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1. 发明授权

US06424516B2 Conductive paste and ceramic electronic component 有权
标题翻译：导电胶和陶瓷电子元件
公开(公告)号：US06424516B2
公开(公告)日：2002-07-23
申请号：US09870552
申请日：2001-05-30
申请人： Kiyotaka Maegawa , Kunihiko Hamada
发明人： Kiyotaka Maegawa , Kunihiko Hamada
IPC分类号： H01G4008
CPC分类号： H01G4/232
摘要： A conductive paste capable of forming a terminal electrode in which sintering proceeds while the viscosity of the glass is maintained during the sintering of the conductive component, so that the softened glass is prevented from flowing into the interface between the ceramic element assembly and the terminal electrode or from flowing on the surface of the terminal electrode, and furthermore, sufficient glass remains in the cavity of the terminal electrode film, so that an excellent seal is provided against the penetration of the plating solution, and the so-called “adhesion defect” is prevented from occurring, is provided. In addition, a ceramic electronic component is provided. The conductive paste is composed of a conductive component containing at least one of Cu and Ni, a glass frit and an organic vehicle, in which the glass frit contains a crystallizable glass, and the sintering starting temperature of the conductive component is higher than the crystallization starting temperature of the crystallizable glass and lower than the remelting temperature of the crystallizable glass.
摘要翻译：一种能够形成端子电极的导电膏，其中在导电部件烧结期间保持玻璃的粘度的同时进行烧结，从而防止软化玻璃流入陶瓷元件组件和端子电极之间的界面或者在端子电极的表面上流动，此外，在端子电极膜的空腔中残留有足够的玻璃，从而对电镀液的渗透提供优异的密封，所谓的“粘附缺陷” 被防止发生。另外，提供陶瓷电子部件。导电性糊料由含有Cu和Ni中的至少一种的导电性成分，玻璃料和有机载体构成，玻璃料含有可结晶玻璃，导电性成分的烧结开始温度高于结晶化可结晶玻璃的起始温度低于可结晶玻璃的重熔温度。

2. 发明授权

US06660226B1 Lead free solder and soldered article 有权
标题翻译：无铅焊料和焊接制品
公开(公告)号：US06660226B1
公开(公告)日：2003-12-09
申请号：US09632819
申请日：2000-08-07
申请人： Hidekiyo Takaoka , Kiyotaka Maegawa
发明人： Hidekiyo Takaoka , Kiyotaka Maegawa
IPC分类号： C22C1300
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of, Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.
摘要翻译：无铅焊料包括选自0.01至1重量％的Co，0.01至0.2重量％的Fe，0.01至0.2重量％的Mn，0.01至0.2重量％的Cr和0.01 至2重量％的Pd; 0.5〜2重量％的Cu; 和90.5重量％以上的Sn。该焊料在焊接接头中表现出令人满意的可焊性，并且在焊接时或当所得到的焊接制品保持在高温下时显示出对电极浸出的高抗性。

3. 发明授权

US07612983B2 Monolithic ceramic electronic component and method for manufacturing the same 有权
标题翻译：单片陶瓷电子元件及其制造方法
公开(公告)号：US07612983B2
公开(公告)日：2009-11-03
申请号：US11845965
申请日：2007-08-28
申请人： Kiyotaka Maegawa , Mitsuhiro Kusano
发明人： Kiyotaka Maegawa , Mitsuhiro Kusano
IPC分类号： H01G4/228 , H01G4/06
CPC分类号： H01G4/30 , H01G4/232 , Y10T29/435
摘要： A monolithic ceramic electronic component includes a ceramic laminate provided with ceramic layers and internal electrode layers disposed between the ceramic layers such that a portion of each internal electrode is led to an end surface of the ceramic laminate and the external electrode disposed on the end surface of the ceramic laminate to which the internal electrode layers are led, so as to connect to the internal electrode layers. At least one end portion in a longitudinal direction of an exposed portion of the internal electrode layer led to and exposed at the end surface of the ceramic laminate is covered with a glass film, and the internal electrodes and the external electrode are electrically connected to each other at a portion not covered with the glass film in the exposed portion of the internal electrode layer.
摘要翻译：单片陶瓷电子部件包括陶瓷层叠体，其设置有陶瓷层和设置在陶瓷层之间的内部电极层，使得每个内部电极的一部分被引导到陶瓷层压体的端面，并且设置在陶瓷层的端面上的外部电极内部电极层被引导到的陶瓷层叠体，以连接到内部电极层。在陶瓷层叠体的端面引导露出的内部电极层的露出部的长度方向的至少一个端部被玻璃膜覆盖，内部电极和外部电极与各个电极另一方面在内部电极层的露出部分中未被玻璃膜覆盖的部分。

4. 发明申请

US20080070059A1 Lead-free solder and soldered article 有权
标题翻译：无铅焊料和焊接制品
公开(公告)号：US20080070059A1
公开(公告)日：2008-03-20
申请号：US11979812
申请日：2007-11-08
申请人： Hidekiyo Takaoka , Kiyotaka Maegawa
发明人： Hidekiyo Takaoka , Kiyotaka Maegawa
IPC分类号： B32B15/01 , C22C13/00
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.
摘要翻译：无铅焊料包括选自0.01〜1重量％的Co，0.01〜0.2重量％的Fe，0.01〜0.2重量％的Mn，0.01〜0.2重量％的Cr和0.01〜 2重量％的Pd; 0.5〜2重量％的Cu; 和90.5重量％以上的Sn。该焊料在焊接接头中表现出令人满意的可焊性，并且在焊接时或当所得到的焊接制品保持在高温下时显示出对电极浸出的高抗性。

