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1. 发明授权

US06180264B2 Soldered article 有权
标题翻译：焊接文章
公开(公告)号：US06180264B2
公开(公告)日：2001-01-30
申请号：US09396819
申请日：1999-09-14
申请人： Hidekiyo Takaoka , Kunihiko Hamada , Yu Tokuda
发明人： Hidekiyo Takaoka , Kunihiko Hamada , Yu Tokuda
IPC分类号： B32B1501
CPC分类号： C22C13/02 , B23K35/262 , Y10T428/12708 , Y10T428/12715
摘要： There is provided a soldered article comprising a component having a Cu conductor joined with a solder, wherein the solder comprises about 0.1 to 2.0% by weight of Cu, about 1.0 to 7.5% by weight of Bi, and the balance being Sn. By using the above described lead-free solder, the occurrence of leaching is suppressed during soldering, and the solderability and joining strength can be improved. Since the solder does not contain Ag, material cost can be reduced, thus enabling reductions in the cost of the entire soldered article.
摘要翻译：提供一种包含具有与焊料接合的Cu导体的部件的焊接制品，其中焊料包含约0.1至2.0重量％的Cu，约1.0至7.5重量％的Bi，余量为Sn。通过使用上述无铅焊料，在焊接时抑制浸出的发生，可以提高可焊性和接合强度。由于焊料不含有Ag，因此可以降低材料成本，从而能够降低整个焊接制品的成本。

2. 发明授权

US07276841B2 Thick film electrode and multilayer ceramic electronic device 有权
标题翻译：厚膜电极和多层陶瓷电子器件
公开(公告)号：US07276841B2
公开(公告)日：2007-10-02
申请号：US11426374
申请日：2006-06-26
申请人： Hidekiyo Takaoka , Satoshi Shindou , Satoru Noda , Kunihiko Hamada
发明人： Hidekiyo Takaoka , Satoshi Shindou , Satoru Noda , Kunihiko Hamada
IPC分类号： H01L41/08
CPC分类号： H01G4/232 , H01L41/0472
摘要： A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.
摘要翻译：多层陶瓷器件包括设置在包括内部电极的压电陶瓷体上的外部电极。外部电极是其中Ag网格整体地嵌入主要由Ag组成的涂膜中的烧结体。因此，即使长时间进行连续的动作，也可以得到耐久性和耐湿性等突出特性的多层陶瓷器件，而不会导致不良的导电性和导电性的降低。

3. 发明授权

US06703113B2 Pb-free solder composition and soldered article 有权
公开(公告)号：US06703113B2
公开(公告)日：2004-03-09
申请号：US09878818
申请日：2001-06-11
申请人： Hidekiyo Takaoka , Kunihiko Hamada
发明人： Hidekiyo Takaoka , Kunihiko Hamada
IPC分类号： B32B1500
CPC分类号： C22C12/00 , B23K35/264 , Y10T428/12681 , Y10T428/24917
摘要： Provided is a Pb-free solder composition having an excellent heat resistance which does not damage a glass substrate and parts on the substrate when the soldering is carried out on to an electrode pattern formed on the substrate. The Pb-free solder composition contains, for example, not less than about 90% by weight of Bi, from about 0.1% to 9.9% by weight of Ag and from about 0.1% to 3.0% by weight of Sb, based on the whole solder composition.

4. 发明申请

US20060232170A1 THICK FILM ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC DEVICE 有权
标题翻译：厚膜电极和多层陶瓷电子器件
公开(公告)号：US20060232170A1
公开(公告)日：2006-10-19
申请号：US11426374
申请日：2006-06-26
申请人： Hidekiyo Takaoka , Satoshi Shindou , Satoru Noda , Kunihiko Hamada
发明人： Hidekiyo Takaoka , Satoshi Shindou , Satoru Noda , Kunihiko Hamada
IPC分类号： H01L41/047
CPC分类号： H01G4/232 , H01L41/0472
摘要： A multilayer ceramic device includes an external electrode disposed on a piezoelectric ceramic body including internal electrodes. The external electrode is a sintered body in which an Ag grid is integrally embedded in a coating film primarily composed of Ag. Therefore, it is possible to obtain a multilayer ceramic device having outstanding properties, such as durability and moisture resistance, without leading to poor electrical continuity and a decrease in conductivity even when a continuous operation is performed for a prolonged period of time.
摘要翻译：多层陶瓷器件包括设置在包括内部电极的压电陶瓷体上的外部电极。外部电极是其中Ag网格整体地嵌入主要由Ag组成的涂膜中的烧结体。因此，即使长时间进行连续的动作，也可以得到耐久性和耐湿性等突出特性的多层陶瓷器件，而不会导致不良的导电性和导电性的降低。

