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1. 发明授权

US5681888A Polyetherketone resin compositions and carries for processing and treating semiconductor wafers 失效
标题翻译：聚醚酮树脂组合物，用于处理和处理半导体晶片
公开(公告)号：US5681888A
公开(公告)日：1997-10-28
申请号：US582340
申请日：1996-01-19
申请人： Hideo Nomura , Tadayasu Kobayashi , Mitsuo Maeda , Kuniaki Asai
发明人： Hideo Nomura , Tadayasu Kobayashi , Mitsuo Maeda , Kuniaki Asai
IPC分类号： C08L67/00 , C08L71/00 , H01L21/673 , C08K3/04
CPC分类号： C08L71/00 , C08L67/00
摘要： A polyetherketone resin composition comprising 5-100 parts by weight of a carbon fiber having an average fiber diameter of 5-20 .mu.m and an average fiber length of 30-500 .mu.m per 100 parts by weight of a composition comprising 95-50% by weight of a polyetherketone and 5-50% by weight of a liquid crystal polyester, and a carrier for processing or treating a semi-conductor wafer molded from the above polyetherketone resin composition. Said composition is excellent in molding properties and said carrier is excellent in stiffness, dimensional stability and antistatic properties. The above liquid crystal polyester includes, for example, those consisting of repeating structural units (I), (II), (III) and (IV), shown below, in a molar ratio (II)/(I) of 0.2-1.0, a molar ratio �(III)+(IV)!/(II) of 0.9-1.1 and a molar ratio (IV)/(III) of 0-1.0. ##STR1##
摘要翻译：一种聚醚酮树脂组合物，其包含5-100重量份平均纤维直径为5-20μm，平均纤维长度为30-500μm的碳纤维/ 100重量份的包含95-50％的5〜50重量％的液晶聚酯和由上述聚醚酮树脂组合物成型的半导体晶片的加工或处理用载体。所述组合物的成型性优异，所述载体的硬度，尺寸稳定性和抗静电性优异。上述液晶聚酯包括例如由以下所示的重复结构单元（I），（II），（III）和（IV））组成的摩尔比（II）/（I）为0.2-1.0 摩尔比[（III）+（IV）] /（II）为0.9-1.1，摩尔比（IV）/（III）为0-1.0。

2. 发明授权

US08692272B2 Resin composition, reflective board and light-emitting apparatus 有权
标题翻译：树脂组合物，反射板和发光装置
公开(公告)号：US08692272B2
公开(公告)日：2014-04-08
申请号：US13125348
申请日：2009-10-23
申请人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
发明人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
IPC分类号： H01L33/00
CPC分类号： C09K19/3809 , C08K3/013 , C08K3/22 , C08L67/03 , C09K19/52 , G02B5/0808 , H01L31/0232 , H01L33/60
摘要： The present invention provides a resin composition comprising a liquid crystal polyester and a titanium oxide filler, wherein when a value obtained by converting the content of aluminum in the titanium oxide filler to the content of aluminum oxide is A (% by weight) and the volume average particle diameter of the titanium oxide filler is B (μm), A and B satisfy the formula (I): A≧0.1 and the formula (II): A/B2≦25, a reflective board obtained by molding the resin composition, and a light-emitting apparatus comprising the reflective board and a light-emitting element. According to the resin composition of the present invention, a reflective board having high reflectance and high heat resistance can be obtained. Furthermore, a light-emitting apparatus which is excellent in properties such as luminance can be obtained by using the reflective board.
摘要翻译：本发明提供一种包含液晶聚酯和氧化钛填料的树脂组合物，其中当将氧化钛填料中的铝含量转化为氧化铝含量而获得的值为A（重量％）和体积氧化钛填料的平均粒径为B（μm），A和B满足式（I）：A≥0.1和式（II）：A / B2＆nlE; 25，通过模塑树脂组合物获得的反射板，以及包括反射板和发光元件的发光装置。根据本发明的树脂组合物，可以获得具有高反射率和高耐热性的反射板。此外，通过使用反射板可以获得诸如亮度等性质优异的发光装置。

