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1. 发明授权

US4340779A Interpreter intercommunication and public address system 失效
标题翻译：翻译互通和公共广播系统
公开(公告)号：US4340779A
公开(公告)日：1982-07-20
申请号：US112449
申请日：1980-01-16
申请人： Hideaki Hashimoto , Mitsuo Abe , Masaharu Morita
发明人： Hideaki Hashimoto , Mitsuo Abe , Masaharu Morita
IPC分类号： H04M11/00 , G09B5/04 , G09B19/06 , H04H20/61 , H04H20/76 , H04H20/83 , H04M3/56 , H04B5/00
CPC分类号： H04H20/61 , G09B19/06 , G09B5/04 , H04H20/76 , H04H20/83
摘要： Simultaneous interpretation apparatus using matrix circuits whereby, even when an additional original language is used other than the specified original languages for the apparatus, simultaneous interpretation of that additional original language into the specified original languages is accomplished with ease and without hindrance. The present invention is particularly adapted to the interpretation of four specified original languages, for example Japanese, English, French and Spanish, and is particularly useful when an additional original language is used, such as Chinese for example. The matrix circuitry of the present invention enables translation of the additional original language to proceed even though the apparatus is primarily adapted for use in interpreting and translating the four specified original languages. Without this matrix circuitry the apparatus could not adapt to the additional original language since certain translators would not be alerted to perform their translating duties.
摘要翻译：使用矩阵电路的同声传译装置，由此即使使用除设备的指定原始语言之外的附加原始语言，也可以容易且无障碍地实现将该附加原始语言同时解释为指定的原始语言。本发明特别适用于四种特定的原始语言的解释，例如日语，英语，法语和西班牙语，并且在使用其他原始语言（例如中文）时特别有用。即使该装置主要适用于解释和翻译四个指定的原始语言，本发明的矩阵电路也能够使附加原始语言的翻译继续进行。没有这种矩阵电路，该装置不能适应附加的原始语言，因为某些翻译器将不会被警告以执行其翻译任务。

2. 发明授权

US07193320B2 Semiconductor device having a heat spreader exposed from a seal resin 失效
公开(公告)号：US07193320B2
公开(公告)日：2007-03-20
申请号：US10352074
申请日：2003-01-28
申请人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
发明人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
IPC分类号： H01L23/06
CPC分类号： H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.

3. 发明授权

US5276574A Magnetic head 失效
标题翻译：磁头
公开(公告)号：US5276574A
公开(公告)日：1994-01-04
申请号：US744515
申请日：1991-08-13
申请人： Mitsuo Abe , Yukiko Ogura , Masakatsu Saito , Toshio Tsuchiya
发明人： Mitsuo Abe , Yukiko Ogura , Masakatsu Saito , Toshio Tsuchiya
IPC分类号： G11B5/127 , G11B5/187 , G11B5/31 , G11B5/255
CPC分类号： G11B5/3106 , G11B5/1871 , G11B5/1878
摘要： Disclosed herein is a magnetic head in which the sliding surface is constructed of a transducing gap, a pair of soft magnetic metal films opposite to each other through the transducing gap, and a substrate holding the soft magnetic metal film. The substrate is 20-200 times as wear-resistant as the soft magnetic metal film. The magnetic head has a gap depth of 1-5 .mu.m and produces an overall high head output.
摘要翻译：这里公开了一种磁头，其中滑动表面由换能间隙，通过换能间隙彼此相对的一对软磁金属膜构成，以及保持软磁金属膜的基板。基材的耐磨性为软磁金属膜的20-200倍。磁头的间隙深度为1-5（my）m，产生一个整体较高的磁头输出。

4. 发明授权

US5067038A Rotary magnetic head device having two different kinds of heads 失效
标题翻译：具有两种不同种类的头的旋转磁头装置
公开(公告)号：US5067038A
公开(公告)日：1991-11-19
申请号：US548628
申请日：1990-07-05
申请人： Toshio Tsuchiya , Mitsuo Abe , Nobuo Arai , Masumi Hisatomi , Hideo Zama
发明人： Toshio Tsuchiya , Mitsuo Abe , Nobuo Arai , Masumi Hisatomi , Hideo Zama
IPC分类号： G11B5/31 , G11B5/53
CPC分类号： G11B5/534
摘要： A rotary magnetic head device utilizes a thin film magnetic head or heads having small mutual influence to external magnetic field in combination with a bulk magnetic head or heads to reduce crosstalk between recording head and reproducing head to thereby improve S/N ratio.
摘要翻译：旋转磁头装置利用与大量磁头或磁头组合的对外部磁场具有小的相互影响的薄膜磁头或磁头，以减少记录头和再现磁头之间的串扰，从而提高S / N比。

