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1. 发明授权

US09587306B2 Method for producing a directional layer by cathode sputtering, and device for implementing the method 有权
标题翻译：通过阴极溅射制造定向层的方法，以及用于实施该方法的装置
公开(公告)号：US09587306B2
公开(公告)日：2017-03-07
申请号：US11968300
申请日：2008-01-02
申请人： Hartmut Rohrmann , Hanspeter Friedli , Jürgen Weichart , Stanislav Kadlec , Martin Dubs
发明人： Hartmut Rohrmann , Hanspeter Friedli , Jürgen Weichart , Stanislav Kadlec , Martin Dubs
IPC分类号： C23C14/34 , G11B5/851 , H01J37/34
CPC分类号： C23C14/34 , G11B5/851 , H01J37/34 , H01J37/3447
摘要： For producing a directional layer for instance with constant nominal directionality, such as a low-retentivity layer with a preferred direction of magnetization or a support layer for such a layer by cathode sputtering on a substrate surface (4), the coating process takes place in a manner whereby particles emanating from a target surface (6) impinge predominantly from directions whose projections onto the substrate surface (4) lies within a preferred angular range surrounding the nominal direction. This is achieved for instance by positioning a collimator (8), encompassing plates (9) that extend at a normal angle to the substrate surface (4) parallel to the nominal direction in front of the substrate surface (4), but in lieu of or in addition to such positioning the location or movement of the substrate surface (4) relative to the target surface (6) can also be suitably adjusted or controlled.
摘要翻译：为了产生例如具有恒定标称方向性的定向层，例如具有优选磁化方向的低保持层或用于通过阴极溅射在衬底表面（4）上的这种层的支撑层，涂覆过程发生在一种从目标表面（6）发出的颗粒主要从其上突出到基板表面（4）上的方向处于围绕标称方向的优选角度范围内的方式。这例如通过定位准直器（8）来实现，该准直器（8）围绕与基板表面（4）平行于基板表面（4）的标称方向的法向角度延伸的板（9），但代替或者除了这样的定位之外，还可以适当地调整或控制衬底表面（4）相对于目标表面（6）的位置或移动。

2. 发明申请

US20090134011A1 Method for producing a directional layer by cathode sputtering, and device for implementing the method 有权
标题翻译：通过阴极溅射制造定向层的方法，以及用于实施该方法的装置
公开(公告)号：US20090134011A1
公开(公告)日：2009-05-28
申请号：US11968300
申请日：2008-01-02
申请人： Hartmut Rohrmann , Hanspeter Friedli , Jurgen Weichart , Stanislav Kadlec , Martin Dubs
发明人： Hartmut Rohrmann , Hanspeter Friedli , Jurgen Weichart , Stanislav Kadlec , Martin Dubs
IPC分类号： C23C14/34
CPC分类号： C23C14/34 , G11B5/851 , H01J37/34 , H01J37/3447
摘要： For producing a directional layer for instance with constant nominal directionality, such as a low-retentivity layer with a preferred direction of magnetization or a support layer for such a layer by cathode sputtering on a substrate surface (4), the coating process takes place in a manner whereby particles emanating from a target surface (6) impinge predominantly from directions at which their projection onto the substrate surface (4) lies within a preferred angular range surrounding the nominal direction. This is achieved for instance by positioning a collimator (8), encompassing plates (9) that extend at a normal angle to the substrate surface (4) parallel to the nominal direction in front of the substrate surface (4), but in lieu of or in addition to such positioning the location or movement of the substrate surface (4) relative to the target surface (6) can also be suitably adjusted or controlled.
摘要翻译：为了产生例如具有恒定标称方向性的定向层，例如具有优选磁化方向的低保持层或用于通过阴极溅射在衬底表面（4）上的这种层的支撑层，涂覆过程发生在从目标表面（6）发出的颗粒主要从其在衬底表面（4）上的投影位于围绕标称方向的优选角度范围内的方向入射的方式。这例如通过定位准直器（8）来实现，该准直器（8）围绕与基板表面（4）平行于基板表面（4）的标称方向的法向角度延伸的板（9），但代替或者除了这样的定位之外，还可以适当地调整或控制衬底表面（4）相对于目标表面（6）的位置或移动。

