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    • 7. 发明申请
    • ELECTROCHEMICAL DEVICE
    • 电化学装置
    • US20110176254A1
    • 2011-07-21
    • US13122139
    • 2009-09-30
    • Kazushi YawataNaoto HagiwaraKatsuei Ishida
    • Kazushi YawataNaoto HagiwaraKatsuei Ishida
    • H01G9/00
    • H01G9/0003H01G9/016H01G9/10H01G9/155H01G11/18H01G11/74H01G11/80H01M2/0212H01M2/06H01M2/30Y02E60/13
    • Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10) is provided with a capacitor element (11), a package (14) having the capacitor element (11) sealed therein, and a positive electrode terminal (12) and a negative electrode terminal (13), each of which is led out from the capacitor element and is provided with a part sealed in the package (14) with the capacitor element and other part led out to the outside the package. On a part of the positive electrode terminal (12) and on a part of the negative electrode terminal (13), increased thermal resistance sections (HR1) for suppressing heat transfer to the capacitor element (11) via the terminals (12, 13) from other parts of the positive electrode terminal (12) and other parts of the negative electrode terminal (13) are arranged, respectively.
    • 提供了适用于使用无铅焊料的高温回流焊接的电化学装置。 双电层电容器(10)具有电容器元件(11),密封有电容器元件(11)的封装(14)和正极端子(12)和负极端子(13), 其中的每一个从电容器元件引出并且设置有密封在封装(14)中的部分,电容器元件和其它部分被引出到封装的外部。 在正极端子(12)的一部分和负极端子(13)的一部分上,经由端子(12,13)抑制向电容器元件(11)的热传递的增加的热阻部(HR1) 从正极端子(12)的其他部分和负极端子(13)的其他部分分别配置。