5. 发明授权

US4589230A Grinding machine 失效
标题翻译：磨床
公开(公告)号：US4589230A
公开(公告)日：1986-05-20
申请号：US647815
申请日：1984-09-06
申请人： Shigehiro Yonemura , Hiroshi Umino , Masao Kume , Mitsuo Abe , Satoshi Miyatake
发明人： Shigehiro Yonemura , Hiroshi Umino , Masao Kume , Mitsuo Abe , Satoshi Miyatake
IPC分类号： B23Q15/14 , B23F5/02 , B23F23/12 , B23Q15/013 , B23Q15/12 , B24B49/16 , B24B19/00
CPC分类号： B23F23/12 , B23Q15/12 , B24B49/16 , G05B2219/37348 , G05B2219/45161
摘要： A grinding machine including a grinding wheel spindle motor for rotating a grinding wheel, a workpiece spindle motor for rotating a workpiece such as a gear to be ground in mesh with the grinding wheel, and a traverse motor for moving a table supporting the workpiece spindle motor. A power detector and a comparator are connected to a driver circuit for the grinding wheel spindle motor. When a load on the grinding wheel in mesh with the workpiece is increased, such a load increase is detected by the power detector and applied to a comparator. If the load signal is in excess of a reference level, then the application of a drive signal to the traverse motor is interrupted or a speed at which the workpiece is traversed relatively to the grinding wheel is reduced.
摘要翻译：一种磨床，包括用于使砂轮旋转的砂轮主轴电机，用于旋转与研磨轮啮合的待磨削齿轮的工件的工件主轴电机和用于移动支撑工件主轴电机的工作台的横动电动机。功率检测器和比较器连接到用于砂轮主轴电机的驱动器电路。当与工件啮合的砂轮上的负载增加时，这种负载增加由功率检测器检测并施加到比较器。如果负载信号超过基准电平，则驱动信号施加到横动电动机被中断，或者工件相对于砂轮运动的速度减小。

6. 发明授权

US4448580A Process for producing .alpha.-methyl styrene-methyl methacrylate-acrylonitrile thermoplastic resin 失效
标题翻译：制备α-甲基苯乙烯 - 甲基丙烯酸甲酯 - 丙烯腈热塑性树脂的方法
公开(公告)号：US4448580A
公开(公告)日：1984-05-15
申请号：US421777
申请日：1982-09-23
申请人： Mitsuo Abe , Syuji Tsuchikawa , Teizo Fukuta , Tsugio Asakawa
发明人： Mitsuo Abe , Syuji Tsuchikawa , Teizo Fukuta , Tsugio Asakawa
IPC分类号： C08F2/00 , C08F2/22 , C08F212/00 , C08F212/10 , C08F212/12 , C08L25/12 , C08L25/16 , C08L55/02 , C08F257/02 , C08L33/12
CPC分类号： C08L25/12 , C08F212/12 , C08L25/16 , C08L55/02
摘要： A thermoplastic resin having an excellent thermal stability and a high heat resistance is prepared by initiating polymerization of 65-85 parts by weight of a monomer mixture (A) consisting of 50-85% by weight of .alpha.-methylstyrene, 3-20% by weight of methyl methacrylate, 2-20% by weight of acrylonitrile, and 0-25% by weight of an aromatic alkenyl compound other than .alpha.-methylstyrene, continuously or intermittently adding, on the way of the polymerization, 2-15 parts by weight of a monomer (B) consisting of acrylonitrile or a mixture thereof with an aromatic alkenyl compound other than .alpha.-methylstyrene to the polymerization system while continuing the polymerization, further adding to the polymerization system 5-25 parts by weight of a monomer (C) consisting of an aromatic alkenyl compound other than .alpha.-methylstyrene, or a mixture thereof with acrylonitrile, and continuing the polymerization to complete the polymerization, the total amount of monomers (A), (B), and (C) being 100 parts by weight. Further, a thermoplastic resin composition having an excellent thermal stability, a high heat resistance and a high impact strength is prepared by mixing the thermoplastic resin thus obtained with a graft copolymer obtained by grafting 60-30 parts by weight of a monomer mixture consisting of 65-80% by weight of an aromatic alkenyl compound and 35-20% by weight of acrylonitrile on 40-70 parts by weight of a diene rubbery polymer in such a proportion that the composition contains 10-30% by weight of the rubbery polymer.
摘要翻译：通过引发65-85重量份由50-85重量％的α-甲基苯乙烯，3-20重量％的α-甲基苯乙烯组成的单体混合物（A）的引发聚合来制备具有优异的热稳定性和高耐热性的热塑性树脂重量的甲基丙烯酸甲酯，2-20重量％的丙烯腈和0-25重量％的除α-甲基苯乙烯之外的芳族烯基化合物，在聚合过程中连续或间歇地加入2-15重量份由丙烯腈或其与α-甲基苯乙烯以外的芳族烯基化合物的混合物组成的单体（B），同时继续进行聚合，进一步向聚合体系中加入5-25重量份的单体（C）由除α-甲基苯乙烯以外的芳族烯基化合物或其与丙烯腈的混合物组成，并继续聚合以完成聚合，单体（A），（B）和（C） ng 100重量份。此外，通过将由此获得的热塑性树脂与通过接枝60-30重量份的由65重量份组成的单体混合物获得的接枝共聚物来制备具有优异的热稳定性，高耐热性和高冲击强度的热塑性树脂组合物 -80重量％的芳族链烯基化合物和35-20重量％的丙烯腈，40-70重量份的二烯橡胶状聚合物的比例为组合物含有10-30重量％的橡胶状聚合物。

