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1. 发明授权

US06962111B2 Screen-printing plate, manufacturing method of laminated-ceramic electronic devices, and laminated-ceramic electronic device manufactured by the method 有权
标题翻译：丝网印刷版，层叠陶瓷电子器件的制造方法以及通过该方法制造的层叠陶瓷电子器件
公开(公告)号：US06962111B2
公开(公告)日：2005-11-08
申请号：US09873375
申请日：2001-06-05
申请人： Kazuma Tanaka , Yuki Yamamoto , Takaaki Kawai
发明人： Kazuma Tanaka , Yuki Yamamoto , Takaaki Kawai
IPC分类号： B41F15/08 , B28B11/00 , B41C1/14 , B41F15/36 , B41M1/12 , B41M3/00 , B41N1/24 , H05K3/12 , H05K3/34 , B05C17/06
CPC分类号： B41M1/12 , B41M3/006 , B41N1/247 , H05K3/1225
摘要： A screen-printing plate is provided with a plurality of printing patterns disposed in a single plate frame. Each printing pattern is formed with a plurality of mesh holes. At least two different aperture ratios of the mesh holes forming the printing patterns are provided according to the positions of regions on the screen-printing plate in which the printing patterns are disposed. The aperture ratio of the mesh holes forming the printing patterns positioned in a region close to the periphery of the plate frame is set higher than the aperture ratio of the mesh holes forming the printing patterns positioned in a central region of the plate frame.
摘要翻译：丝网印版设置有设置在单板框架中的多个印刷图案。每个印刷图案形成有多个网孔。根据印刷图案配置的丝网印刷板上的区域的位置，提供形成印刷图案的网孔的至少两个不同孔径比。形成位于靠近板框周边的区域中的打印图案的网孔的孔径比被设定为高于形成位于板框的中心区域中的打印图案的网孔的孔径比。

2. 外观设计

USD314607S Water purifier 失效
公开(公告)号：USD314607S
公开(公告)日：1991-02-12
申请号：US438900
申请日：1989-11-16
申请人： Jeffrey Kapec , Samuel Montague , Kazuma Tanaka
设计人： Jeffrey Kapec , Samuel Montague , Kazuma Tanaka

3. 发明授权

US08066550B2 Wafer polishing method and apparatus 有权
标题翻译：晶圆抛光方法及装置
公开(公告)号：US08066550B2
公开(公告)日：2011-11-29
申请号：US12337145
申请日：2008-12-17
申请人： Daichi Higuchi , Kazuma Tanaka
发明人： Daichi Higuchi , Kazuma Tanaka
IPC分类号： B24B1/00
CPC分类号： B24B9/065
摘要： A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished. Finally, the polishing unit is lowered to make the lower surface of the polishing member into pressure contact with the peripheral portion of the wafer, thus polishing only the peripheral portion.
摘要翻译：一种晶片抛光方法，其中抛光构件的外周边缘首先被固定到台座上的切割工具切割，从而将抛光构件形成为完全圆形，并且将抛光构件沿Y方向定位在表格的Y方向参考位置。此后，抛光单元在桌面保持静止在基准位置的状态下一次抬起。此后，台架沿着Y方向水平移动，从而将抛光部件定位在Y方向上，使得只有晶片的周边部分被抛光部件抛光。此时，预先从切削工具与夹持台上的晶片之间的Y方向的位置关系和待抛光的周边部的宽度获得台座的水平行程。最后，抛光单元被降低以使抛光构件的下表面与晶片的周边部分压力接触，从而只抛光周边部分。

4. 发明授权

US5503726A Plating apparatus 失效
标题翻译：电镀装置
公开(公告)号：US5503726A
公开(公告)日：1996-04-02
申请号：US490143
申请日：1995-06-14
申请人： Kunihiko Hamada , Shigehiro Nojiri , Kazuma Tanaka , Tatsuya Todo
发明人： Kunihiko Hamada , Shigehiro Nojiri , Kazuma Tanaka , Tatsuya Todo
IPC分类号： C25D17/16 , C25D21/10
CPC分类号： C25D17/16
摘要： A plating apparatus (11) includes a plating solution container (13) storing a plating solution (14) and a cathode (18) dipped therein, for plating objects which are placed on the cathode (18) by driving an air cylinder (22) for applying vibration to the cathode (18) while making a stopper (24) collide with a forward end (21a) of a coupling member (21) which is coupled to the air cylinder (22) and the cathode (18) thereby applying an impact to the cathode (18).
摘要翻译：电镀设备（11）包括：电镀溶液容器（13），其存储浸入其中的电镀液（14）和阴极（18），用于通过驱动气缸（22）放置在阴极（18）上的电镀物体，用于在使制动器（24）与耦合到气缸（22）和阴极（18）的联接构件（21）的前端（21a）碰撞的同时向阴极（18）施加振动，从而施加对阴极（18）的影响。

5. 发明申请

US20090176444A1 WAFER POLISHING METHOD AND APPARATUS 有权
标题翻译：波浪抛光方法和装置
公开(公告)号：US20090176444A1
公开(公告)日：2009-07-09
申请号：US12337145
申请日：2008-12-17
申请人： Daichi Higuchi , Kazuma Tanaka
发明人： Daichi Higuchi , Kazuma Tanaka
IPC分类号： B24B9/06 , B24B53/00
CPC分类号： B24B9/065
摘要： A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference position of the table base. Thereafter, a polishing unit is once lifted in the condition where the table base remains still at the reference position. Thereafter, the table base is horizontally moved toward a column in the Y direction to thereby position the polishing member in the Y direction so that only a peripheral portion of the wafer is polished by the polishing member. At this time, the horizontal travel of the table base is preliminarily obtained from the Y-directional positional relation between the cutting tool and the wafer held on a chuck table and from the width of the peripheral portion to be polished. Finally, the polishing unit is lowered to make the lower surface of the polishing member into pressure contact with the peripheral portion of the wafer, thus polishing only the peripheral portion.
摘要翻译：一种晶片抛光方法，其中抛光构件的外周边缘首先被固定到台座上的切割工具切割，从而将抛光构件形成为完全圆形，并且将抛光构件沿Y方向定位在表格的Y方向参考位置。此后，抛光单元在桌面保持静止在基准位置的状态下一次抬起。此后，台架沿着Y方向水平移动，从而将抛光部件定位在Y方向上，使得只有晶片的周边部分被抛光部件抛光。此时，预先从切削工具与夹持台上的晶片之间的Y方向的位置关系和待抛光的周边部的宽度获得台座的水平行程。最后，抛光单元被降低以使抛光构件的下表面与晶片的周边部分压力接触，从而只抛光周边部分。

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