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1. 发明授权

US6002426A Inverted alignment station and method for calibrating needles of probe card for probe testing of integrated circuits 失效
标题翻译：反向对准站和校准探针卡针的方法用于集成电路的探针测试
公开(公告)号：US6002426A
公开(公告)日：1999-12-14
申请号：US887073
申请日：1997-07-02
申请人： Gerald W. Back , Joseph A. Mirowski
发明人： Gerald W. Back , Joseph A. Mirowski
IPC分类号： G01R31/28 , H04N7/18 , H04N13/00 , H04N17/00
CPC分类号： H04N13/0438 , H04N13/0048 , H04N13/0239 , H04N13/0497 , H04N7/181 , G01R31/2886 , H04N13/004 , H04N13/0055 , H04N13/0059 , H04N13/0296 , H04N13/044
摘要： A probe needle alignment device supports a probe card assembly with probe needles extending upward. A microscope includes a first eyepiece aligned with the probe needles in its field of view. A first video camera is positioned in optical alignment with the first eyepiece to view probe needles through the first eyepiece. An overdriver includes a transparent planar plate movably disposed between the microscope and the probe needles to displace contact tips of the probe needles through an overdrive distance. A mask plate has a plurality of spots located at positions corresponding precisely to positions of contact pads of an integrated circuit to be probe tested. A second video camera includes the spots within its field of view. Video signals produced by the first and second video cameras are combined to simultaneously represent images of the probe needles and the spots on the probe plate are converted to video images and overlapping images of the probe needles and the spots are simultaneously displayed in a virtual reality headset to aid in alignment of contact tips of probe needles with corresponding spots of the mask plate.
摘要翻译：探头针对准装置支撑探针卡组件，探头针向上延伸。显微镜包括在其视场中与探针对准的第一目镜。第一摄像机定位成与第一目镜光学对准以通过第一目镜来观察探针。一个起子包括可移动地设置在显微镜和探针之间的透明平面板，以通过过驱动距离来移动探针的接触尖端。掩模板具有位于与要被探测的集成电路的接触焊盘的位置精确对应的位置处的多个点。第二台摄像机包括其视野内的景点。由第一和第二摄像机产生的视频信号被组合以同时表示探针的图像，并将探针板上的斑点转换成视频图像，并且将探针的重叠图像同时显示在虚拟现实耳机中以帮助探针的接触尖端与掩模板的相应点对准。

2. 发明申请

US20080204062A1 Cantilever probe card 有权
标题翻译：悬臂式探针卡
公开(公告)号：US20080204062A1
公开(公告)日：2008-08-28
申请号：US11712733
申请日：2007-02-28
申请人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
发明人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
IPC分类号： G01R1/067 , H01R43/00
CPC分类号： G01R1/07342 , G01R1/06727 , G01R3/00 , H01R11/18 , H01R2201/20 , Y10T29/49117
摘要： A method and apparatus for a flattened probe element wire is provided. A probe element wire comprises a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may comprise a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.
摘要翻译：提供了一种用于扁平的探针元件线的方法和装置。探针元件线包括梁部分和尖端部分。顶端部分的至少一部分变平。扁平的探针元件线可能具有较大的z方向高度强度，从而增加最大探针元件线z向垂直力。扁平化的探针元件线在平坦的探针元件导线尖端中也可能具有降低的变化。探针卡组件可以包括衬底和由衬底支撑的多个至少部分平坦化的探针元件线。这种探针卡组件可以具有延长的使用寿命并且保持在设计参数中以供更长的使用期限。

