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    • 1. 发明授权
    • Substrate transfer apparatus and method, and storage medium
    • 基板转印装置和方法以及存储介质
    • US07458469B2
    • 2008-12-02
    • US11227136
    • 2005-09-16
    • Hiroki HosakaToshihiko IijimaShinya Shimizu
    • Hiroki HosakaToshihiko IijimaShinya Shimizu
    • B65G49/07
    • H01L21/67309Y10S414/137
    • In a substrate transfer apparatus, an adaptor unit 25 includes a box-shaped main body 40 having three open sides; and a plurality of stage arms 41 disposed in the main body 40, serving as substrate mounting members. Each of the stage arms 41 has a disc-shaped wafer supporting portion 411 disposed at an approximately central portion of the main body 40 and a flat body 412 disposed in the main body 40 so as not to interfere with the moving paths of transfer arms 241 and 341. Formed at a connecting portion of the wafer supporting portion 411 and the body 412 are cutout portions 413 for preventing interference between the stage arms 41 and two prongs of leading end portions of the transfer arms 241 and 341 introduced into the main body 40.
    • 在基板输送装置中,适配器单元25包括具有三个开口侧的箱形主体40; 以及设置在主体40中的用作基板安装构件的多个平台臂41。 每个平台臂41具有设置在主体40的大致中央部的盘状晶片支撑部411和设置在主体40中的平坦体412,以便不干涉传送臂241的移动路径 在晶片支撑部分411和主体412的连接部分处形成切口部分413,用于防止台臂41与引入主体40的转移臂241和341的前端部分的两个尖头之间的干涉 。
    • 2. 发明申请
    • Substrate transfer apparatus and method, and storage medium
    • 基板转印装置和方法以及存储介质
    • US20070031222A1
    • 2007-02-08
    • US11227136
    • 2005-09-16
    • Hiroki HosakaToshihiko IijimaShinya Shimizu
    • Hiroki HosakaToshihiko IijimaShinya Shimizu
    • B65B69/00
    • H01L21/67309Y10S414/137
    • In a substrate transfer apparatus, an adaptor unit 25 includes a box-shaped main body 40 having three open sides; and a plurality of stage arms 41 disposed in the main body 40, serving as substrate mounting members. Each of the stage arms 41 has a disc-shaped wafer supporting portion 411 disposed at an approximately central portion of the main body 40 and a flat body 412 disposed in the main body 40 so as not to interfere with the moving paths of transfer arms 241 and 341. Formed at a connecting portion of the wafer supporting portion 411 and the body 412 are cutout portions 413 for preventing interference between the stage arms 41 and two prongs of leading end portions of the transfer arms 241 and 341 introduced into the main body 40.
    • 在基板输送装置中,适配器单元25包括具有三个开口侧的箱形主体40; 以及设置在主体40中的用作基板安装构件的多个平台臂41。 每个平台臂41具有设置在主体40的大致中央部的盘状晶片支撑部411和设置在主体40中的平坦体412,以便不干涉传送臂241的移动路径 和341。 在晶片支撑部分411和主体412的连接部分处形成切口部分413,用于防止台臂41与引入主体40的转移臂241和341的前端部分的两个尖头之间的干涉。
    • 3. 发明授权
    • Substrate transfer system, substrate transfer apparatus and storage medium
    • 基板转印系统,基板转印装置和存储介质
    • US08121723B2
    • 2012-02-21
    • US11524280
    • 2006-09-21
    • Toshihiko IijimaShinya Shimizu
    • Toshihiko IijimaShinya Shimizu
    • G06F7/00
    • H01L21/6732H01L21/67276H01L21/67736
    • A substrate transfer system includes a substrate storing apparatus for storing therein one or more substrates; at least one substrate processing apparatus for performing a predetermined processing on the substrate; and a substrate transfer apparatus for transferring the substrate by moving between the substrate storing apparatus and the substrate processing apparatus, the substrate transfer apparatus including at least one substrate transfer unit for supporting the substrate, unloading the substrate from the substrate storing apparatus or the substrate processing apparatus, and loading the substrate into the substrate storing apparatus of the substrate processing apparatus. The substrate transfer apparatus moves while supporting the substrate by the substrate transfer unit.
    • 基板转印系统包括用于在其中存储一个或多个基板的基板存储装置; 至少一个基板处理装置,用于对所述基板执行预定处理; 以及基板转印装置,用于通过在基板收纳装置和基板处理装置之间移动来转印基板,基板转印装置包括至少一个用于支撑基板的基板转移单元,从基板存储装置卸载基板或基板处理 装置,并将基板装载到基板处理装置的基板存储装置中。 基板转印装置在通过基板转印单元支撑基板的同时移动。
    • 4. 发明授权
    • Transfer system and transfer method of object to be processed
    • 待处理对象的传送系统和传送方法
    • US07826918B2
    • 2010-11-02
    • US11374998
    • 2006-03-15
    • Toshihiko IijimaShinya ShimizuKaori Ishihara
    • Toshihiko IijimaShinya ShimizuKaori Ishihara
    • G06F7/00
    • H01L21/67736G01R31/2893G05B19/41815G05B2219/31002G05B2219/31216G05B2219/33198G05B2219/45031H01L21/67265Y02P90/08Y02P90/285Y10S414/135
    • A transfer method employs a transfer system including a semiconductor handling device and an automatic transfer device. The semiconductor handling device includes a first transfer mechanism and a first optically coupled parallel I/O communications interface. The automatic transfer device includes a second transfer mechanism and a second optically coupled parallel I/O communications interface. The transfer method includes a successive transfer notifying step wherein the automatic transfer device and the semiconductor handling device notify each other that a successive transfer is possible via an optical communications between the first and the second optically coupled parallel I/O communications interface in case where a plurality of objects to be processed are able to be successively transferred one by one between the first and the second transfer mechanism; and a successive transfer step wherein the objects are transferred one by one between the first and the second transfer mechanism.
    • 转印方法采用包括半导体处理装置和自动转印装置的转印系统。 半导体处理装置包括第一传送机构和第一光耦合并行I / O通信接口。 自动传送装置包括第二传送机构和第二光耦合并行I / O通信接口。 传送方法包括连续传送通知步骤,其中自动传送设备和半导体处理设备通过彼此通过第一和第二光耦合并行I / O通信接口之间的光通信可以进行连续的传送, 要处理的多个物体能够在第一和第二传送机构之间逐个地依次传送; 以及连续传送步骤,其中物体在第一和第二传送机构之间逐个传送。