3. 发明申请

US20140001678A1 METHOD FOR MANUFACTURING LIQUID CRYSTAL POLYESTER MOLDED BODIES 审中-公开
标题翻译：制造液晶聚酯模塑体的方法
公开(公告)号：US20140001678A1
公开(公告)日：2014-01-02
申请号：US14005468
申请日：2012-03-13
申请人： Tomoyuki Hara , Mitsuo Maeda , Yasuo Matsumi
发明人： Tomoyuki Hara , Mitsuo Maeda , Yasuo Matsumi
IPC分类号： B29C45/00
CPC分类号： B29C45/0001 , B29C45/60 , B29C48/362 , B29C48/52 , B29C48/53 , B29K2067/003
摘要： A method is provided for manufacturing a liquid crystal polyester molded body by molding a liquid crystal polyester composition using a molding machine containing a cylinder, a screw and a heater. The screw is provided inside the cylinder, and is composed of a feed section, a compression section, and a metering section, the feed section and the compression section of the screw are composed of a single flight, the heater is provided on the outer periphery of the cylinder. The liquid crystal polyester composition contains a liquid crystal polyester and a polyamide resin. The method for manufacturing the polyester molded body includes: a step of melting and metering the liquid crystal polyester composition, a step of tightening a mold and performing mold clamping, a step of injecting the melted liquid crystal polyester composition into the mold, and a step of extracting the solidified resin from inside the mold.
摘要翻译：提供一种通过使用含有圆筒，螺杆和加热器的成型机成型液晶聚酯组合物来制造液晶聚酯成型体的方法。螺杆设置在气缸内部，由进给部，压缩部和计量部构成，螺杆的进给部和压缩部由单个飞行构成，加热器设置在外周的气缸。液晶聚酯组合物含有液晶聚酯和聚酰胺树脂。聚酯成型体的制造方法包括：熔融并计量液晶聚酯组合物的步骤，将模具拉紧并进行合模的步骤，将熔融的液晶聚酯组合物注入到模具中的步骤，以及步骤从模具内部提取固化树脂。

4. 发明申请

US20110204406A1 RESIN COMPOSITION, REFLECTIVE BOARD AND LIGHT-EMITTING APPARATUS 有权
标题翻译：树脂组合物，反光板和发光装置
公开(公告)号：US20110204406A1
公开(公告)日：2011-08-25
申请号：US13125348
申请日：2009-10-23
申请人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
发明人： Yasuo Matsumi , Mitsuo Maeda , Shintaro Saito
IPC分类号： H01L33/60 , C08L67/00 , C08K3/22
CPC分类号： C09K19/3809 , C08K3/013 , C08K3/22 , C08L67/03 , C09K19/52 , G02B5/0808 , H01L31/0232 , H01L33/60
摘要： The present invention provides a resin composition comprising a liquid crystal polyester and a titanium oxide filler, wherein when a value obtained by converting the content of aluminum in the titanium oxide filler to the content of aluminum oxide is A (% by weight) and the volume average particle diameter of the titanium oxide filler is B (μm), A and B satisfy the formula (I): A≧0.1 and the formula (II): A/B2≦25, a reflective board obtained by molding the resin composition, and a light-emitting apparatus comprising the reflective board and a light-emitting element. According to the resin composition of the present invention, a reflective board having high reflectance and high heat resistance can be obtained. Furthermore, a light-emitting apparatus which is excellent in properties such as luminance can be obtained by using the reflective board.
摘要翻译：本发明提供一种包含液晶聚酯和氧化钛填料的树脂组合物，其中当将氧化钛填料中的铝含量转化为氧化铝含量而获得的值为A（重量％）和体积氧化钛填料的平均粒径为B（μm），A和B满足式（I）：A≥0.1和式（II）：A / B2＆nlE; 25，通过模塑树脂组合物获得的反射板，以及包括反射板和发光元件的发光装置。根据本发明的树脂组合物，可以获得具有高反射率和高耐热性的反射板。此外，通过使用反射板可以获得诸如亮度等性质优异的发光装置。