3. 发明授权

US06426637B1 Alignment guide and signal transmission apparatus and method for spring contact probe needles 失效
标题翻译：用于弹簧接触探针的对准导向器和信号传输装置及方法
公开(公告)号：US06426637B1
公开(公告)日：2002-07-30
申请号：US09469944
申请日：1999-12-21
申请人： Son N. Dang , Gerald W. Back , H. Dan Higgins , Scott R. Williams
发明人： Son N. Dang , Gerald W. Back , H. Dan Higgins , Scott R. Williams
IPC分类号： G01R3102
CPC分类号： G01R1/07357
摘要： Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles “scrubbing” against bonding pads is achieved at high test signal frequencies by a probe needle assembly (14) including a plurality of probe needles (13) each having a shank portion (13A), a curved flex portion (13B), and a contact tip (13C) on a free end of the flex portion, the shank portion (13A) being electrically coupled to an electrical test system. The shank portion (13A) of each probe needle is attached to a surface (16A) of an insulative layer (16). The insulative layer is supported on a ground plane conductor 25. The flex portions (13B) of the probe needles (13) extend beyond an edge of the insulative layer. A portion (24) of the ground plane conductor (25) extends beyond the insulator (16) and is adjacent to all but an extending tip portion (30) of the flex portion (13B) of each probe needle (13). A thin insulator/guide layer (26B) is attached to the extending portion (24) of the ground plane conductor (25) and disposed between the extending portion and the flex portions (13B), the insulator/guide layer (26B) having a smooth, low friction surface to guide/stabilize the flex portions (13B) during flexing. The insulative layer (16) and insulator/guide layer (26B) provide matched impedance between the shank and flex portions of the probe needles.
摘要翻译：通过包括多个探针（13）的探针针组件（14）在高测试信号频率下实现集成电路的探针测试，以便实现低探针针接触电阻而不用探针针对接合焊盘“擦洗” 在柔性部分的自由端上的柄部分（13A），弯曲弯曲部分（13B）和接触尖端（13C），所述柄部分（13A）电耦合到电气测试系统。每个探针的柄部分（13A）附接到绝缘层（16）的表面（16A）。绝缘层被支撑在接地平面导体25上。探针（13）的挠曲部分（13B）延伸超过绝缘层的边缘。接地平面导体（25）的部分（24）延伸超过绝缘体（16），并且与每个探针（13）的柔性部分（13B）的延伸的尖端部分（30）相邻。薄的绝缘体/引导层（26B）被附接到接地平面导体（25）的延伸部分（24）并且设置在延伸部分和挠曲部分（13B）之间，绝缘体/引导层（26B）具有光滑的低摩擦表面，以在弯曲期间引导/稳定柔性部分（13B）。绝缘层（16）和绝缘体/引导层（26B）在探针的柄和挠曲部分之间提供匹配的阻抗。

4. 发明授权

US08222912B2 Probe head structure for probe test cards 有权
标题翻译：探头测头卡头探头结构
公开(公告)号：US08222912B2
公开(公告)日：2012-07-17
申请号：US12403264
申请日：2009-03-12
申请人： Son N. Dang , Gerald W. Back , Rehan Kazmi
发明人： Son N. Dang , Gerald W. Back , Rehan Kazmi
IPC分类号： G01R1/067
CPC分类号： G01R1/0675 , G01R1/07357
摘要： A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.
摘要翻译：用于测试待测器件的探头组件包括多个测试探头和探头头结构。探针头结构包括引导板和模板，并且支撑多个测试探针，每个测试探针包括具有尖端的尖端部分，该尖端部分具有与被测器件电接触的尖端，弯曲的柔顺体部分和具有尾部的尾部结束与空间变压器的电气接触。本发明的实施例包括相对于测试探针的末端部分抵消测试探针的尾部的位置，使得测试探针的末端部分被偏压在导板的孔内，使用硬停止特征有助于保持测试探针相对于导板和探针斜坡特征的位置，以改善擦洗行为。

