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1. 发明授权

US08222912B2 Probe head structure for probe test cards 有权
标题翻译：探头测头卡头探头结构
公开(公告)号：US08222912B2
公开(公告)日：2012-07-17
申请号：US12403264
申请日：2009-03-12
申请人： Son N. Dang , Gerald W. Back , Rehan Kazmi
发明人： Son N. Dang , Gerald W. Back , Rehan Kazmi
IPC分类号： G01R1/067
CPC分类号： G01R1/0675 , G01R1/07357
摘要： A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.
摘要翻译：用于测试待测器件的探头组件包括多个测试探头和探头头结构。探针头结构包括引导板和模板，并且支撑多个测试探针，每个测试探针包括具有尖端的尖端部分，该尖端部分具有与被测器件电接触的尖端，弯曲的柔顺体部分和具有尾部的尾部结束与空间变压器的电气接触。本发明的实施例包括相对于测试探针的末端部分抵消测试探针的尾部的位置，使得测试探针的末端部分被偏压在导板的孔内，使用硬停止特征有助于保持测试探针相对于导板和探针斜坡特征的位置，以改善擦洗行为。

2. 发明授权

US07679383B2 Cantilever probe card 有权
标题翻译：悬臂式探针卡
公开(公告)号：US07679383B2
公开(公告)日：2010-03-16
申请号：US11712733
申请日：2007-02-28
申请人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
发明人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
IPC分类号： G01R31/02
CPC分类号： G01R1/07342 , G01R1/06727 , G01R3/00 , H01R11/18 , H01R2201/20 , Y10T29/49117
摘要： A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.
摘要翻译：提供了一种用于扁平的探针元件线的方法和装置。探针元件线包括梁部分和尖端部分。顶端部分的至少一部分变平。扁平的探针元件线可能具有较大的z方向高度强度，从而增加最大探针元件线z向垂直力。扁平化的探针元件线在平坦的探针元件导线尖端中也可能具有降低的变化。探针卡组件可以包括衬底和由衬底支撑的多个至少部分平坦的探针元件线。这种探针卡组件可以具有延长的使用寿命并且保持在设计参数中以供更长的使用期限。

3. 发明申请

US20080204062A1 Cantilever probe card 有权
标题翻译：悬臂式探针卡
公开(公告)号：US20080204062A1
公开(公告)日：2008-08-28
申请号：US11712733
申请日：2007-02-28
申请人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
发明人： Lich Thanh Tran , Son N. Dang , Gerald W. Back , Reynaldo M. Rincon
IPC分类号： G01R1/067 , H01R43/00
CPC分类号： G01R1/07342 , G01R1/06727 , G01R3/00 , H01R11/18 , H01R2201/20 , Y10T29/49117
摘要： A method and apparatus for a flattened probe element wire is provided. A probe element wire comprises a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may comprise a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.
摘要翻译：提供了一种用于扁平的探针元件线的方法和装置。探针元件线包括梁部分和尖端部分。顶端部分的至少一部分变平。扁平的探针元件线可能具有较大的z方向高度强度，从而增加最大探针元件线z向垂直力。扁平化的探针元件线在平坦的探针元件导线尖端中也可能具有降低的变化。探针卡组件可以包括衬底和由衬底支撑的多个至少部分平坦化的探针元件线。这种探针卡组件可以具有延长的使用寿命并且保持在设计参数中以供更长的使用期限。

4. 发明授权

US06426637B1 Alignment guide and signal transmission apparatus and method for spring contact probe needles 失效
标题翻译：用于弹簧接触探针的对准导向器和信号传输装置及方法
公开(公告)号：US06426637B1
公开(公告)日：2002-07-30
申请号：US09469944
申请日：1999-12-21
申请人： Son N. Dang , Gerald W. Back , H. Dan Higgins , Scott R. Williams
发明人： Son N. Dang , Gerald W. Back , H. Dan Higgins , Scott R. Williams
IPC分类号： G01R3102
CPC分类号： G01R1/07357
摘要： Probe testing of an integrated circuit so as to achieve low probe needle contact resistance without probe needles “scrubbing” against bonding pads is achieved at high test signal frequencies by a probe needle assembly (14) including a plurality of probe needles (13) each having a shank portion (13A), a curved flex portion (13B), and a contact tip (13C) on a free end of the flex portion, the shank portion (13A) being electrically coupled to an electrical test system. The shank portion (13A) of each probe needle is attached to a surface (16A) of an insulative layer (16). The insulative layer is supported on a ground plane conductor 25. The flex portions (13B) of the probe needles (13) extend beyond an edge of the insulative layer. A portion (24) of the ground plane conductor (25) extends beyond the insulator (16) and is adjacent to all but an extending tip portion (30) of the flex portion (13B) of each probe needle (13). A thin insulator/guide layer (26B) is attached to the extending portion (24) of the ground plane conductor (25) and disposed between the extending portion and the flex portions (13B), the insulator/guide layer (26B) having a smooth, low friction surface to guide/stabilize the flex portions (13B) during flexing. The insulative layer (16) and insulator/guide layer (26B) provide matched impedance between the shank and flex portions of the probe needles.
摘要翻译：通过包括多个探针（13）的探针针组件（14）在高测试信号频率下实现集成电路的探针测试，以便实现低探针针接触电阻而不用探针针对接合焊盘“擦洗” 在柔性部分的自由端上的柄部分（13A），弯曲弯曲部分（13B）和接触尖端（13C），所述柄部分（13A）电耦合到电气测试系统。每个探针的柄部分（13A）附接到绝缘层（16）的表面（16A）。绝缘层被支撑在接地平面导体25上。探针（13）的挠曲部分（13B）延伸超过绝缘层的边缘。接地平面导体（25）的部分（24）延伸超过绝缘体（16），并且与每个探针（13）的柔性部分（13B）的延伸的尖端部分（30）相邻。薄的绝缘体/引导层（26B）被附接到接地平面导体（25）的延伸部分（24）并且设置在延伸部分和挠曲部分（13B）之间，绝缘体/引导层（26B）具有光滑的低摩擦表面，以在弯曲期间引导/稳定柔性部分（13B）。绝缘层（16）和绝缘体/引导层（26B）在探针的柄和挠曲部分之间提供匹配的阻抗。