5. 发明申请

US20100044844A1 LEAD FRAME, RESIN PACKAGE, SEMICONDUCTOR DEVICE AND RESIN PACKAGE MANUFACTURING METHOD 有权
标题翻译：引线框架，树脂包装，半导体器件和树脂包装制造方法
公开(公告)号：US20100044844A1
公开(公告)日：2010-02-25
申请号：US12545176
申请日：2009-08-21
申请人： Yasuo Matsumi , Mitsuo Maeda
发明人： Yasuo Matsumi , Mitsuo Maeda
IPC分类号： H01L23/495 , H01L21/56
CPC分类号： H01L23/49565 , H01L21/565 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H01L2924/181 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1
摘要翻译：压力损失部H1（H2）从与树脂封装的角部对应的位置延伸，S1是与树脂流动方向（X轴）垂直的压力损失部H1（H2）的开口面积的最小值）在树脂成型期间的压力损失部H1（H2）中，S2是在多余的树脂容器H3〜H5内与树脂流动方向（Y轴）垂直的多余的树脂容器H3〜H5的开口面积的平均值成型。在该引线框中，满足S1

6. 发明申请

US20070225420A1 Granule useful for highly thermal-conductive resin composition 审中-公开
标题翻译：颗粒可用于高导热性树脂组合物
公开(公告)号：US20070225420A1
公开(公告)日：2007-09-27
申请号：US11723439
申请日：2007-03-20
申请人： Shintaro Komatsu , Mitsuo Maeda
发明人： Shintaro Komatsu , Mitsuo Maeda
IPC分类号： C04B26/06
CPC分类号： C04B20/0016 , C04B26/10 , C04B26/18 , C04B2111/90 , Y10T428/2982 , C04B14/386 , C04B14/4625 , C04B24/40
摘要： Granules useful for highly thermal-conductive resin composition are provided. The Granules have a number average particle diameter of 0.5 to 5 mm, obtained by granulating fibers mainly containing fibers selected from alumina fibers and carbon fibers, wherein the fibers to be granulated have a number average fiber diameter of 1 to 50 μm.
摘要翻译：提供了用于高导热性树脂组合物的颗粒。颗粒的数均粒径为0.5〜5mm，通过将主要含有选自氧化铝纤维和碳纤维的纤维的纤维造粒得到，其中待粒化的纤维的数均纤维直径为1〜50μm。

7. 发明申请

US20070057236A1 Conductive resin composition and the use thereof 审中-公开
标题翻译：导电树脂组合物及其用途
公开(公告)号：US20070057236A1
公开(公告)日：2007-03-15
申请号：US11483673
申请日：2006-07-11
申请人： Tomoya Hosoda , Satoshi Okamoto , Mitsuo Maeda
发明人： Tomoya Hosoda , Satoshi Okamoto , Mitsuo Maeda
IPC分类号： H01B1/12
CPC分类号： H01B1/24 , H01M8/0221 , H01M8/0226 , H01M8/0232
摘要： The present invention provides a conductive resin composition comprising a liquid crystalline polyester which comprises the following structure units having the formulas (i), (ii) and (iii), and has an aromatic group having 2,6-naphthalenediyl group in a ratio of not less than 5% by mole; and at least one filler selected from a metal oxide conductive filler and a carbon conductive filler. According to the present invention, the composition is easy to mold and can give molded products having high hydrolysis resistance. The resulting molded products are hardly to lower the strength even if they are exposed to high temperature and humid condition, and can be suitably used for a separator in a fuel cell.
摘要翻译：本发明提供一种包含液晶聚酯的导电树脂组合物，其包含具有式（i），（ii）和（iii）的以下结构单元，并且具有2,6-萘二基的芳族基团，不低于5摩尔％和选自金属氧化物导电填料和碳导电填料的至少一种填料。根据本发明，组合物易于模塑，并且可以得到具有高耐水解性的模制品。所得到的成型体即使暴露在高温高湿条件下也难以降低强度，能够适合用于燃料电池中的隔膜。

