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    • 1. 发明授权
    • Mechanism for the removal of slag in incineration plants
    • 焚烧厂除渣机理
    • US4976206A
    • 1990-12-11
    • US422966
    • 1989-10-18
    • Hansruedi SteinerHans Weber
    • Hansruedi SteinerHans Weber
    • F23J1/02
    • F23J1/02F23J2900/01021
    • A mechanism for the removal of incombustible residues from an incineration plant includes a slag shaft, a slag tank positioned under a mouth of the slag shaft and filled with water extending up to the mouth of the shaft. The incombustible residues dropping from the incineration plant furnace grate through the slag shaft collect in the slag tank and are discharged therefrom by a pusher plate via an upwardly sloping discharge path. The pusher plate is in operative connection with two thrust piston drives via two thrust rods and two rocking levers. The joint connecting the thrust rod with the rocking lever is arranged in such a way that it is not immersed in the water bath either in the rear position of the pusher plate or in the discharge position of the pusher plate. Through the direct coupling to the joint, the thrust rod and the rocking lever can operate in the same vertical plane, so that no additional moments are exerted on the rocking shaft. This leads to a longer life for the lint and also to increased operational reliability and easier maintenance.
    • 用于从焚化厂除去不可燃残余物的机构包括炉渣杆,位于炉渣杆口下方的炉渣罐,并且填充有直到轴的口部延伸的水。 从焚烧炉炉排落下的不燃物残渣通过炉渣收集在渣槽中,并通过向上倾斜的排放路径由推动板排出。 推动板通过两个推力杆和两个摇杆与两个推力活塞驱动器操作连接。 将推杆与摆动杆连接的连接部配置成不会在推动板的后方位置或推动板的排出位置处浸入水浴中。 通过与接头的直接连接,推杆和摇杆可以在相同的垂直平面上运行,从而不会在摇摆轴上施加额外的力矩。 这样可以延长棉绒的使用寿命,同时提高操作的可靠性和更容易的维护。
    • 2. 发明授权
    • Charge compensation semiconductor device
    • 充电补偿半导体器件
    • US08901642B2
    • 2014-12-02
    • US13414037
    • 2012-03-07
    • Hans WeberFranz Hirler
    • Hans WeberFranz Hirler
    • H01L29/78
    • H01L29/7802H01L29/0634H01L29/1095H01L29/167H01L29/32H01L29/407H01L29/408H01L29/41766H01L29/66727
    • A semiconductor device includes a semiconductor body having a first surface defining a vertical direction and a source metallization arranged on the first surface. In a vertical cross-section the semiconductor body further includes: a drift region of a first conductivity type; at least two compensation regions of a second conductivity type each of which forms a pn-junction with the drift region and is in low resistive electric connection with the source metallization; a drain region of the first conductivity type having a maximum doping concentration higher than a maximum doping concentration of the drift region, and a third semiconductor layer of the first conductivity type arranged between the drift region and the drain region and includes at least one of a floating field plate and a floating semiconductor region of the second conductivity type forming a pn-junction with the third semiconductor layer.
    • 半导体器件包括具有限定垂直方向的第一表面和布置在第一表面上的源极金属化的半导体本体。 在垂直横截面中,半导体主体还包括:第一导电类型的漂移区; 至少两个第二导电类型的补偿区域,每个补偿区域与漂移区域形成pn结并与源极金属化处于低电阻电连接; 具有高于漂移区的最大掺杂浓度的最大掺杂浓度的第一导电类型的漏极区和布置在漂移区和漏极区之间的第一导电类型的第三半导体层,并且包括以下中的至少一个: 浮置场板和第二导电类型的浮置半导体区域形成与第三半导体层的pn结。