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    • 1. 发明授权
    • Method and apparatus for inspecting a surface of a substrate
    • 用于检查基板表面的方法和装置
    • US08547545B2
    • 2013-10-01
    • US13210418
    • 2011-08-16
    • Hideaki SasazawaTakayuki IshiguroKiyotaka HorieYu Yanaka
    • Hideaki SasazawaTakayuki IshiguroKiyotaka HorieYu Yanaka
    • G01N21/88G01N21/55G01N21/47
    • G01N21/8851G01N21/95G01N2021/4711G01N2021/556G01N2021/8854G01N2021/8874
    • The present invention provides a method and apparatus for inspecting a surface of a substrate. The apparatus includes: a rotatable stage on which a substrate to be inspected is placed; an inspection optical system having an illumination light source for emitting light to a substrate placed on the stage and a detector for detecting light from the substrate which is irradiated with the light from the illumination light source; an A/D converter for amplifying and A/D converting signals output from the detector in the inspection optical system; and a defect detector for detecting defects in a surface of the substrate by processing signals output from the detector and converted by the A/D converter and classifying the defected defects. The defect detector extracts micro defects in the surface of the substrate by processing the signals output from the detector, and detects linear defects existing discretely in a linear region.
    • 本发明提供一种用于检查基板表面的方法和装置。 该装置包括:可旋转台,放置待检查的基板; 具有用于向放置在载物台上的基板发光的照明光源的检查光学系统和用于检测来自基板的光的检测器,所述检测光照射来自照明光源的光; A / D转换器,用于放大和A / D转换检测光学系统中的检测器输出的信号; 以及缺陷检测器,用于通过处理从检测器输出并由A / D转换器转换并对缺陷缺陷进行分类的信号来检测基板的表面中的缺陷。 缺陷检测器通过处理从检测器输出的信号来提取衬底表面的微缺陷,并检测线性区域中离散存在的线性缺陷。
    • 2. 发明申请
    • PATTERN INSPECTION METHOD AND DEVICE FOR SAME
    • 模式检验方法及其设备
    • US20120287426A1
    • 2012-11-15
    • US13520217
    • 2011-01-27
    • Hideaki SasazawaTakenori HiroseShigeru SerikawaKiyotaka Horie
    • Hideaki SasazawaTakenori HiroseShigeru SerikawaKiyotaka Horie
    • G01N21/89G01J3/42
    • G11B5/855G01B11/0641G01N21/95607
    • In an optical inspection for patterned media for hard disks, a pattern inspection device is provided for inspecting patterns without being susceptible to variations in film thickness and film quality of an underlying film, the device includes optical characteristics detection means for detecting optical characteristics of multilayers by processing, upon the reflected light being dispersed and detected by the spectroscopic detection means, the reflected light from a non-patterned region on the substrate, and processing a detection signal corresponding to, and detecting optical characteristics of, the reflected light from the patterns including the multilayers; and pattern inspection means for inspecting the patterns formed on the multilayers, by viewing, upon the detection of the optical characteristics by the optical characteristics detection means, information on the optical characteristics of the reflected light from the multilayers, and processing information on the optical characteristics of the reflected light from the patterns including the multilayers.