3. 发明申请

US20110186421A1 TARGET ASSEMBLY FOR A MAGNETRON SPUTTERING APPARATUS, A MAGNETRON SPUTTERING APPARATUS AND A METHOD OF USING THE MAGNETRON SPUTTERING APPARATUS 审中-公开
标题翻译：磁控溅射装置的目标组件，磁控溅射装置和使用磁控溅射装置的方法
公开(公告)号：US20110186421A1
公开(公告)日：2011-08-04
申请号：US13015892
申请日：2011-01-28
申请人： Hanspeter Friedli , Hartmut Rohrmann
发明人： Hanspeter Friedli , Hartmut Rohrmann
IPC分类号： C23C14/35
CPC分类号： C23C14/3407 , H01J37/3408 , H01J37/3452 , H01J37/3461
摘要： To provide, in a magnetron sputtering apparatus for coating a substrate with a material of high magnetic permeability, for a sufficient trapping field of at least 24 kA/m (300 Oe) field strength above a target surface a target assembly consists of target plates (34, 33, 32) separated by through-going slits (35, 36) which the magnetic field must cross and to a support plate (31) consisting of copper to which the backside of the target is fixed. In order to avoid any release of material from the support plate and deposition of the same on the substrate each of the slits (35, 36) is shaped in such a way that there is no line-of-sight connection between the gap at the target surface and the support plate (31) at the backside of the target through the slit, the latter having, e.g., two sections which are perpendicular to the target surface, one ending at the target surface and the other at the support plate, and which are laterally offset and connected by a third section which is parallel to the target surface. Magnetic field strength in the slits (35, 36) is kept below 64 kA/m (800 Oe) to prevent the formation of plasma there.
摘要翻译：为了在具有高导磁率的材料涂覆基板的磁控溅射装置中提供在目标表面上方至少24kA / m（300Oe）场强的足够的捕获场，目标组件由靶板（ 34,33,32），其被磁场必须穿过的穿过狭缝（35,36）分开，并且由固定有靶的背面的铜组成的支撑板（31）分开。为了避免材料从支撑板的任何释放和其在衬底上的沉积，每个狭缝（35,36）上的每个狭缝（35,36）的形状是这样的，使得在目标表面和支撑板（31）通过狭缝位于靶的背面，后者具有例如垂直于目标表面的两个部分，一个在目标表面处终止，另一个在支撑板处，其横向偏移并且通过与目标表面平行的第三部分连接。狭缝（35,36）中的磁场强度保持在64kA / m（800Oe）以下，以防止在那里形成等离子体。

4. 发明申请

US20130180850A1 MAGNETRON SPUTTERING APPARATUS 审中-公开
标题翻译： MAGNETRON喷射装置
公开(公告)号：US20130180850A1
公开(公告)日：2013-07-18
申请号：US13808956
申请日：2011-07-08
申请人： Hartmut Rohrmann , Martin Dubs
发明人： Hartmut Rohrmann , Martin Dubs
IPC分类号： C23C14/35
CPC分类号： C23C14/352 , H01J37/3408 , H01J37/3447 , H01J37/347
摘要： A magnetron sputtering apparatus comprises, within a vacuum chamber (1), a substrate support (2) holding a substrate (3) with an upward-facing plane substrate surface (4) which is to be coated. The substrate (3) may be a disk of, e.g., 200 mm diameter. At a distance from a centre plane (5) two oblong targets (7a, 7b) are symmetrically arranged which are inclined towards the centre plane (5) so as to enclose an acute angle (β; −β) of between 8° and 35° with the plane defined by the substrate surface (4). Above the substrate surface (4) a collimator (13) with equidistant rectangular collimator plates is arranged. With this configuration high uniformity of the coating is achievable, in particular, if the distance of the collimator (13) from the substrate surface (4) is chosen as a multiple n of the extension of the collimator (13) perpendicular to the said surface, preferably with n equalling 1 or 2, for suppressing ripple.
摘要翻译：磁控溅射装置包括在真空室（1）内的基板支撑件（2），该基板支撑件（2）用待涂覆的面向上的平面基板表面（4）保持基板（3）。衬底（3）可以是例如200mm直径的盘。在离中心平面（5）的距离处，两个长方形的靶（7a，7b）对称地布置成朝向中心平面（5）倾斜，以便包围在8°和35°之间的锐角（β-β） °，由基板表面（4）限定的平面。在基板表面（4）上方布置有具有等距矩形准直板的准直器（13）。利用这种结构可以实现涂层的高均匀性，特别是如果将准直器（13）与衬底表面（4）的距离选择为垂直于所述表面的准直器（13）的延伸部的倍数，优选为n等于1或2，以抑制纹波。

