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1. 发明申请

US20080266884A1 Cooling Device for Cooling a Semiconductor Component, in Particular, an Optoelectronic Semiconductor Component 审中-公开
标题翻译：用于冷却半导体部件的冷却装置，特别是光电子半导体部件
公开(公告)号：US20080266884A1
公开(公告)日：2008-10-30
申请号：US11794583
申请日：2005-12-01
申请人： Georg Bogner , Herbert Brunner , Stefan Grotsch , Guy Lefranc
发明人： Georg Bogner , Herbert Brunner , Stefan Grotsch , Guy Lefranc
IPC分类号： F21V29/00
CPC分类号： H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The invention relates to a cooling device for cooling a semiconductor component (1), in particular an optoelectronic semiconductor component, comprising at least partially first and second layers and a heal dissipation device (4), wherein said first and second layers are flatly placed on top of each other and one layer is provided, at least partially, with a structure for receiving said heat dissipation device (4).
摘要翻译：本发明涉及用于冷却半导体部件（1）的冷却装置，特别是包括至少部分第一和第二层的光电子半导体部件和愈合耗散装置（4），其中所述第一和第二层平坦地放置在至少部分地具有用于接收所述散热装置（4）的结构的一个层。

2. 发明申请

US20080315227A1 Light-Emitting Diode Arrangement 有权
标题翻译：发光二极管布置
公开(公告)号：US20080315227A1
公开(公告)日：2008-12-25
申请号：US11631058
申请日：2005-05-18
申请人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
发明人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.
摘要翻译：公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。

3. 发明申请

US20090001490A1 Optoelectronic Component that Emits Electromagnetic Radiation and Illumination Module 有权
标题翻译：发出电磁辐射和照明模块的光电子元件
公开(公告)号：US20090001490A1
公开(公告)日：2009-01-01
申请号：US11658822
申请日：2005-07-21
申请人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis
发明人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis
IPC分类号： H01L31/0232 , H01L23/34 , H01L23/495
CPC分类号： H01L33/60 , F21S41/143 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from one another which is less than or equal to one-and-a-half lateral edge lengths of the semiconductor chips and greater than or equal to 0 μm. In addition, an illumination module comprising such a component is disclosed.
摘要翻译：一种发射电磁辐射的光电子部件，包括具有空腔的壳体，所述腔体形成沟槽状，并且在所述空腔中具有以线性排列布置的多个半导体芯片。两个相邻的半导体芯片彼此之间具有小于或等于半导体芯片的一半半边缘长度并且大于或等于0μm的距离。另外，公开了一种包括这种部件的照明模块。

4. 发明申请

US20080192153A1 Projection Apparatus 有权
标题翻译：投影仪
公开(公告)号：US20080192153A1
公开(公告)日：2008-08-14
申请号：US11914020
申请日：2006-04-21
申请人： Gerhard Kuhn , Moritz Engl , Patrick Kromotis , Stefan Grotsch , Josef Huttner , Mario Wanninger , Georg Bogner
发明人： Gerhard Kuhn , Moritz Engl , Patrick Kromotis , Stefan Grotsch , Josef Huttner , Mario Wanninger , Georg Bogner
IPC分类号： H04N5/74
CPC分类号： G02B19/0066 , F21K9/00 , F21V17/101 , G02B19/0028 , G02B26/0833 , G02B27/0983 , G03B21/14 , G03B21/2033 , G03B21/208 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L2924/0002 , H04N9/315 , H01L2924/00
摘要： A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size AM and a maximum acceptance angle a for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle β. At least one of the LED chips has a radiation decoupling area of the size AD. The relation 0.7·(AM·sin2(α))/(AD·sin2(β)·n2)≦N≦1.3·(AM·sin2(α))/(AD·sin2(β)·n2) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.
摘要翻译：一种投影装置，其特征在于包括一个光调制器，该光调制器具有受光区域，该受光区域具有被照亮的尺寸A M M的横截面积和入射光的最大接收角度α，以及至少一个光源，在其操作期间，产生用于照亮所述光接收区域的所述横截面区域的光锥并且包括具有最大辐射角β的N个LED芯片。至少一个LED芯片具有尺寸为A D D D的放射去耦合区域。（α2）（α））/（A）D 2（S）2（（N）（α））/（A）N = 1.3。（A）M 适用于其中n等于1或耦合介质的折射率，其中LED 提供芯片。

