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    • 5. 发明授权
    • Component part mounting structure
    • 组件部件安装结构
    • US08821091B2
    • 2014-09-02
    • US13201636
    • 2010-01-14
    • Takahiro SatoShogo Akaba
    • Takahiro SatoShogo Akaba
    • F16B39/00B23P11/00B60R11/00B60R13/02F16B5/02F16B25/00
    • B60R13/02B60R11/00B60R2011/0052B60R2013/0287F16B5/02F16B25/00Y10T29/4978
    • A component part mounting structure for mounting a cup holder base (2) on a front surface (1a) of a side lining (1) of a vehicle by using a self-tapping screw (3), wherein the side lining (1) comprises a base portion (15) projecting from a rear surface (1b) of the side lining (1) and defining a space (16) in cooperation with the rear surface (1b), and a boss portion (17) projecting from the base portion and defining a through hole (18) opening out toward the space (16), characterized by that the cup holder base (2) is provided with a fastening seat (6) abutting the front surface (1a) of the side lining (1), and the self-tapping screw (3) is configured to be passed through the fastening seat (6) and side lining (1) from the side of the cup holder base (2), and engaged by the through hole (18) of the boss portion (17) at a free end thereof.
    • 一种用于通过使用自攻螺钉(3)将杯架基座(2)安装在车辆侧衬(1)的前表面(1a)上的部件安装结构,其中侧衬(1)包括 从所述侧衬(1)的后表面(1b)突出并且与所述后表面(1b)配合地限定空间(16)的基部(15),以及从所述基部 并且限定向所述空间(16)开口的通孔(18),其特征在于,所述杯架基座(2)设置有抵靠所述侧衬(1)的前表面(1a)的紧固座(6) ,并且所述自攻螺钉(3)构造成从所述杯架基座(2)的一侧穿过所述紧固座(6)和侧衬(1),并且通过所述通孔(18)与 凸台部分(17)在其自由端。
    • 10. 发明授权
    • Semiconductor light emitting device
    • 半导体发光器件
    • US08436395B2
    • 2013-05-07
    • US13405961
    • 2012-02-27
    • Takahiro SatoShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • Takahiro SatoShigeya KimuraTaisuke SatoToshihide ItoKoichi TachibanaShinya Nunoue
    • H01L33/36
    • H01L33/24H01L33/382H01L33/42
    • According to one embodiment, a semiconductor light emitting device includes a stacked structure unit, a transparent, p-side and n-side electrodes. The unit includes n-type semiconductor layer, a light emitting portion provided on a part of the n-type semiconductor layer and p-type semiconductor layer provided on the light emitting portion. The transparent electrode is provided on the p-type semiconductor layer. The p-side electrode is provided on the transparent electrode. The n-side electrode is provided on the n-type semiconductor layer. The transparent electrode has a hole provided between the n-side and p-side electrodes. A width of the hole along an axis perpendicular to an axis from the p-side electrode toward the n-side electrode is longer than widths of the n-side and p-side electrodes. A distance between the hole and the n-side electrode is not longer than a distance between the hole and the p-side electrode.
    • 根据一个实施例,半导体发光器件包括堆叠结构单元,透明的p侧和n侧电极。 该单元包括n型半导体层,设置在n型半导体层的一部分上的发光部分和设置在发光部分上的p型半导体层。 透明电极设置在p型半导体层上。 p侧电极设置在透明电极上。 n侧电极设置在n型半导体层上。 透明电极具有设置在n侧和p侧电极之间的孔。 沿着与p侧电极朝向n侧电极的轴垂直的轴的孔的宽度比n侧电极和p侧电极的宽度长。 孔和n侧电极之间的距离不大于孔和p侧电极之间的距离。