5. 发明申请

US20100176831A1 Probe Test Card with Flexible Interconnect Structure 审中-公开
标题翻译：具有灵活互连结构的探头测试卡
公开(公告)号：US20100176831A1
公开(公告)日：2010-07-15
申请号：US12353879
申请日：2009-01-14
申请人： William M. Palcisko , Gerald W. Back , Bahadir Tunaboylu
发明人： William M. Palcisko , Gerald W. Back , Bahadir Tunaboylu
IPC分类号： G01R31/02
CPC分类号： G01R1/07378 , G01R1/07357
摘要： A probe test card assembly for testing of a device under test includes a printed circuit board (PCB), a space transformer, a probe head structure and a flexible interconnect structure. The space transformer has a first plurality of electrical contacts disposed thereon for providing electrical connections with a plurality of contacts disposed on the PCB and a second plurality of electrical contacts disposed thereon for making contact with a plurality of test probes. Each test probe from the plurality of test probes has a first end for making electrical contact with a device under test and a second end for making electrical contact with one of the electrical contacts from the second plurality of electrical contacts on the space transformer. The flexible interconnect structure provides electrical connections between the first plurality of electrical contacts on the space transformer and the plurality of electrical contacts on the PCB.
摘要翻译：用于测试被测器件的探针测试卡组件包括印刷电路板（PCB），空间变压器，探针头结构和柔性互连结构。空间变压器具有设置在其上的第一多个电触点，用于提供与设置在PCB上的多个触点的电连接以及设置在其上的用于与多个测试探针接触的第二多个电触点。来自多个测试探针的每个测试探针具有用于与被测器件进行电接触的第一端和用于与来自空间变压器上的第二多个电触点的电触点之一电接触的第二端。柔性互连结构提供空间变压器上的第一组多个电触点与PCB上的多个电触点之间的电连接。

6. 发明授权

US07679383B2 Cantilever probe card 有权
标题翻译：悬臂式探针卡
公开(公告)号：US07679383B2
公开(公告)日：2010-03-16
申请号：US11712733
申请日：2007-02-28
申请人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
发明人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
IPC分类号： G01R31/02
CPC分类号： G01R1/07342 , G01R1/06727 , G01R3/00 , H01R11/18 , H01R2201/20 , Y10T29/49117
摘要： A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.
摘要翻译：提供了一种用于扁平的探针元件线的方法和装置。探针元件线包括梁部分和尖端部分。顶端部分的至少一部分变平。扁平的探针元件线可能具有较大的z方向高度强度，从而增加最大探针元件线z向垂直力。扁平化的探针元件线在平坦的探针元件导线尖端中也可能具有降低的变化。探针卡组件可以包括衬底和由衬底支撑的多个至少部分平坦的探针元件线。这种探针卡组件可以具有延长的使用寿命并且保持在设计参数中以供更长的使用期限。

7. 发明申请

US20100231249A1 Probe Head Structure For Probe Test Cards 有权
标题翻译：探头头结构探头测试卡
公开(公告)号：US20100231249A1
公开(公告)日：2010-09-16
申请号：US12403264
申请日：2009-03-12
申请人： Son N. Dang , Gerald W. Back , Rehan Kazmi
发明人： Son N. Dang , Gerald W. Back , Rehan Kazmi
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R1/0675 , G01R1/07357
摘要： A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.
摘要翻译：用于测试待测器件的探头组件包括多个测试探头和探头头结构。探针头结构包括引导板和模板，并且支撑多个测试探针，每个测试探针包括具有尖端的尖端部分，该尖端部分具有与被测器件电接触的尖端，弯曲的柔顺体部分和具有尾部的尾部结束与空间变压器的电气接触。本发明的实施例包括使测试探针的尾部相对于测试探针的末端部分的位置偏移，使得测试探针的末端部分被偏压在引导板的孔内，使用硬停止特征有助于保持测试探针相对于导板和探针斜坡特征的位置，以改善擦洗行为。