5. 发明申请

US20060014429A1 Housing for an electronic component 有权
标题翻译：电子部件的外壳
公开(公告)号：US20060014429A1
公开(公告)日：2006-01-19
申请号：US11169861
申请日：2005-06-29
申请人： Josef Schmid , Stefan Grotsch , Michael Hiegler , Moritz Engl , Georg Bogner , Karlheinz Arndt , Markus Schneider
发明人： Josef Schmid , Stefan Grotsch , Michael Hiegler , Moritz Engl , Georg Bogner , Karlheinz Arndt , Markus Schneider
IPC分类号： H01R13/40
CPC分类号： H01L31/0203 , H01L23/60 , H01L25/167 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01068 , H01L2924/12041 , H01L2924/00014
摘要： A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).
摘要翻译：为具有至少两个与壳体接触的连接部分（4a，4b）的电子部件规定了外壳。壳体的至少子区域的电导率被设定为限定的方式，并且通过壳体的电流通路形成在连接部件之间。因此，壳体具有与电子部件（1）并联连接的限定电阻（2），并为部件（1）提供ESD保护。

6. 发明申请

US20070008734A1 Headlight and headlight element 有权
标题翻译：头灯和头灯元件
公开(公告)号：US20070008734A1
公开(公告)日：2007-01-11
申请号：US10551412
申请日：2004-03-24
申请人： Georg Bogner , Stefan Grotsch , Joachim Reill
发明人： Georg Bogner , Stefan Grotsch , Joachim Reill
IPC分类号： F21V1/00
CPC分类号： B60Q1/04 , F21S41/143 , F21S41/24 , F21S41/28 , F21S41/663 , F21Y2115/10 , H01L33/58 , H01L33/60 , Y10S362/80
摘要： A headlight having a multitude of headlight elements, which each have at least one semiconductor chip which emits electromagnetic radiation; a primary optics element, which reduces the divergence of the light which is incident through the light input; and at least one headlight element output, which emits a part of the headlight light from the headlight element. At least some of the headlight element outputs are arranged in at least two groups in such a way that the arrangement of at least one of the groups and/or at least overall arrangement of headlight element outputs of multiple groups corresponds essentially to a desired emission characteristic of the headlight, in that, in particular, it has a shape which corresponds essentially to the cross-sectional shape of a desired headlight beam, wherein the semiconductor chips which belong to the headlight element outputs of one group can each be operated independently of other semiconductor chips. A headlight element is disclosed which is suitable for a headlight such as this.
摘要翻译：具有多个头灯元件的头灯，每个头灯元件具有发射电磁辐射的至少一个半导体芯片; 主要光学元件，其减少通过光输入入射的光的发散; 以及至少一个头灯元件输出，其从头灯元件发射一部分前照灯光。至少一些前灯元件输出以至少两组布置成使得多个组中的组中的至少一个组和/或至少总体布置的大灯组件输出的布置基本上对应于期望的发射特性特别地，其具有基本上对应于期望的前灯光束的横截面形状的形状，其中属于一组的前灯元件输出的半导体芯片可以分别独立于其它部件操作半导体芯片。公开了适合于诸如此类的头灯的头灯元件。

7. 发明申请

US20090103297A1 LED ARRAY 有权
标题翻译： LED阵列
公开(公告)号：US20090103297A1
公开(公告)日：2009-04-23
申请号：US11816951
申请日：2006-02-06
申请人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
发明人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
IPC分类号： F21V33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/42 , H01L33/505 , H01L33/507 , H01L2924/0002 , H01L2924/00
摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
摘要翻译：在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体，透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