7. 发明授权

US4420348A Amorphous alloy for magnetic head core 失效
标题翻译：磁头芯非晶合金
公开(公告)号：US4420348A
公开(公告)日：1983-12-13
申请号：US248456
申请日：1981-03-27
申请人： Kazuo Shiiki , Shigekazu Otomo , Mitsuhiro Kudo , Mitsuo Abe
发明人： Kazuo Shiiki , Shigekazu Otomo , Mitsuhiro Kudo , Mitsuo Abe
IPC分类号： C22C45/00 , C22C45/04 , G11B5/147 , H01F1/153 , C22C33/00
CPC分类号： C22C45/008 , H01F1/15316
摘要： Amorphous alloy for magnetic head core represented by the general formula, (Fe.sub.x Co.sub.1-x).sub.a Cr.sub.b Si.sub.c -B.sub.1-a-b-c, where the value of x is 0.04-0.07, the value of a is 0.73-0.75, the value of b is 0.005-0.03, and the value of c is 0.02-0.06. The present amorphous alloy has high permeability, high saturation flux density, low magnetostriction, and low magnetic after-effect at the same time, and has distinguished characteristics for magnetic head core.
摘要翻译：由通式（FexCo1-x）a CrbSic-B1-abc表示的用于磁头芯的非晶合金，其中x的值为0.04-0.07，a的值为0.73-0.75，b的值为0.005〜 0.03，c值为0.02-0.06。本发明的非晶合金同时具有高磁导率，高饱和磁通密度，低磁致伸缩性和低磁性后效应，具有磁头芯的特点。