    • 在用于硬盘的图案化介质的光学检查中,提供了用于检查图案的图案检查装置,而不会影响底层膜的膜厚度和膜质量的变化,该装置包括用于通过以下方式检测多层膜的光学特性的光学特性检测装置 在由所述分光检测装置分散和检测的反射光中,对来自所述基板上的非图案化区域的反射光进行处理,并处理与来自所述图案的反射光相对应的检测信号和检测来自所述图案的反射光的检测信号,所述反射光包括 多层 以及用于检查形成在多层上的图案的图案检查装置,通过在通过光学特性检测装置检测到光学特性时观察,查看来自多层的反射光的光学特性的信息,以及关于光学特性的处理信息 来自包括多层的图案的反射光。
    • 4. 发明授权
    • Circuit board production method and its apparatus
    • 电路板生产方法及其设备
    • US07355143B1
    • 2008-04-08
    • US09763735
    • 1999-12-27
    • Hiroyuki NakanoToshihiko NakataMasayoshi SerizawaHideaki Sasazawa
    • Hiroyuki NakanoToshihiko NakataMasayoshi SerizawaHideaki Sasazawa
    • B23K10/00B23K26/00
    • G01N15/0227G01N15/0211G01N2015/0216
    • Making it possible to execute the detection of the particles floating inside a processing chamber with the use of an optical system including one observing window and one unit (An object of the present invention is, by using an optical system including one observing window and one unit, to make it possible to execute the detection of the particles floating inside a processing chamber.) Also, in order to be able to detect exceedingly feeble particle scattered-lights with a high-accuracy, when performing a desired thin-film forming or thin-film processing treatment toward a to-be-processed target inside the processing chamber, the following method is employed: First, the irradiation with a beam is executed into the processing chamber through the observing window. Here, the beam is P-polarized and is intensity-modulated with a frequency differing from an exciting source's frequency and its integer-multiples, and the observing window has an inclination that forms Brewster angle toward the P-polarized incident beam. Next, backward scattered-lights scattered by the particles inside the processing chamber are received and image-photographed at a detecting optical system through the above-described one and the same observing window. Moreover, the above-described frequency component and a wavelength component of the above-described intensity-modulated beam are detected out of the received signals. Finally, the detected components and the image-photographed image information are used so as to judge the number, the size, and the distribution of the particles.
    • 通过使用包括一个观察窗口和一个单元的光学系统,可以执行浮动在处理室内的颗粒的检测。本发明的目的是通过使用包括一个观察窗口和一个单元的光学系统 ,使得可以执行浮在处理室内的颗粒的检测。)此外,为了能够以高精度检测到极度​​微弱的粒子散射光,当进行所需的薄膜形成或薄 对处理室内的待处理靶材进行膜处理,采用以下方法:首先,通过观察窗口将光束照射进入处理室。 这里,光束是P偏振光并且以不同于激发光源的频率和其整数倍的频率进行强度调制,并且观察窗口具有朝向P偏振入射光束形成布鲁斯特角的倾斜度。 接下来,通过上述同一观察窗口,在检测光学系统中接收并处理由处理室内的颗粒散射的向后散射光并进行图像拍摄。 此外,从接收信号中检测出上述强度调制波束的上述频率分量和波长分量。 最后,使用检测到的分量和图像拍摄图像信息来判断粒子的数量,大小和分布。
    • 5. 发明授权
    • Method for controlling semiconductor device production process and a method for producing semiconductor devices
    • 半导体器件制造方法的控制方法以及半导体器件的制造方法
    • US07273685B2
    • 2007-09-25
    • US11304778
    • 2005-12-16
    • Hideaki SasazawaYasuhiro Yoshitake
    • Hideaki SasazawaYasuhiro Yoshitake
    • G03F9/00G03C5/00
    • G03F7/70641
    • In order to realize individually and easily optimization of exposure conditions such as exposure dose and focus by photolithography in a production process of semiconductor devices, the present invention is such that: light is radiated onto a pattern on a semiconductor wafer; by an optical system that detects information on a pattern shape using scattered light by its reflection, waveforms of an FEM sample wafer having a plurality of shape deformation patterns prepared in advance are detected and stored; one or more characteristic points on a spectral waveform generated in association with a pattern change is recorded; and a variation model of the characteristic points is obtained. As to a pattern to be measured, a spectral waveform is detected in the same manner as that described above, and deviations (exposure dose deviation and focus deviation) of the formation conditions are estimated from a displacement of the characteristic points on the waveform using the variation model. Thereby, the exposure dose and focus can be independently fed back and the process control can be achieved with high accuracy.