5. 发明授权

US07488445B2 Lead-free solder and soldered article 有权
公开(公告)号：US07488445B2
公开(公告)日：2009-02-10
申请号：US11979812
申请日：2007-11-08
申请人： Hidekiyo Takaoka , Kiyotaka Maegawa
发明人： Hidekiyo Takaoka , Kiyotaka Maegawa
IPC分类号： C22C13/00
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

6. 发明申请

US20060285994A1 Lead-free solder and soldered article 有权
公开(公告)号：US20060285994A1
公开(公告)日：2006-12-21
申请号：US11512304
申请日：2006-08-30
申请人： Hidekiyo Takaoka , Kiyotaka Maegawa
发明人： Hidekiyo Takaoka , Kiyotaka Maegawa
IPC分类号： C22C13/00
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

7. 发明授权

US07422721B2 Lead-free solder and soldered article 有权
公开(公告)号：US07422721B2
公开(公告)日：2008-09-09
申请号：US11512304
申请日：2006-08-30
申请人： Hidekiyo Takaoka , Kiyotaka Maegawa
发明人： Hidekiyo Takaoka , Kiyotaka Maegawa
IPC分类号： C22C13/00
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

8. 发明申请

US20070297119A1 MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：单晶陶瓷电子元件及其制造方法
公开(公告)号：US20070297119A1
公开(公告)日：2007-12-27
申请号：US11845965
申请日：2007-08-28
申请人： Kiyotaka Maegawa , Mitsuhiro Kusano
发明人： Kiyotaka Maegawa , Mitsuhiro Kusano
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232 , Y10T29/435
摘要： A monolithic ceramic electronic component includes a ceramic laminate provided with ceramic layers and internal electrode layers disposed between the ceramic layers such that a portion of each internal electrode is led to an end surface of the ceramic laminate and the external electrode disposed on the end surface of the ceramic laminate to which the internal electrode layers are led, so as to connect to the internal electrode layers. At least one end portion in a longitudinal direction of an exposed portion of the internal electrode layer led to and exposed at the end surface of the ceramic laminate is covered with a glass film, and the internal electrodes and the external electrode are electrically connected to each other at a portion not covered with the glass film in the exposed portion of the internal electrode layer.
摘要翻译：单片陶瓷电子部件包括陶瓷层叠体，其设置有陶瓷层和设置在陶瓷层之间的内部电极层，使得每个内部电极的一部分被引导到陶瓷层压体的端面，并且设置在陶瓷层的端面上的外部电极内部电极层被引导到的陶瓷层叠体，以连接到内部电极层。在陶瓷层叠体的端面引导露出的内部电极层的露出部的长度方向的至少一个端部被玻璃膜覆盖，内部电极和外部电极与各个电极另一方面在内部电极层的露出部分中未被玻璃膜覆盖的部分。

9. 发明授权

US07022282B2 Lead-free solder and soldered article 有权
公开(公告)号：US07022282B2
公开(公告)日：2006-04-04
申请号：US10087786
申请日：2002-03-05
申请人： Hidekiyo Takaoka , Kiyotaka Maegawa
发明人： Hidekiyo Takaoka , Kiyotaka Maegawa
IPC分类号： C22C13/00
CPC分类号： B23K35/262 , C22C13/00 , C22C13/02 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A lead-free solder includes at least one selected from 0.01 to 1% by weight of Co, 0.01 to 0.2% by weight of Fe, 0.01 to 0.2% by weight of Mn, 0.01 to 0.2% by weight of Cr, and 0.01 to 2% by weight of Pd; 0.5 to 2% by weight of Cu; and 90.5% by weight or more of Sn. This solder exhibits a satisfactory solderability in solder joints and shows a high resistance to electrode leaching upon soldering or when the resulting soldered article is left at high temperatures.

10. 发明授权

US6139979A Lead-free solder and soldered article 有权
标题翻译：无铅焊料和焊接制品
公开(公告)号：US6139979A
公开(公告)日：2000-10-31
申请号：US289449
申请日：1999-04-09
申请人： Hidekiyo Takaoka , Kiyotaka Maegawa
发明人： Hidekiyo Takaoka , Kiyotaka Maegawa
IPC分类号： B23K35/22 , B23K35/00 , B23K35/26 , C22C13/00 , C22C13/02 , B32B15/01
CPC分类号： C22C13/02 , B23K35/262 , C22C13/00 , B23K35/007 , H01L24/10 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , Y10T428/12694 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： A lead-free solder contains nickel, silver and tin. A soldered article is a workpiece containing a transition metal conductor capable of readily diffusing into melted tin; and the lead-free solder; wherein the lead-free solder is applied and bonded to the workpiece so as to be electrically and mechanically bonded to the transition metal conductor. The lead-free solder and soldered article barely cause electrode erosion during soldering or during aging after soldering, and have high tensile strength and thermal impact resistance.
摘要翻译：无铅焊料含有镍，银和锡。焊接制品是含有能够容易地扩散到熔融锡中的过渡金属导体的工件; 和无铅焊料; 其中所述无铅焊料被施加并结合到所述工件，以便电和机械地结合到所述过渡金属导体。无铅焊料和焊接制品在焊接期间或焊接后的老化中几乎不引起电极腐蚀，并且具有高抗拉强度和耐热冲击性。

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