8. 发明授权

US5130999A Laser device 失效
标题翻译：激光装置
公开(公告)号：US5130999A
公开(公告)日：1992-07-14
申请号：US623094
申请日：1990-12-06
申请人： Mitsuo Maeda , Kazuo Shimazaki
发明人： Mitsuo Maeda , Kazuo Shimazaki
IPC分类号： H01S3/04 , H01S3/042 , H01S3/093 , H01S5/022
CPC分类号： H01S3/0931 , H01S3/042 , H01S3/0407
摘要： It is an object of the present invention to provide A laser device of long life. In the laser device, light source is housed in transparent cooling vessel, and the vessel is filled with a cooling liquid which is circulated. The electrodes of the light source project out of the cooling vessel. Reflectors are provided outside the cooling vessel. The electrodes and the reflectors are out of contact with the cooling liquid.It is another object of the present invention to stabilize laser oscillation. A light source is housed in a first transparent cooling vessel. The first cooling vessel is filled with a first cooling liquid. A laser medium is housed in a second transparent cooling vessel. The second cooling vessel is filled with a second cooling liquid. A heat insulation layer is provided between the first and the second cooling vessels so that the first and the second cooling liquids are thermally insulated from each other.

9. 发明授权

US08298869B2 Resin package and production method thereof 有权
标题翻译：树脂包装及其制造方法
公开(公告)号：US08298869B2
公开(公告)日：2012-10-30
申请号：US12406997
申请日：2009-03-19
申请人： Mitsuo Maeda , Yasuo Matsumi
发明人： Mitsuo Maeda , Yasuo Matsumi
IPC分类号： H01L21/60
CPC分类号： H01L21/565 , H01L23/3121 , H01L23/3142 , H01L23/49861 , H01L23/49894 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/1461 , H01L2924/15747 , H01L2924/00 , H01L2224/4554
摘要： The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.
摘要翻译：根据本发明的树脂封装的制造方法包括通过氧化至少表面由铜制成的引线框架的表面来形成氧化铜层的工序，以及形成树脂封装主体的工序通过树脂成型封装使树脂附着在引线框架表面上的氧化铜层上，然后用酸性溶液除去规定区域的氧化铜层。

10. 发明授权

US08258209B2 Insulating resin composition and application thereof 有权
标题翻译：绝缘树脂组合物及其应用
公开(公告)号：US08258209B2
公开(公告)日：2012-09-04
申请号：US12230424
申请日：2008-08-28
申请人： Shintaro Komatsu , Mitsuo Maeda , Hiroshi Harada
发明人： Shintaro Komatsu , Mitsuo Maeda , Hiroshi Harada
IPC分类号： C08K3/22 , C08K7/04 , C08K7/18 , C08L101/00
CPC分类号： C08K7/08 , C08K3/14 , C08K7/06
摘要： The present invention provides a resin composition comprising: (A) a thermoplastic resin, (B) a granular material which has a number average particle diameter of 0.5 to 5 mm and is obtainable by granulating a fiber mainly having alumina with a number average fiber diameter of 1 to 50 μm, and (C) a filler composed of a material of which electric resistivity at 300 K is 102 Ωm or less. The resin composition can be molded into a molded article with electric insulation. The electric resistivity of the molded article has sufficient electric insulation in applications such as in electric and electronic parts.
摘要翻译：本发明提供一种树脂组合物，其包含：（A）热塑性树脂，（B）数均粒径为0.5〜5mm的粒状材料，其主要成分为具有数均纤维直径的氧化铝的纤维为1〜50μm，（C）由300K下的电阻率为102Ω·cm以下的材料构成的填料。树脂组合物可以模制成具有电绝缘性的模制品。模制品的电阻率在诸如电气和电子部件的应用中具有足够的电绝缘。

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