    • 为了在半导体器件的生产过程中实现通过光刻的曝光量和曝光量等的曝光条件的单独和容易的优化,本发明使得:将光照射到半导体晶片上的图案上; 通过利用其反射检测使用散射光的图案形状的信息的光学系统,检测并存储具有预先准备的多个形状变形图案的FEM样品晶片的波形; 记录与图案变化相关联地生成的光谱波形上的一个或多个特征点; 并获得特征点的变化模型。 对于要测量的图案,以与上述相同的方式检测光谱波形,并且使用波形的波形上的特征点的位移来估计形成条件的偏差(曝光剂量偏差和聚焦偏差) 变异模型。 因此,可以独立地反馈曝光剂量和聚焦,并且可以以高精度实现过程控制。
    • 6. 发明授权
    • Method and apparatus for automatic focusing and a method and apparatus
for three dimensional profile detection
    • 自动对焦的方法和装置以及用于三维轮廓检测的方法和装置
    • US5780866A
    • 1998-07-14
    • US559946
    • 1995-11-17
    • Hisae YamamuraYukio MatsuyamaTakanori NinomiyaHideaki Sasazawa
    • Hisae YamamuraYukio MatsuyamaTakanori NinomiyaHideaki Sasazawa
    • G01B11/02G01B11/24G01C3/06G01N21/956G01R31/309G06T1/00G01N21/84
    • G01R31/309G01B11/026G01B11/24G01N21/956
    • A method for automatic focusing and three dimensional profile detection and an apparatus for automatic focusing and three dimensional profile detection have the purpose of detecting a three dimensional profile of the state of mounting of parts or soldering on a board without the affects of warp, even if the board of the detection object is warped, as if the surface of the board were on a flat plane. The board surface height is detected in a plurality of windows corresponding to stage scanning regions from a three dimensional profile signal of the part-mounted board detected by a height detection optical system. The board height or inclination in the next window is forecasted from the board surface height and the control history of stage height in the already-detected plurality of windows. Based on the forecasted board surface height or inclination, the speed or height in the Z direction of a Z-stage is controlled according to a feedforward method with scanning so as that the board surface and the focal plane of the height detection optical system are made coincident.
    • 用于自动聚焦和三维轮廓检测的方法以及用于自动聚焦和三维轮廓检测的装置的目的是检测零件的安装状态或焊接在板上的三维轮廓,而不影响翘曲,即使 检测对象的板翘曲,仿佛板的表面在平面上。 根据由高度检测光学系统检测的部件安装板的三维轮廓信号,在与台架扫描区域相对应的多个窗口中检测板表面高度。 在已经检测到的多个窗口中,从板表面高度和台架高度的控制历史预测下一窗口中的板高度或倾斜度。 基于预测的板表面高度或倾斜度,根据前馈方法控制Z级Z方向的速度或高度,以使得高度检测光学系统的板表面和焦平面成为 巧合
    • 7. 发明授权
    • Spectral detection method and device, and defect inspection method and apparatus using the same
    • 光谱检测方法和装置,以及使用其的缺陷检查方法和装置
    • US08279431B2
    • 2012-10-02
    • US12626963
    • 2009-11-30
    • Takenori HiroseMinoru YoshidaHideaki SasazawaYasuhiro Yoshitake
    • Takenori HiroseMinoru YoshidaHideaki SasazawaYasuhiro Yoshitake
    • G01N21/00
    • G01J3/02G01B2210/56G01J3/0208G01J3/021G01J3/0229G01N21/95607
    • In spectral detection for detecting the shape of repeating pattern structures uniformly formed on a surface of a test object, it is advantageous to use light having a wide wavelength range in a short wavelength region. However, it is not easy to realize a relatively simple optical system capable of spectral detection of light having a wide wavelength range in a short wavelength region, namely in ultraviolet region. The present invention provides an inspection apparatus for detecting pattern defects. The inspection apparatus includes a spectral detection optical system capable of spectral detection of light in a wavelength range from deep ultraviolet to near infrared. The spectral detection optical system includes a spatially partial mirror serving as a half mirror and a reflecting objective provided with an aperture stop for limiting the angle and direction of light to be applied to and reflected by a test object.