5. 发明申请

US20120031749A1 REACTIVE SPUTTERING WITH MULTIPLE SPUTTER SOURCES 审中-公开
标题翻译：具有多个溅射源的反应溅射
公开(公告)号：US20120031749A1
公开(公告)日：2012-02-09
申请号：US13258576
申请日：2010-04-23
申请人： Martin Dubs , Kurt Ruhm , Hartmut Rohrmann
发明人： Martin Dubs , Kurt Ruhm , Hartmut Rohrmann
IPC分类号： C23C14/35 , C23C14/34
CPC分类号： C23C14/0036 , C23C14/0094 , C23C14/352 , C23C14/505 , H01J37/3405 , H01J37/3426 , H01J37/3438 , H01J37/3444
摘要： The apparatus (1) for coating a substrate (14) by reactive sputtering comprises an axis (8), at least two targets (11,12) in an arrangement symmetrically to said axis (8) and a power supply connected to the targets (11,12), wherein the targets are alternatively operable as cathode and anode. The method is a method for manufacturing a coated substrate (14) by coating a substrate (14) by reactive sputtering in an apparatus (1) comprising an axis (8). The method comprises a) providing a substrate (14) to be coated; b) providing at least two targets (11,12) in an arrangement symmetrically to said axis (8); c) alternatively operating said targets (11,12) as cathode and anode during coating. Preferably, the targets (11,12) are rotated during sputtering and/or the targets are arranged concentrically, with an innermost circular target surrounded by at least one ring-shaped outer target.
摘要翻译：用于通过反应溅射涂覆衬底（14）的装置（1）包括轴线（8），至少两个对准所述轴线（8）的靶子（11,12）和连接到靶材 11,12），其中目标可替代地可操作为阴极和阳极。该方法是通过在包括轴线（8）的装置（1）中通过反应溅射涂覆基板（14）来制造涂覆的基板（14）的方法。该方法包括：a）提供待涂覆的基底（14）; b）以与所述轴线（8）对称的布置提供至少两个目标（11,12）; c）在涂覆期间可选地将所述靶（11,12）作为阴极和阳极操作。优选地，靶（11,12）在溅射期间旋转和/或目标物同心地布置，其中最内圆的圆形靶被至少一个环形外靶围绕。

6. 发明授权

US08540850B2 Target arrangement for mounting / dismounting and method of manufacturing 有权
标题翻译：安装/拆卸的目标布置及制造方法
公开(公告)号：US08540850B2
公开(公告)日：2013-09-24
申请号：US11639034
申请日：2006-12-14
申请人： Marcel Neusch , Peter Schlegel , Hartmut Rohrmann , Oliver Rattunde
发明人： Marcel Neusch , Peter Schlegel , Hartmut Rohrmann , Oliver Rattunde
IPC分类号： C23C14/00
CPC分类号： C23C14/3407 , H01J37/34 , H01J37/3423 , H01J37/3435
摘要： So as to provide a target arrangement with improved mounting and dismounting ability, the target arrangement comprises a plate along a plane (E) which has a border (7) defined by a first wedge surface (5u) angled to the addressed general plane (E) and a second wedge surface (5l) which is substantially planar as well and angled with respect to the generic plane (E). The two wedge surfaces mutually convert in a direction along the addressed plane (E) and from a more central area of the plate outwardly.
摘要翻译：为了提供具有改进的安装和拆卸能力的目标装置，目标装置包括沿着平面（E）的板，其具有由与所寻址的总平面成角度的第一楔形表面（5u）限定的边界（7））和第二楔形表面（51），其基本上是平面的，并且相对于通用平面（E）成角度。两个楔形表面在沿着寻址的平面（E）的方向上并且从板的更中心的区域向外相互转换。

7. 发明申请

US20050205412A1 Sputtering device for manufacturing thin films 审中-公开
标题翻译：用于制造薄膜的溅射装置
公开(公告)号：US20050205412A1
公开(公告)日：2005-09-22
申请号：US11085766
申请日：2005-03-21
申请人： Hartmut Rohrmann , Jens Baumann
发明人： Hartmut Rohrmann , Jens Baumann
IPC分类号： C23C14/34 , C23C14/35 , H01J37/34
CPC分类号： H01J37/3402 , C23C14/352 , H01J37/3408 , H01J37/3461
摘要： A sputtering station for depositing a thin film on a substrate includes a cathode comprising two targets placed opposite each other defining a plasma region, permanent magnets or coils to generate a magnetic field, yokes to direct the magnetic field and two independent power supplies connected to each target to independently control the energy to each target.
摘要翻译：用于在衬底上沉积薄膜的溅射站包括阴极，其包括彼此相对放置的两个靶，限定等离子体区域，用于产生磁场的永磁体或线圈，用于引导磁场的轭和连接到每个的两个独立电源目标是独立控制每个目标的能量。

