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1. 发明授权

US06530276B2 Acceleration sensor and acceleration apparatus using acceleration sensor 失效
公开(公告)号：US06530276B2
公开(公告)日：2003-03-11
申请号：US10081635
申请日：2002-02-22
申请人： Hirofumi Tajika , Kazunari Nishihara , Koji Nomura , Motoyuki Taji , Yoshihiro Tomita
发明人： Hirofumi Tajika , Kazunari Nishihara , Koji Nomura , Motoyuki Taji , Yoshihiro Tomita
IPC分类号： G01P1509
CPC分类号： G01P1/023 , G01P1/02 , G01P15/0922
摘要： An acceleration sensor having a well controlled dispersion in the detection characteristics and improved detection characteristics in the low frequency detection comprises a first piezoelectric plate (11), a second piezoelectric plate (12) bonded to the first piezoelectric plate (11) by direct bonding, a first external electrode (13) provided on the main surface of the first piezoelectric plate (11) and a second external electrode (14) provided on the main surface of the second piezoelectric plate (12). The first piezoelectric plate (11) and the second piezoelectric plate (12) are bonded together with their polarization axes reversed to each other. Appearance of the acceleration sensor resembles to a letter “L” in the cross section; thickness of the supporting section (15) is greater than that of the rest part (free vibration section).

2. 发明授权

US06382026B1 Acceleration sensor and acceleration apparatus using acceleration sensor 有权
标题翻译：加速度传感器和使用加速度传感器的加速装置
公开(公告)号：US06382026B1
公开(公告)日：2002-05-07
申请号：US09463140
申请日：2000-04-12
申请人： Hirofumi Tajika , Kazunari Nishihara , Koji Nomura , Motoyuki Taji , Yoshihiro Tomita
发明人： Hirofumi Tajika , Kazunari Nishihara , Koji Nomura , Motoyuki Taji , Yoshihiro Tomita
IPC分类号： G01P1509
CPC分类号： G01P1/023 , G01P1/02 , G01P15/0922
摘要： An acceleration sensor having a well controlled dispersion in the detection, characteristics and improved detection characteristics in the low frequency detection comprises a first piezoelectric plate (11), a second piezoelectric plate (12) bonded to the first piezoelectric plate (11) by direct bonding, a first external electrode (13) provided on the main surface of the first piezoelectric plate (11) and a second external electrode (14) provided on the main surface of the second piezoelectric plate (12). The first piezoelectric plate (11) and the second piezoelectric plate (12) are bonded together with their polarization axes reversed to each other. Appearance of the acceleration sensor resembles to a letter “L” in the cross section; thickness of the supporting section (15) is greater than that of the rest part (free vibration section).
摘要翻译：具有在低频检测中的检测，特性和改进的检测特性中良好控制的色散的加速度传感器包括：第一压电板（11），通过直接接合结合到第一压电板（11）的第二压电板（12），设置在第一压电板（11）的主表面上的第一外部电极（13）和设置在第二压电板（12）的主表面上的第二外部电极（14）。第一压电板（11）和第二压电板（12）以它们的偏振轴彼此相反地接合在一起。加速度传感器的外观类似于截面中的字母“L”; 支撑部分（15）的厚度大于其余部分（自由振动部分）的厚度。

3. 发明申请

US20090238394A1 MICROPHONE AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：麦克风及其制造方法
公开(公告)号：US20090238394A1
公开(公告)日：2009-09-24
申请号：US12396010
申请日：2009-03-02
申请人： Masanori Minamio , Yoshihiro Tomita , Koji Nomura
发明人： Masanori Minamio , Yoshihiro Tomita , Koji Nomura
IPC分类号： H04R1/00 , H04R31/00
CPC分类号： H04R31/00 , Y10T29/49005
摘要： A microphone includes: a substrate including a tone hole and having a top surface on which a substrate electrode is provided; a converter provided on the top surface of the substrate and including a main body having a back space, a diaphragm provided at the bottom of the back space of the main body, and a converter electrode provided on a region of a bottom surface of the main body facing the substrate electrode; and a bump connecting the substrate electrode and the converter electrode to each other. The diaphragm vibrates in response to sound entering from the tone hole. The converter converts sound into a signal.
摘要翻译：麦克风包括：包括音孔并具有其上设置有基板电极的顶表面的基板; 设置在所述基板的上表面上的转换器，具有设置在所述主体的后部空间的底部的隔膜，设置在所述主体的后部空间的底部的隔膜以及设置在所述主体的底面的区域的转换电极身体面向衬底电极; 以及将基板电极和转换器电极彼此连接的凸块。响应于从音孔进入的声音，隔膜振动。转换器将声音转换为信号。

