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    • 5. 发明授权
    • Method for forming a silicide region
    • 硅化物区域的形成方法
    • US6054387A
    • 2000-04-25
    • US927696
    • 1997-09-11
    • Yukio Fukuda
    • Yukio Fukuda
    • H01L21/28H01L21/285H01L21/3205H01L21/336
    • H01L29/665H01L21/28052H01L21/28518H01L21/32053
    • A method of forming a suicide layer 12 is disclosed herein. In one embodiment, a refractory metal (e.g., titanium) layer 20 is formed over a silicon (e.g., polysilicon) layer 10. The silicon layer 10 and the titanium layer 20 are then heated to a first temperature so that the silicon 10 and titanium 20 react to form a titanium silicide region 12. While applying an external force to warp the device, the titanium silicide region 12 is heated to a second temperature. This second temperature is higher than the first temperature. In one embodiment, this two-step heating process helps facilitate the transition from C49 phase TiSi.sub.2 to C54 phase TiSi.sub.2.
    • 本文公开了形成硅化物层12的方法。 在一个实施例中,在硅(例如,多晶硅)层10上形成难熔金属(例如,钛)层20.然后将硅层10和钛层20加热至第一温度,使得硅10和钛 20反应以形成硅化钛区域12.当施加外力来扭曲器件时,硅化钛区域12被加热到第二温度。 该第二温度高于第一温度。 在一个实施方案中,该两步加热方法有助于促进从C49相TiSi 2向C 54相TiSi 2的转变。