    • 在用于检测在测试对象的表面上均匀形成的重复图案结构的形状的光谱检测中,有利的是在短波长范围内使用宽波长范围的光。 然而,实现能够在短波长区域即紫外线区域中具有宽波长范围的光的光谱检测的相对简单的光学系统是不容易的。 本发明提供一种用于检测图案缺陷的检查装置。 检查装置包括能够对从深紫外线到近红外线的波长范围内的光进行光谱检测的光谱检测光学系统。 光谱检测光学系统包括用作半反射镜的空间部分反射镜和设置有孔径光阑的反射物镜,该孔径光阑用于限制被施加到测试对象并由被测物体反射的光的角度和方向。
    • 8. 发明授权
    • Method and apparatus for inspecting a pattern shape
    • 用于检查图案形状的方法和装置
    • US08040772B2
    • 2011-10-18
    • US12425438
    • 2009-04-17
    • Keiya SaitoTakenori HiroseHideaki Sasazawa
    • Keiya SaitoTakenori HiroseHideaki Sasazawa
    • G11B7/00G01N21/00
    • G11B27/36B82Y10/00G01N21/9506G01N21/95607G01N2021/945G11B5/743G11B5/746G11B5/82G11B5/855G11B5/865G11B2220/2516
    • An apparatus for inspecting a pattern shape of a magnetic record medium or its stamper includes: a moving mechanism, on which an object to be inspected where a pattern is formed is placed and which moves the object to be inspected in a radial direction while rotating the object; an irradiating optical system that applies illuminating light of a wide band including far ultraviolet light to the object to be inspected moved in the radial direction while rotating the object by the moving mechanism in a polarized state suitable for the object to be inspected from an oblique direction; a detecting optical system that detects zero-order reflected light generated from the object to be inspected irradiated by the irradiating optical system; and a shape inspection unit that inspects a pattern shape formed on the object to be inspected based on a spectral reflectance waveform obtained by dispersing the detected zero-order reflected light, thereby inspecting the pattern shape at a high speed and with high sensitivity.
    • 用于检查磁记录介质或其压模的图案形状的装置包括:移动机构,其上形成有图案的待检查对象,并且沿径向移动被检查物体,同时旋转 目的; 照射光学系统,其将从包括远紫外线的宽带的照明光向受检对象移动,同时通过移动机构以倾斜方向适于被检查对象的偏振状态旋转物体 ; 检测光学系统,其检测由所述照射光学系统照射的待检查物体产生的零级反射光; 以及形状检查单元,其基于通过分散检测到的零级反射光而获得的光谱反射率波形来检查形成在待检查对象上的图案形状,从而以高速和高灵敏度检查图案形状。
    • 9. 发明授权
    • Method and device for detecting shape of surface of medium
    • 用于检测介质表面形状的方法和装置
    • US07969567B2
    • 2011-06-28
    • US12482125
    • 2009-06-10
    • Minoru YoshidaTakenori HiroseHideaki SasazawaShigeru Serikawa
    • Minoru YoshidaTakenori HiroseHideaki SasazawaShigeru Serikawa
    • G01N21/00
    • G11B20/1883G11B2020/1826G11B2220/20G11B2220/2516
    • A defect generated during a nano-imprint process is inspected by a scatterometry method. The scatterometry method is to illuminate the surface of a medium with light having a plurality of wave lengths by means of a first illuminator through a half mirror and an objective lens and cause light reflected on the medium to be incident on a spectrometer through the objective lens and the half mirror. A second illuminator illuminates a foreign material or scratch on the surface of the medium from an oblique direction with respect to the surface of the medium. Light is scattered from the foreign material or scratch and detected by first and second detectors. The first detector is placed in a direction defining a first elevation angle with the surface of the medium. The second detector is placed in a direction defining a second elevation angle with the surface of the medium. When coordinates of a defect that are obtained by the scatterometry method match coordinates of the foreign material or scratch, an inspection device determines that the defect is not generated during the nano-imprint process. When the matching is negative, the inspection device determines that the defect is generated during the nano-imprint process.
    • 在纳米压印过程中产生的缺陷通过散射法进行检查。 散射方法是通过半反射镜和物镜通过第一照明器照亮具有多个波长的光的介质的表面,并使介质上反射的光通过物镜入射到光谱仪上 和半反射镜。 第二个照明器相对于介质的表面从倾斜的方向照射介质表面上的异物或划痕。 光从异物或划痕散射并由第一和第二检测器检测。 第一检测器被放置在与介质表面限定第一仰角的方向上。 第二检测器被放置在与介质表面限定第二仰角的方向上。 当通过散射测定方法获得的缺陷的坐标与异物或划痕的坐标匹配时,检查装置确定在纳米压印过程中不产生缺陷。 当匹配为负时,检查装置确定在纳米压印过程中产生缺陷。