a prober chamber, each of the loading ports mounting thereon waters; a sub-chuck, disposed under the second loading port, for positioning the wafers; and a wafer transfer unit having a transfer arm for transferring the wafers between the sub-chuck and the prober chamber, the transfer arm being rotatable and movable vertically.
摘要翻译：提供了一种处理装置，其能够通过提供附加的加载端口而将具有单一加载端口的现有处理装置修改为具有双加载端口的处理装置，而不增加其脚印，并且还能够通过利用来实现晶片传送的完全自动化现有的自动传输线。所述加工设备包括装载室，所述装载室具有：第一和第二装载端口，其定位成在探测室侧面彼此间隔开，每个装载端口安装在水面上; 设置在所述第二装载口下方的用于定位所述晶片的副卡盘; 以及晶片转印单元，其具有用于在子卡盘和检测室之间传送晶片的转移臂，所述转移臂可旋转并可垂直移动。

9. 外观设计

USD607424S1 Wafer carrying-in/out apparatus 有权
标题翻译：晶圆进/出装置
公开(公告)号：USD607424S1
公开(公告)日：2010-01-05
申请号：US29266907
申请日：2006-10-02
申请人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane
设计人： Hiroki Hosaka , Shuji Akiyama , Tadashi Obikane

10. 发明申请

US20070150085A1 CONVEYANCE METHOD FOR TRANSPORTING OBJECTS 失效
标题翻译：运输对象的输送方法
公开(公告)号：US20070150085A1
公开(公告)日：2007-06-28
申请号：US11550433
申请日：2006-10-18
申请人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
发明人： Shuji Akiyama , Toshihiko Iijima , Hiroki Hosaka
IPC分类号： G06F19/00
CPC分类号： H01L21/67276 , H01L21/67775 , H01L21/67778 , Y10S414/135
摘要： The present invention relates to conveyance method for transporting a plurality of unprocessed/processed objects between an automatic transporting device (AGV) and a semiconductor manufacturing device (prober). The prober has a load port to/from which the objects are delivered from/to the AGV. The method comprises the steps of: making a communication between the AGV and the prober to decide respective timings of deliveries of the objects to/from the load port; and transporting the objects between the AGV and the prober via the load port, with the timings of the deliveries of the objects to/from the load port shifted from each other by using a holding site for provisionally holding the object. The holding site is at least one of components of the AGV and the prober other than the load port.
摘要翻译：本发明涉及用于在自动传送装置（AGV）和半导体制造装置（探测器）之间传送多个未处理物体的传送方法。探测器具有一个负载端口，从该对象从AGV传送对象。该方法包括以下步骤：在AGV与探测器之间进行通信，以确定与负载端口之间传送物体的相应定时; 并且经由装载端口在AGV和探测器之间传送对象，其中通过使用用于临时保持物体的保持位置，物体到/从装载端口的传送的定时彼此偏移。持有站点至少是AGV的组件和负载端口以外的探测器。

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