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    • 2. 发明授权
    • Semiconductor arrangement with active drift zone
    • 具有主动漂移区的半导体装置
    • US08866253B2
    • 2014-10-21
    • US13362038
    • 2012-01-31
    • Rolf WeisGerald DeboyMichael TreuArmin WillmerothHans Weber
    • Rolf WeisGerald DeboyMichael TreuArmin WillmerothHans Weber
    • H01L27/00
    • H01L27/0207H01L21/84H01L21/845H01L27/06H01L27/0629H01L27/088H01L27/0886H01L27/1211H01L29/4236H01L29/78H03K17/063H03K17/102
    • A semiconductor device arrangement includes a first semiconductor device having a load path and a plurality of second semiconductor devices, each having a load path between a first and a second load terminal and a control terminal. The second semiconductor devices have their load paths connected in series and connected in series to the load path of the first semiconductor device. Each of the second semiconductor devices has its control terminal connected to the load terminal of one of the other second semiconductor devices, and one of the second semiconductor devices has its control terminal connected to one of the load terminals of the first semiconductor device. Each of the second semiconductor devices has at least one device characteristic. At least one device characteristic of at least one of the second semiconductor devices is different from the corresponding device characteristic of others of the second semiconductor devices.
    • 半导体器件布置包括具有负载路径的第一半导体器件和多个第二半导体器件,每个第二半导体器件具有在第一和第二负载端子与控制端子之间的负载路径。 第二半导体器件的负载路径串联连接并与第一半导体器件的负载路径串联连接。 每个第二半导体器件的控制端子连接到其它第二半导体器件之一的负载端子,并且其中一个第二半导体器件的控制端子连接到第一半导体器件的负载端子之一。 每个第二半导体器件具有至少一个器件特性。 第二半导体器件中的至少一个的至少一个器件特征与第二半导体器件中的其它器件的相应器件特性不同。
    • 4. 发明授权
    • Transistor with controllable compensation regions
    • 具有可控补偿区域的晶体管
    • US08803205B2
    • 2014-08-12
    • US13484490
    • 2012-05-31
    • Armin WillmerothFranz HirlerHans WeberMichael Treu
    • Armin WillmerothFranz HirlerHans WeberMichael Treu
    • H01L29/66
    • H01L29/7813H01L27/088H01L27/098H01L29/0634H01L29/407H01L29/41766H01L29/42356H01L29/7803H01L29/7831
    • A semiconductor device includes a gate terminal, at least one control terminal and first and second load terminals and at least one device cell. The at least one device cell includes a MOSFET device having a load path and a control terminal, the control terminal coupled to the gate terminal and a JFET device having a load path and a control terminal, the load path connected in series with the load path of the MOSFET device between the load terminals. The at least one device cell further includes a first coupling transistor having a load path and a control terminal, the load path coupled between the control terminal of the JFET device and one of the source terminal and the gate terminal, and the control terminal coupled to the at least one control terminal of the transistor device.
    • 半导体器件包括栅极端子,至少一个控制端子以及第一和第二负载端子以及至少一个器件单元。 所述至少一个器件单元包括具有负载路径和控制端子的MOSFET器件,所述控制端子耦合到所述栅极端子以及具有负载路径和控制端子的JFET器件,所述负载路径与所述负载路径串联连接 的MOSFET器件在负载端子之间。 所述至少一个器件单元还包括具有负载路径和控制端子的第一耦合晶体管,所述负载路径耦合在所述JFET器件的控制端子与所述源极端子和所述栅极端子之一之间,并且所述控制端子耦合到 晶体管器件的至少一个控制端子。
    • 7. 发明授权
    • Heterojunction semiconductor device and method
    • 异质结半导体器件及方法
    • US08492771B2
    • 2013-07-23
    • US11862661
    • 2007-09-27
    • Michael RübMichael TreuArmin WillmerothFranz Hirler
    • Michael RübMichael TreuArmin WillmerothFranz Hirler
    • H01L29/15H01L31/0312
    • H01L29/7802H01L29/0634H01L29/0878H01L29/1095H01L29/165H01L29/267H01L29/41775H01L29/66068
    • A semiconductor device includes a first semiconductor substrate of a first band-gap material and a second semiconductor substrate of a second band-gap material. The second band-gap material has a lower band-gap than the first band-gap material. A heterojunction is formed between the first semiconductor substrate and the second semiconductor substrate substantially in a first plane. The semiconductor device further includes, in a cross-section which is perpendicular to the first plane, a first semiconductor region of a first conductivity type and a second semiconductor region of the first conductivity type both of which extend from the second semiconductor substrate at least partially into the first semiconductor substrate. The first and second semiconductor regions are spaced in the first semiconductor substrate from each other in a direction parallel to the first plane by a first distance which is arranged in an area proximate to the heterojunction and which is larger than a second distance which is arranged in an area distal to the heterojunction.
    • 半导体器件包括第一带隙材料的第一半导体衬底和第二带隙材料的第二半导体衬底。 第二带隙材料具有比第一带隙材料低的带隙。 基本上在第一平面中,在第一半导体衬底和第二半导体衬底之间形成异质结。 所述半导体器件还包括垂直于所述第一平面的横截面,所述第一导电类型的第一半导体区域和所述第一导电类型的第二半导体区域从所述第二半导体衬底至少部分地延伸 进入第一半导体衬底。 第一和第二半导体区域在第一半导体衬底中沿平行于第一平面的方向彼此间隔开第一距离,第一距离布置在接近异质结的区域中,并且大于第二距离 远离异质结的区域。