5. 发明授权

US06614641B2 Ceramic electronic component 有权
公开(公告)号：US06614641B2
公开(公告)日：2003-09-02
申请号：US10117276
申请日：2002-04-08
申请人： Takayuki Kayatani , Hidekiyo Takaoka , Kunihiko Hamada
发明人： Takayuki Kayatani , Hidekiyo Takaoka , Kunihiko Hamada
IPC分类号： H01G412
CPC分类号： H01G4/228 , H01C1/144 , H01L23/4827 , H01L41/0477 , H01L2224/4847 , H01L2224/4918
摘要： A ceramic electronic component includes a ceramic body; terminal electrodes formed on the ceramic body; and lead terminals joined to the terminal electrodes with solder containing Sn. Each terminal electrode includes a first electrode layer formed on the ceramic body and a second electrode layer formed on the first electrode layer. The second electrode layer contains a conductive constituent containing at least Zn, Ag and/or Cu, and Sn. The Zn content in the second electrode layer is about 4% by weight or more in relation to 100% by weight of the conductive constituent and is within the solubility limit not forming AgZn and/or CuZn intermetallic compounds.

6. 发明授权

US5376596A Conductive paste 失效
标题翻译：导电胶
公开(公告)号：US5376596A
公开(公告)日：1994-12-27
申请号：US101921
申请日：1993-08-04
申请人： Yu Tokuda , Kunihiko Hamada
发明人： Yu Tokuda , Kunihiko Hamada
IPC分类号： C03C8/04 , C03C8/18
CPC分类号： C03C8/04 , C03C8/18 , Y10S428/901
摘要： A conductive paste contains at least a conductive powder and a glass frit. The glass frit includes 9.0 to 45.0 wt % of SiO.sub.2 and 1.0 to 18.5 wt % of CaO, the balance being ZnO, B.sub.2 O.sub.3 and Li.sub.2 O. The glass frit may contain not more than 6.0 wt % of Al.sub.2 O.sub.3 incorporated therein as additive.
摘要翻译：导电浆料至少含有导电粉末和玻璃料。玻璃料包含9.0〜45.0重量％的SiO 2和1.0〜18.5重量％的CaO，余量为ZnO，B 2 O 3和Li 2 O。玻璃料可以含有不超过6.0重量％的掺入其中的Al 2 O 3作为添加剂。

7. 发明授权

US06911138B2 Method for plating electrodes of ceramic chip electronic components 有权
标题翻译：陶瓷芯片电子部件电极电镀方法
公开(公告)号：US06911138B2
公开(公告)日：2005-06-28
申请号：US10243183
申请日：2002-09-13
申请人： Akihiro Motoki , Shoichi Higuchi , Yoshihiko Takano , Kunihiko Hamada
发明人： Akihiro Motoki , Shoichi Higuchi , Yoshihiko Takano , Kunihiko Hamada
IPC分类号： C25D3/32 , C25D7/00 , C25D7/12 , C25D17/16 , C25D3/60 , C25D3/30
CPC分类号： C25D7/12 , C25D3/32 , C25D17/16
摘要： A method for plating electrodes of ceramic chip electronic components includes performing electroplating in a plating bath. The plating bath contains tin (II) sulfamate, acting as a tin (II) salt; a complexing agent including at least one selected from the group consisting of citric acid, gluconic acid, pyrophosphoric acid, heptoic acid, malonic acid, malic acid, salts of these acids, and gluconic lactone; and a brightener including at least one surfactant having an HLB value of about 10 or more. The tin plating adhesion of the resulting ceramic chip electronic components can be limited to a certain level.
摘要翻译：陶瓷芯片电子部件的电极电镀方法包括在电镀液中进行电镀。电镀液含有锡（II）氨基磺酸盐，作为锡（II）盐; 包括选自柠檬酸，葡萄糖酸，焦磷酸，庚酸，丙二酸，苹果酸，这些酸的盐和葡萄糖酸内酯中的至少一种的络合剂; 以及包含HLB值为约10以上的至少一种表面活性剂的增白剂。所得到的陶瓷芯片电子部件的镀锡附着力可以限制在一定水平。