5. 发明申请

US20100231249A1 Probe Head Structure For Probe Test Cards 有权
标题翻译：探头头结构探头测试卡
公开(公告)号：US20100231249A1
公开(公告)日：2010-09-16
申请号：US12403264
申请日：2009-03-12
申请人： Son N. Dang , Gerald W. Back , Rehan Kazmi
发明人： Son N. Dang , Gerald W. Back , Rehan Kazmi
IPC分类号： G01R1/067 , G01R31/02
CPC分类号： G01R1/0675 , G01R1/07357
摘要： A probe head assembly for testing a device under test includes a plurality of test probes and a probe head structure. The probe head structure includes a guide plate and a template and supports a plurality of test probes that each includes a tip portion with a tip end for making electrical contact with a device under test, a curved compliant body portion and a tail portion with a tail end for making electrical contact with the space transformer. Embodiments of the invention include offsetting the position of the tail portions of the test probes with respect to the tip portions of the test probes so that the tip portions of the test probes are biased within the apertures of the guide plate, using hard stop features to help maintain the position of the test probes with respect to the guide plate and probe ramp features to improve scrubbing behavior.
摘要翻译：用于测试待测器件的探头组件包括多个测试探头和探头头结构。探针头结构包括引导板和模板，并且支撑多个测试探针，每个测试探针包括具有尖端的尖端部分，该尖端部分具有与被测器件电接触的尖端，弯曲的柔顺体部分和具有尾部的尾部结束与空间变压器的电气接触。本发明的实施例包括使测试探针的尾部相对于测试探针的末端部分的位置偏移，使得测试探针的末端部分被偏压在引导板的孔内，使用硬停止特征有助于保持测试探针相对于导板和探针斜坡特征的位置，以改善擦洗行为。

6. 发明申请

US20090174423A1 Bond Reinforcement Layer for Probe Test Cards 审中-公开
标题翻译：用于探头测试卡的粘结强化层
公开(公告)号：US20090174423A1
公开(公告)日：2009-07-09
申请号：US12398905
申请日：2009-03-05
申请人： Peter J. Klaerner , Son N. Dang , Pastor Yanga , Gerald W. Back , Victor Golubic , Bahadir Tunaboylu
发明人： Peter J. Klaerner , Son N. Dang , Pastor Yanga , Gerald W. Back , Victor Golubic , Bahadir Tunaboylu
IPC分类号： G01R31/02
CPC分类号： G01R1/0466 , B82Y30/00 , G01R1/07342 , G01R1/0735 , G01R1/07357 , Y10T29/49147
摘要： A probe card assembly includes a substrate and a plurality of probes bonded to a surface of the substrate. The probe card assembly also includes a reinforcing layer provided on the surface of the substrate. The reinforcing layer is in contact with a lower portion of each of the probes, where a remaining portion of each of the probes is free from the reinforcing layer. The reinforcing layer may be a composite reinforcing layer that includes multiple layers of material to achieve a particular result. According to one embodiment of the invention, the reinforcing layer includes a powder layer disposed on the substrate and an adhesive layer formed on the powder layer. The composite reinforcing layer may be compliant to allow the probes to flex and move as intended, without limiting deflection capability. The composite reinforcing layer may be removable to allow access to probes for repair.
摘要翻译：探针卡组件包括基底和结合到基底表面的多个探针。探针卡组件还包括设置在基板的表面上的加强层。增强层与每个探针的下部接触，其中每个探针的剩余部分没有加强层。增强层可以是复合增强层，其包括多层材料以实现特定的结果。根据本发明的一个实施例，加强层包括设置在基底上的粉末层和形成在粉末层上的粘合剂层。复合增强层可以是顺应性的，以允许探针按预期的方式弯曲和移动，而不限制挠曲能力。复合增强层可以是可移除的，以允许进入探针以进行修复。

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