8. 发明申请

US20070114642A1 Semiconductor device having a heat spreader exposed from a seal resin 审中-公开
标题翻译：具有从密封树脂露出的散热器的半导体装置
公开(公告)号：US20070114642A1
公开(公告)日：2007-05-24
申请号：US11655253
申请日：2007-01-19
申请人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
发明人： Sumikazu Hosoyamada , Yoshitsugu Kato , Mitsuo Abe , Kazuto Tsuji , Masaharu Minamizawa , Toshio Hamano , Toshiyuki Honda , Katsuro Hiraiwa , Masashi Takenaka
IPC分类号： H01L23/495
CPC分类号： H01L24/48 , H01L23/3128 , H01L23/4334 , H01L23/49822 , H01L23/50 , H01L24/45 , H01L24/49 , H01L24/73 , H01L2224/0401 , H01L2224/05554 , H01L2224/05624 , H01L2224/06135 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/4813 , H01L2224/48227 , H01L2224/4824 , H01L2224/48247 , H01L2224/48465 , H01L2224/48599 , H01L2224/48699 , H01L2224/49109 , H01L2224/4911 , H01L2224/4943 , H01L2224/73207 , H01L2224/73215 , H01L2224/73265 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10162 , H01L2924/1433 , H01L2924/15151 , H01L2924/15153 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19042 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
摘要翻译：半导体元件具有电路形成面，电极端子在其周边配置有电极端子。半导体元件由模具树脂封装在基板上，该基板在对应于半导体元件的电极的位置处具有开口。半导体元件在电路形成表面面向基板并且电极端子位于开口处的状态下安装到基板，并且与半导体元件的电路形成表面相反的后表面从模制树脂露出。由金属板形成的发热部件设置在与安装有半导体元件的表面相对的基板的表面上。发泡构件的表面从模制树脂露出。

9. 发明授权

US06559536B1 Semiconductor device having a heat spreading plate 有权
标题翻译：具有散热板的半导体装置
公开(公告)号：US06559536B1
公开(公告)日：2003-05-06
申请号：US09612317
申请日：2000-07-07
申请人： Yoshitsugu Katoh , Mitsuo Abe , Yoshihiko Ikemoto , Sumikazu Hosoyamada
发明人： Yoshitsugu Katoh , Mitsuo Abe , Yoshihiko Ikemoto , Sumikazu Hosoyamada
IPC分类号： H01L2334
CPC分类号： H01L24/32 , H01L23/3128 , H01L23/4334 , H01L23/49531 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/97 , H01L2224/05599 , H01L2224/32057 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2224/83385 , H01L2224/8547 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15151 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025 , Y10T29/49121 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49171 , H01L2224/85 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor device includes a semiconductor chip, a substrate electrically connected to the semiconductor chip and heat spreading plate thermally connected to the semiconductor chip. The substrate is provided with external connection terminals on a first surface and electrically connects the semiconductor chip and the external connection terminals. The substrate is provided with joining , parts made of metal on a second surface. The heat spreading plate and the substrate are joined together by welding the joining parts and the heat spreading plate.
摘要翻译：半导体器件包括半导体芯片，与半导体芯片电连接的基板和热连接到半导体芯片的散热板。基板在第一表面上设置有外部连接端子，并且电连接半导体芯片和外部连接端子。基板设置有接合部，第二表面上由金属制成的部件。通过焊接接合部和散热板将散热板和基板接合在一起。

10. 发明授权

US06333564B1 Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes 失效
标题翻译：表面贴装型半导体器件及其制造方法，具有将半导体芯片与突起电极电连接的中间层
公开(公告)号：US06333564B1
公开(公告)日：2001-12-25
申请号：US09336747
申请日：1999-06-21
申请人： Yoshitsugu Katoh , Mitsutaka Sato , Hiroshi Inoue , Seiichi Orimo , Akira Okada , Yoshihiro Kubota , Mitsuo Abe , Toshio Hamano , Yoshitaka Aiba , Tetsuya Fujisawa , Masaaki Seki , Noriaki Shiba
发明人： Yoshitsugu Katoh , Mitsutaka Sato , Hiroshi Inoue , Seiichi Orimo , Akira Okada , Yoshihiro Kubota , Mitsuo Abe , Toshio Hamano , Yoshitaka Aiba , Tetsuya Fujisawa , Masaaki Seki , Noriaki Shiba
IPC分类号： H01L2348
CPC分类号： H01L23/3107 , H01L23/4334 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L2224/32145 , H01L2224/32225 , H01L2224/451 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/18161 , H01L2924/18165 , H01L2924/3511 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2924/00015 , H01L2224/05599
摘要： A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.
摘要翻译：一种半导体器件及其制造方法，该器件包括半导体芯片; 作为外部连接端子的球; 电连接半导体芯片和滚珠的基板; 模制树脂，其密封半导体芯片的至少一部分; 以及密封基板和半导体芯片之间的连接部分的连接部密封树脂。半导体器件通过球安装到印刷电路板上。模制树脂的热膨胀系数与印刷电路板的热膨胀系数相匹配。在模制树脂中形成用于保持半导体芯片的侧表面的侧表面保持部分，以限制半导体芯片的热变形。

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