8. 发明申请

US20090174423A1 Bond Reinforcement Layer for Probe Test Cards 审中-公开
标题翻译：用于探头测试卡的粘结强化层
公开(公告)号：US20090174423A1
公开(公告)日：2009-07-09
申请号：US12398905
申请日：2009-03-05
申请人： Peter J. Klaerner , Son N. Dang , Pastor Yanga , Gerald W. Back , Victor Golubic , Bahadir Tunaboylu
发明人： Peter J. Klaerner , Son N. Dang , Pastor Yanga , Gerald W. Back , Victor Golubic , Bahadir Tunaboylu
IPC分类号： G01R31/02
CPC分类号： G01R1/0466 , B82Y30/00 , G01R1/07342 , G01R1/0735 , G01R1/07357 , Y10T29/49147
摘要： A probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer. The reinforcing layer may be a composite reinforcing layer that includes multiple layers of material to achieve a particular result. According to one embodiment of the invention, the reinforcing layer includes a powder layer disposed on the substrate and an adhesive layer formed on the powder layer. The composite reinforcing layer may be compliant to allow the probes to flex and move as intended, without limiting deflection capability. The composite reinforcing layer may be removable to allow access to probes for repair.
摘要翻译：探针卡组件包括基底和结合到基底表面的多个探针。探针卡组件还包括设置在基板的表面上的加强层。增强层与每个探针的下部接触，其中每个探针的剩余部分没有加强层。增强层可以是复合增强层，其包括多层材料以实现特定的结果。根据本发明的一个实施例，加强层包括设置在基底上的粉末层和形成在粉末层上的粘合剂层。复合增强层可以是顺应性的，以允许探针按预期的方式弯曲和移动，而不限制挠曲能力。复合增强层可以是可移除的，以允许进入探针以进行修复。

9. 发明授权

US07364461B1 Direct attachment of coaxial cables 有权
标题翻译：直接连接同轴电缆
公开(公告)号：US07364461B1
公开(公告)日：2008-04-29
申请号：US11712796
申请日：2007-02-28
申请人： Gerald W. Back , Roger A. Sneddon
发明人： Gerald W. Back , Roger A. Sneddon
IPC分类号： H01R9/05
CPC分类号： H01R9/0515 , H05K1/0243 , H05K3/0047 , H05K3/429 , H05K2201/096 , H05K2201/09645 , H05K2201/09809 , H05K2201/09845 , H05K2201/10356 , H05K2203/0207 , H05K2203/0242 , H05K2203/175
摘要： Techniques for attaching a coaxial cable to an assembly are provided. A conductive layer is applied to a top and bottom surface of a first layer and the bottom surface of a second layer. An aperture is formed through the first layer. The first layer is affixed to the top of the second layer to form an assembly. A signal via and one or more shield vias are formed in the assembly. The signal via and the one or more shield vias, are covered with a conductive layer. The signal via is then electrically separated from the shield vias and the aperture. A stripped coaxial cable may then be inserted into the aperture so that the conductive core of the coaxial cable is electrically connected to the signal via but electrically isolated from the shield vias and aperture. The coaxial cable may then be secured to the assembly.
摘要翻译：提供了将同轴电缆连接到组件的技术。将导电层施加到第一层的顶表面和底表面以及第二层的底表面。通过第一层形成孔。第一层固定到第二层的顶部以形成组件。信号通孔和一个或多个屏蔽通孔形成在组件中。信号通孔和一个或多个屏蔽通孔被导电层覆盖。然后，信号通孔与屏蔽通孔和孔径电隔离。然后可以将剥离的同轴电缆插入到孔中，使得同轴电缆的导电芯电连接到信号通孔，但是与屏蔽通孔和孔电隔离。然后可以将同轴电缆固定到组件。

10. 发明授权

US06908364B2 Method and apparatus for probe tip cleaning and shaping pad 有权
标题翻译：探针头清洁和成型垫的方法和装置
公开(公告)号：US06908364B2
公开(公告)日：2005-06-21
申请号：US09921327
申请日：2001-08-02
申请人： Gerald W. Back , Son Dang , Bahadir Tunaboylu
发明人： Gerald W. Back , Son Dang , Bahadir Tunaboylu
IPC分类号： B24B19/16 , B24B29/08 , B24D3/28 , B24D13/14 , B24D18/00 , B24D11/00
CPC分类号： B24B29/08 , B24B19/16 , B24D3/28 , B24D13/142 , B24D18/0045 , B24D18/0072
摘要： A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.
摘要翻译：提供了一种使用多层粘合剂和磨料垫来清洁和成形探针尖端的方法和装置。多层粘合剂和研磨垫被构造在诸如硅晶片的支撑结构的表面上，并且由与磨料颗粒接触的粘合剂制成。粘合剂以每层粘合剂之间的磨料颗粒层施加。研磨颗粒的尺寸和材料可以在层间变化以实现清洁，成型和抛光目标。

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