4. 发明授权

US08077900B2 Microphone and method for fabricating the same 有权
标题翻译：麦克风及其制造方法
公开(公告)号：US08077900B2
公开(公告)日：2011-12-13
申请号：US12396010
申请日：2009-03-02
申请人： Masanori Minamio , Yoshihiro Tomita , Koji Nomura
发明人： Masanori Minamio , Yoshihiro Tomita , Koji Nomura
IPC分类号： H04R11/04
CPC分类号： H04R31/00 , Y10T29/49005
摘要： A microphone includes: a substrate including a tone hole and having a top surface on which a substrate electrode is provided; a converter provided on the top surface of the substrate and including a main body having a back space, a diaphragm provided at the bottom of the back space of the main body, and a converter electrode provided on a region of a bottom surface of the main body facing the substrate electrode; and a bump connecting the substrate electrode and the converter electrode to each other. The diaphragm vibrates in response to sound entering from the tone hole. The converter converts sound into a signal.
摘要翻译：麦克风包括：包括音孔并具有其上设置有基板电极的顶表面的基板; 设置在所述基板的上表面上的转换器，具有设置在所述主体的后部空间的底部的隔膜，设置在所述主体的后部空间的底部的隔膜以及设置在所述主体的底面的区域的转换电极身体面向衬底电极; 以及将基板电极和转换器电极彼此连接的凸块。响应于从音孔进入的声音，隔膜振动。转换器将声音转换为信号。

5. 发明授权

US5021660A Pyroelectric infrared detector and driving method therefor 失效
标题翻译：热电红外探测器及其驱动方法
公开(公告)号：US5021660A
公开(公告)日：1991-06-04
申请号：US431176
申请日：1989-11-03
申请人： Yoshihiro Tomita , Ryoichi Takayama , Hisahito Ogawa , Koji Nomura , Junko Asayama , Atsushi Abe
发明人： Yoshihiro Tomita , Ryoichi Takayama , Hisahito Ogawa , Koji Nomura , Junko Asayama , Atsushi Abe
IPC分类号： G01J1/02 , G01J1/42 , G01J1/44 , G08B13/191
CPC分类号： G08B13/191
摘要： In a pyroelectric infrared detector, there is provided a member having a slit positioned in front of an array of pyroelectric elements, which interrupts an infrared image which is incident on the pyroelectric element array, and respective pyroelectric elements forming a row of the pyroelectric element array are wired so that they are connected in series electrically and adjacent pyroelectric element generate counter-electromotive forces. An infrared image irradiated on respective pyroelectric elements is scanned successively by the movement of the slit member along a row of the pyroelectric element array, thus obtaining information relating to an infrared intensity distribution from a heat source which emits IR rays which are being irradiated onto respective pyroelectric elements, from time series signals produced at both ends of the pyroelectric element array.

6. 发明申请

US20190099776A1 COMPRESSIBLE MEDIA APPLICATOR, APPLICATION SYSTEM AND METHODS FOR SAME 审中-公开
公开(公告)号：US20190099776A1
公开(公告)日：2019-04-04
申请号：US15720497
申请日：2017-09-29
申请人： Ken P. Hackenberg , Nachiket R. Raravikar , James C. Matayabas, JR. , Elizabeth Nofen , Nisha Ananthakrishnan , Manabu Nakagawasai , Yoshihiro Tomita
发明人： Ken P. Hackenberg , Nachiket R. Raravikar , James C. Matayabas, JR. , Elizabeth Nofen , Nisha Ananthakrishnan , Manabu Nakagawasai , Yoshihiro Tomita
IPC分类号： B05C5/02 , F16K21/18 , B05B1/02 , B05B1/30
摘要： A fluid applicator configured to apply a fluid to at least one substrate feature. The includes compressible reticulated media including an input interface configured for coupling with a fluid reservoir, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the applicator profile. The compressible reticulated media includes filling and dispensing configurations. In the dispensing configuration the substrate interface is configured for engagement with the at least one substrate feature, the compressible reticulated media is compressed, and according to the compression the fluid is applied across the feature profile. In the filling configuration the compressible reticulated media is configured for expansion relative to the dispensing configuration, and the fluid infiltrates the reticulations according to the expansion.

7. 发明申请

US20150270169A1 METHODS OF CONNECTING A FIRST ELECTRONIC PACKAGE TO A SECOND ELECTRONIC PACKAGE 有权
标题翻译：将第一电子包连接到第二电子包的方法
公开(公告)号：US20150270169A1
公开(公告)日：2015-09-24
申请号：US14219749
申请日：2014-03-19
申请人： Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
发明人： Chia-Pin Chiu , Kinya Ichikawa , Yoshihiro Tomita , Robert L. Sankman , Eric Li
IPC分类号： H01L21/768 , H01L21/56 , H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L25/50 , H01L21/4853 , H01L21/565 , H01L23/3121 , H01L23/49811 , H01L24/03 , H01L24/11 , H01L24/81 , H01L25/0657 , H01L25/105 , H01L2224/16227 , H01L2224/48227 , H01L2224/81801 , H01L2225/06517 , H01L2225/06548 , H01L2225/06555 , H01L2225/1023 , H01L2225/1058 , H01L2225/1082 , H01L2924/01029 , H01L2924/06 , H01L2924/15311 , H01L2924/15321 , H01L2924/1815 , H01L2924/381
摘要： A method of fabricating an electronic package. The method includes filling a mold with an electric conductor to form a number of electrical interconnects within the mold. The mold includes openings that are filled with several electric conductors to form a number of electrical interconnects. The method of fabricating an electronic package further includes attaching the mold to a substrate such that the electrical interconnects engage electrical contacts on the substrate. The method of fabricating an electronic package may further include forming conductive pads on the electrical insulator that engage the electrical interconnects and attaching a die to the substrate such that the die is electrically connected to at least some of the electrical interconnects.
摘要翻译：一种制造电子封装的方法。该方法包括用电导体填充模具以在模具内形成多个电互连。模具包括填充有多个电导体以形成多个电互连的开口。制造电子封装的方法还包括将模具附接到基板，使得电互连件接合基板上的电触点。制造电子封装的方法还可以包括在电绝缘体上形成接合电互连并将管芯连接到衬底上的导电焊盘，使得管芯电连接到至少一些电互连。