8. 发明申请

US20070144899A1 Target arrangement for mounting / dismounting and method of manufacturing 有权
标题翻译：安装/拆卸的目标布置及制造方法
公开(公告)号：US20070144899A1
公开(公告)日：2007-06-28
申请号：US11639034
申请日：2006-12-14
申请人： Marcel Neusch , Peter Schlegel , Hartmut Rohrmann , Oliver Rattunde
发明人： Marcel Neusch , Peter Schlegel , Hartmut Rohrmann , Oliver Rattunde
IPC分类号： C23C14/00
CPC分类号： C23C14/3407 , H01J37/34 , H01J37/3423 , H01J37/3435
摘要： So as to provide a target arrangement with improved mounting and dismounting ability, the target arrangement comprises a plate along a plane (E) which has a border (7) defined by a first wedge surface (5u) angled to the addressed general plane (E) and a second wedge surface (5l) which is substantially planar as well and angled with respect to the generic plane (E). The two wedge surfaces mutually convert in a direction along the addressed plane (E) and from a more central area of the plate outwardly.
摘要翻译：为了提供具有改进的安装和拆卸能力的目标装置，目标装置包括沿着具有由第一楔形表面（5 u）定义的边界（7）的平面（E）的板，与所寻址的总平面（E）成角度，并且第二楔形表面（5L1）也是基本上平面的并且相对于通用平面（E）成一定角度。两个楔形表面在沿着寻址的平面（E）的方向上并且从板的更中心的区域向外相互转换。

9. 发明申请

US20080308412A1 MULTITARGET SPUTTER SOURCE AND METHOD FOR THE DEPOSITION OF MULTI-LAYERS 审中-公开
标题翻译：多层溅射源和多层沉积方法
公开(公告)号：US20080308412A1
公开(公告)日：2008-12-18
申请号：US12139096
申请日：2008-06-13
申请人： Hartmut Rohrmann
发明人： Hartmut Rohrmann
IPC分类号： C23C14/35 , C23C14/34
CPC分类号： H01J37/3408 , C23C14/352 , H01J37/3423 , H01J37/3426
摘要： Apparatus and methods for sputtering are provided, which are useful for sputtering high magnetization saturation materials. In one embodiment, a plurality of sputtering target arrangements are arranged concentrically, wherein independent magnetic fields can be generated at least partially above the respective target arrangements. One or several target arrangements can include respective upper and lower parts that are spaced from one another but arranged in essentially parallel planes. Methods include co-sputtering from multiple target arrangements to produce sputtered alloy layers on a substrate, as well as alternately sputtering from different target arrangements to produce a plurality of sputtered layers on the substrate.
摘要翻译：提供用于溅射的装置和方法，其可用于溅射高磁化饱和材料。在一个实施例中，多个溅射靶设备被同心地布置，其中可以至少部分地在相应的目标布置上方产生独立的磁场。一个或多个目标布置可以包括彼此间隔开但布置在基本上平行的平面中的相应的上部和下部。方法包括从多个目标布置共溅射以在基底上产生溅射的合金层，以及从不同的目标布置交替溅射以在基底上产生多个溅射层。

10. 发明申请

US20060054495A1 Substrate processing system 审中-公开
标题翻译：基板加工系统
公开(公告)号：US20060054495A1
公开(公告)日：2006-03-16
申请号：US11222270
申请日：2005-09-08
申请人： Hartmut Rohrmann , Oliver Rattunde
发明人： Hartmut Rohrmann , Oliver Rattunde
IPC分类号： C23C14/00 , C23C14/32
CPC分类号： H01L21/67173 , G11B5/8404 , H01L21/67709 , H01L21/67712 , H01L21/6776
摘要： In a substrate processing system for the treatment of substrates in vacuum two linear assemblies of process modules are stacked one above the other and connected by at least one lift module allowing for the transport from the first set to the second set. Along the traveling path through the first and second set of process modules there is arranged a linear synchronous motor. A substrate carrier with rails interacting with rollers mounted in the processing system is being held by the attractive forces of said linear synchronous motor in vertical position.
摘要翻译：在用于处理真空中的基板的基板处理系统中，处理模块的两个线性组件彼此层叠堆叠并由至少一个提升模块连接，允许从第一组传送到第二组。沿着通过第一和第二组过程模块的行进路径布置有线性同步电动机。具有与安装在处理系统中的辊相互作用的导轨的衬底载体正被所述线性同步电动机的吸引力保持在垂直位置。

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