8. 发明授权

US5536293A Base metal composition for external electrode of multilayer electronic component 失效
标题翻译：多层电子元件外部电极基体金属组成
公开(公告)号：US5536293A
公开(公告)日：1996-07-16
申请号：US318186
申请日：1994-10-05
申请人： Mika Yamamoto , Masaki Fujiyama , Yukio Sanada , Kunihiko Hamada
发明人： Mika Yamamoto , Masaki Fujiyama , Yukio Sanada , Kunihiko Hamada
IPC分类号： H01B1/02 , C03C8/18 , C22C32/00 , H01B1/16 , H01G4/232 , H01L23/498 , C22C9/04
CPC分类号： H01G4/2325 , C03C8/18 , C22C32/0089 , H01B1/16 , H01L23/49883 , H01L2924/0002 , H01L2924/09701
摘要： A base metal composition for forming an external electrode of a multilayer electronic component contains 70 to 85 percent by weight of Cu, 2 to 10 percent by weight of glass frit and 10 to 28 percent by weight of an organic vehicle. The glass frit contains at least one of lead zinc borosilicate and zinc borosilicate, Ba-Si based glass, and Zn which is in a range of less than 10 percent by weight in terms of ZnO.
摘要翻译：用于形成多层电子部件的外部电极的贱金属组合物含有70〜85重量％的Cu，2〜10重量％的玻璃料和10〜28重量％的有机载体。玻璃料包含硼硅酸铅锌和硼硅酸锌，Ba-Si基玻璃和Zn中的至少一种，其以ZnO计小于10重量％的范围。

9. 发明授权

US5503726A Plating apparatus 失效
标题翻译：电镀装置
公开(公告)号：US5503726A
公开(公告)日：1996-04-02
申请号：US490143
申请日：1995-06-14
申请人： Kunihiko Hamada , Shigehiro Nojiri , Kazuma Tanaka , Tatsuya Todo
发明人： Kunihiko Hamada , Shigehiro Nojiri , Kazuma Tanaka , Tatsuya Todo
IPC分类号： C25D17/16 , C25D21/10
CPC分类号： C25D17/16
摘要： A plating apparatus (11) includes a plating solution container (13) storing a plating solution (14) and a cathode (18) dipped therein, for plating objects which are placed on the cathode (18) by driving an air cylinder (22) for applying vibration to the cathode (18) while making a stopper (24) collide with a forward end (21a) of a coupling member (21) which is coupled to the air cylinder (22) and the cathode (18) thereby applying an impact to the cathode (18).
摘要翻译：电镀设备（11）包括：电镀溶液容器（13），其存储浸入其中的电镀液（14）和阴极（18），用于通过驱动气缸（22）放置在阴极（18）上的电镀物体，用于在使制动器（24）与耦合到气缸（22）和阴极（18）的联接构件（21）的前端（21a）碰撞的同时向阴极（18）施加振动，从而施加对阴极（18）的影响。

10. 发明授权

US06424516B2 Conductive paste and ceramic electronic component 有权
标题翻译：导电胶和陶瓷电子元件
公开(公告)号：US06424516B2
公开(公告)日：2002-07-23
申请号：US09870552
申请日：2001-05-30
申请人： Kiyotaka Maegawa , Kunihiko Hamada
发明人： Kiyotaka Maegawa , Kunihiko Hamada
IPC分类号： H01G4008
CPC分类号： H01G4/232
摘要： A conductive paste capable of forming a terminal electrode in which sintering proceeds while the viscosity of the glass is maintained during the sintering of the conductive component, so that the softened glass is prevented from flowing into the interface between the ceramic element assembly and the terminal electrode or from flowing on the surface of the terminal electrode, and furthermore, sufficient glass remains in the cavity of the terminal electrode film, so that an excellent seal is provided against the penetration of the plating solution, and the so-called “adhesion defect” is prevented from occurring, is provided. In addition, a ceramic electronic component is provided. The conductive paste is composed of a conductive component containing at least one of Cu and Ni, a glass frit and an organic vehicle, in which the glass frit contains a crystallizable glass, and the sintering starting temperature of the conductive component is higher than the crystallization starting temperature of the crystallizable glass and lower than the remelting temperature of the crystallizable glass.
摘要翻译：一种能够形成端子电极的导电膏，其中在导电部件烧结期间保持玻璃的粘度的同时进行烧结，从而防止软化玻璃流入陶瓷元件组件和端子电极之间的界面或者在端子电极的表面上流动，此外，在端子电极膜的空腔中残留有足够的玻璃，从而对电镀液的渗透提供优异的密封，所谓的“粘附缺陷” 被防止发生。另外，提供陶瓷电子部件。导电性糊料由含有Cu和Ni中的至少一种的导电性成分，玻璃料和有机载体构成，玻璃料含有可结晶玻璃，导电性成分的烧结开始温度高于结晶化可结晶玻璃的起始温度低于可结晶玻璃的重熔温度。

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