8. 发明申请

US20130122656A1 FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装上的柔性互连图案
公开(公告)号：US20130122656A1
公开(公告)日：2013-05-16
申请号：US13734861
申请日：2013-01-04
申请人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
发明人： Yoshihiro Tomita , David Chau , Gregory M. Chrysler , Devendra Natekar
IPC分类号： H01L21/768
CPC分类号： H01L21/4867 , H01L21/563 , H01L23/3675 , H01L23/42 , H01L23/5389 , H01L24/24 , H01L2223/6677 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2224/73259 , H01L2224/73267 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/1423 , H01L2924/15311 , H01L2924/16152 , H01L2924/351 , H01L2924/00
摘要： An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.
摘要翻译：本发明的一个实施例是制造金属互连的技术。将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。设备安装在第一个金属轨迹上。当封装电源时，该设备从基板接收电力。

9. 发明授权

US08387240B2 Methods for making multi-chip packaging using an interposer 有权
标题翻译：使用插入片进行多芯片封装的方法
公开(公告)号：US08387240B2
公开(公告)日：2013-03-05
申请号：US12955816
申请日：2010-11-29
申请人： Sriram Muthukumar , Raul Mancera , Yoshihiro Tomita , Chi-won Hwang
发明人： Sriram Muthukumar , Raul Mancera , Yoshihiro Tomita , Chi-won Hwang
IPC分类号： H01K3/10
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/147 , H01L25/0655 , H01L2224/81203 , H01L2224/81815 , H01L2924/10253 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49163 , Y10T29/49165 , H01L2924/00
摘要： In one embodiment, a method includes forming a plurality of vias partially through a body, the vias including sidewalls defined by the body. An electrically insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed on the insulating layer in the vias and on the upper surface, the electrically conductive layer defining first metal pads on the upper surface and second metal pads in contact with the first metal pads, the second metal pads having a denser pitch than the first metal pads. A dielectric layer is formed between adjacent first metal pads and between adjacent second metal pads. The body is thinned through a lower surface and the electrically insulating layer in the vias is exposed. After the thinning, a portion of the electrically insulating layer in the, vias is removed. The body is coupled to a substrate.
摘要翻译：在一个实施例中，一种方法包括通过主体部分地形成多个通孔，通孔包括由身体限定的侧壁。电绝缘层形成在主体的侧壁和上表面上。在通孔和上表面上的绝缘层上形成导电层，导电层限定上表面上的第一金属焊盘和与第一金属焊盘接触的第二金属焊盘，第二金属焊盘具有较密的间距比第一金属垫。在相邻的第一金属焊盘之间和相邻的第二金属焊盘之间形成介电层。身体通过下表面变薄，并且通孔中的电绝缘层被暴露。在变薄之后，去除通孔中的电绝缘层的一部分。主体耦合到基板。

10. 发明授权

US08354748B2 In-package microelectronic apparatus, and methods of using same 有权
标题翻译：包装内微电子装置及其使用方法
公开(公告)号：US08354748B2
公开(公告)日：2013-01-15
申请号：US13354708
申请日：2012-01-20
申请人： Sriram Dattaguru , Lesley A. Polka Wood , Yoshihiro Tomita , Kiniya Ichikawa , Robert L. Sankman
发明人： Sriram Dattaguru , Lesley A. Polka Wood , Yoshihiro Tomita , Kiniya Ichikawa , Robert L. Sankman
IPC分类号： H01L23/34 , H01L21/00 , H05K1/18
CPC分类号： H01L25/0657 , H01L23/5384 , H01L23/5389 , H01L24/48 , H01L24/82 , H01L25/18 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2225/06517 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01065 , H01L2924/14 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A mounting substrate for a processor includes a die side and a land side with a processor footprint configured on the die side. The processor footprint is coupled to at least one processor interconnect and a microelectronic die is embedded in the mounting substrate. The microelectronic die is coupled to the processor interconnect and communication between a processor to be installed on the processor footprint is in a rate between 10 Gb/s and 1 Tb/s.
摘要翻译：用于处理器的安装基板包括裸片侧和在裸片侧配置有处理器占位面的平台侧。处理器占用面积耦合到至少一个处理器互连，并且微电子管芯嵌入在安装衬底中。微电子管芯耦合到处理器互连，并且待处理器占用的处理器之间的通信速率在10Gb / s至1Tb / s之间。

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