8. 发明授权

US07838357B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US07838357B2
公开(公告)日：2010-11-23
申请号：US10494160
申请日：2002-10-28
申请人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
IPC分类号： H01L218/8238
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.
摘要翻译：具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气引线框的端子。壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。

9. 发明申请

US20070253667A1 Optoelectronic Component with Multi-Part Housing Body 有权
标题翻译：多部件壳体的光电元件
公开(公告)号：US20070253667A1
公开(公告)日：2007-11-01
申请号：US10593794
申请日：2005-03-09
申请人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
发明人： Herbert Brunner , Matthias Winter , Markus Zeiler , Georg Bogner , Thomas Hofer
IPC分类号： H01L31/0203
CPC分类号： H01L33/60 , H01L31/0203 , H01L31/02325 , H01L33/486 , H01L33/54 , H01L2924/0002 , H01S5/02228 , H01S5/02244 , H01S5/02292 , H01L2924/00
摘要： An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.
摘要翻译：提出了一种光电子部件（1），其包括壳体（2）和设置在其上的至少一个半导体芯片（8），所述壳体具有包括连接器主体（16）的基部（13）导体材料（6,7）设置，并且所述壳体具有包括反射体（23）的反射器部分（14），反射器材料（9）设置在所述反射器部分上，其中所述连接器主体和所述反射器主体被预成型彼此分开，并且所述反射器主体以反射器顶部的形式设置在所述连接器主体上。

10. 发明授权

US5999552A Radiation emitter component 失效
标题翻译：辐射发射器组件
公开(公告)号：US5999552A
公开(公告)日：1999-12-07
申请号：US9606
申请日：1998-01-20
申请人： Georg Bogner , Herbert Brunner , Heinz Haas , Johann Luft , Ernst Nirschl , Werner Spaeth , Norbert Stath , Wolfgang Teich
发明人： Georg Bogner , Herbert Brunner , Heinz Haas , Johann Luft , Ernst Nirschl , Werner Spaeth , Norbert Stath , Wolfgang Teich
IPC分类号： H01L33/56 , H01S3/00 , H01S5/00 , H01S5/022 , H01S3/18 , H01L33/00
CPC分类号： H01S5/02244 , H01S5/02228 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2933/0091 , H01L33/56
摘要： A radiation emitter component, in particular an infrared emitter component with a conventional light-emitting diode housing, includes two electrode connections, one of which has a well-shaped reflector. The housing has an optically transparent, electrically non-conducting encapsulation material. A semiconductor laser chip is fastened in a well-shaped reflector of the light-emitting diode housing. The semiconductor laser chip has a quantum well structure, in particular with a strained layer structure, for example MOVPE epitaxial layers with a layer sequence GaAlAs-InGaAs-GaAlAs. A diffusor material can be inserted into the optically transparent, electrically non-conducting material of the light-emitting diode housing. The diffusor material is constructed or inserted with regard to type and concentration in such a way that in connection with the semiconductor laser chip encapsulated in the light-emitting diode housing, a radiation characteristic curve or an increase of an effective emission surface is produced that is comparable to that of a conventional infrared light-emitting diode.
摘要翻译：辐射发射器部件，特别是具有传统发光二极管外壳的红外发射器部件包括两个电极连接件，其中之一具有良好形状的反射器。壳体具有光学透明的非导电封装材料。将半导体激光芯片紧固在发光二极管壳体的形状好的反射器中。半导体激光芯片具有量子阱结构，特别是具有应变层结构，例如具有层序列GaAlAs-InGaAs-GaAlAs的MOVPE外延层。漫射材料可以插入到发光二极管外壳的光学透明的非导电材料中。关于类型和浓度来构造或插入扩散材料，使得与封装在发光二极管外壳中的半导体激光器芯片有关，产生辐射特性曲线或有效发射表面的增加，即，与传统的红外发光二极管相当。

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