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    • 7. 发明授权
    • Fluid ejection device and process for the production thereof
    • 流体喷射装置及其制造方法
    • US06554408B1
    • 2003-04-29
    • US09506751
    • 2000-02-18
    • Katsumasa MikiMasaya NakataniIsaku KannoRyoichi TakayamaKoji Nomura
    • Katsumasa MikiMasaya NakataniIsaku KannoRyoichi TakayamaKoji Nomura
    • B41J2045
    • B41J2/1623B41J2/14233B41J2/161B41J2/1628B41J2/1631B41J2/1632B41J2/1646B41J2002/14387
    • A fluid ejection device, such as for an ink jet printer or the like, having increased increasing nozzle density. A through-hole (15) is provided in a glass substrate (18) to which a second silicon substrate (19) is directly bonded to form an ink outlet (14). The first silicon substrate (17) is etched to form a pressure chamber (12), an ink channel (13) and an ink inlet (16), and bonded directly to the glass substrate (18). A piezoelectric thin film (11), having a conductive, elastic body (20), is bonded to the first substrate covering the pressure chamber (12). The elastic body (20) is sandwiched between the piezoelectric thin film (11) and a resin layer (25). The second substrate (19) has a thickness of less than about 0.8 mm in a range of thickness comprising about 1.2 to about 1.9 times (rg-rs), wherein rg is the diameter of the wide end of the through-hole (15) and rs is the diameter of the narrow end of the through-hole (15).
    • 诸如用于喷墨打印机等的流体喷射装置具有增加的喷嘴密度的增加。 在玻璃基板(18)上设置有通孔(15),第二硅基板(19)直接接合在该玻璃基板(18)上形成出墨口(14)。 蚀刻第一硅衬底(17)以形成压力室(12),墨水通道(13)和墨水入口(16),并直接粘合到玻璃基底(18)上。 具有导电弹性体(20)的压电薄膜(11)与覆盖压力室(12)的第一基板接合。 弹性体(20)夹在压电薄膜(11)和树脂层(25)之间。 第二基板(19)的厚度小于约0.8mm,其厚度范围为约1.2至约1.9倍(rg-rs),其中rg是通孔(15)的宽端的直径, 并且rs是通孔(15)的窄端的直径。