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1. 发明申请

US20090154155A1 OPTICAL PROJECTION DEVICE 有权
标题翻译：光学投影设备
公开(公告)号：US20090154155A1
公开(公告)日：2009-06-18
申请号：US12279873
申请日：2007-03-09
申请人： Stefan Grotsch
发明人： Stefan Grotsch
IPC分类号： F21V9/00 , F21V1/00
CPC分类号： H04N9/3155 , F21K9/00 , G03B21/2033 , G03B21/208 , H01L51/5275 , H04N9/3105
摘要： The invention relates to an optical projection device. Said optical projection device comprises a plurality of light-emitting diode chips and at least one optical element comprising a light input surface which is associated with at least one of the light-emitting diode chips. The light decoupling surface of the light-emitting diode chip, which is adapted to the refraction index, is optically connected to the light input surface of the associated optical element.
摘要翻译：本发明涉及一种光学投影装置。所述光学投影装置包括多个发光二极管芯片和至少一个光学元件，其包括与至少一个发光二极管芯片相关联的光输入表面。适于折射率的发光二极管芯片的光去耦表面光学地连接到相关联的光学元件的光输入表面。

2. 发明申请

US20090129230A1 Light Guide 有权
标题翻译：光导
公开(公告)号：US20090129230A1
公开(公告)日：2009-05-21
申请号：US11816947
申请日：2006-02-02
申请人： Stefan Grotsch
发明人： Stefan Grotsch
IPC分类号： G11B7/00
CPC分类号： G02B6/002 , G02B6/0021 , G02B6/0046 , G02B6/0068 , G02B6/0073 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light guide is provided. The light guide has an uneven light input face and even side faces, which are arranged directly downstream of the light input face. Furthermore, an optoelectronic component with such a light guide is provided.
摘要翻译：提供光导。导光体具有不均匀的光输入面和均匀的侧面，它们直接布置在光输入面的下游。此外，提供具有这种光导的光电子部件。

3. 发明申请

US20090103297A1 LED ARRAY 有权
标题翻译： LED阵列
公开(公告)号：US20090103297A1
公开(公告)日：2009-04-23
申请号：US11816951
申请日：2006-02-06
申请人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
发明人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
IPC分类号： F21V33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/42 , H01L33/505 , H01L33/507 , H01L2924/0002 , H01L2924/00
摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
摘要翻译：在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体，透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

4. 发明申请

US20080266884A1 Cooling Device for Cooling a Semiconductor Component, in Particular, an Optoelectronic Semiconductor Component 审中-公开
标题翻译：用于冷却半导体部件的冷却装置，特别是光电子半导体部件
公开(公告)号：US20080266884A1
公开(公告)日：2008-10-30
申请号：US11794583
申请日：2005-12-01
申请人： Georg Bogner , Herbert Brunner , Stefan Grotsch , Guy Lefranc
发明人： Georg Bogner , Herbert Brunner , Stefan Grotsch , Guy Lefranc
IPC分类号： F21V29/00
CPC分类号： H01L23/427 , H01L33/648 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The invention relates to a cooling device for cooling a semiconductor component (1), in particular an optoelectronic semiconductor component, comprising at least partially first and second layers and a heal dissipation device (4), wherein said first and second layers are flatly placed on top of each other and one layer is provided, at least partially, with a structure for receiving said heat dissipation device (4).
摘要翻译：本发明涉及用于冷却半导体部件（1）的冷却装置，特别是包括至少部分第一和第二层的光电子半导体部件和愈合耗散装置（4），其中所述第一和第二层平坦地放置在至少部分地具有用于接收所述散热装置（4）的结构的一个层。

5. 发明申请

US20060076572A1 Light-emitting diode arrangement and motor vehicle headlamp 有权
标题翻译：发光二极管布置和机动车辆前照灯
公开(公告)号：US20060076572A1
公开(公告)日：2006-04-13
申请号：US11239723
申请日：2005-09-29
申请人： Rainer Huber , Joachim Reill , Kurt-Jurgen Lang , Moritz Engl , Markus Hofmann , Mario Wanninger , Michael Sailer , Stefan Grotsch
发明人： Rainer Huber , Joachim Reill , Kurt-Jurgen Lang , Moritz Engl , Markus Hofmann , Mario Wanninger , Michael Sailer , Stefan Grotsch
IPC分类号： H01L33/00
CPC分类号： F21V29/004 , F21S41/143 , F21S45/43 , F21S45/46 , F21S45/47 , F21S45/48 , F21S45/49 , F21S45/60 , F21V5/04 , F21V29/51 , F21V29/67 , F21V29/71 , F21V29/89 , F21Y2115/10 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode arrangement having at least one light-emitting diode chip (1), each light-emitting diode chip (1) being assigned at least one optical element (4). In addition, the light-emitting diode arrangement has at least one heat-conducting element (13) which is suitable to carry away the heat generated by the light-emitting diode chip, and at least one cooling apparatus which is suitable to carry heat away from the heat-conducting element. The light-emitting diode arrangement is particularly well suited, for example, to use in motor vehicle headlamps.
摘要翻译：一种具有至少一个发光二极管芯片（1）的发光二极管装置，每个发光二极管芯片（1）被分配至少一个光学元件（4）。此外，发光二极管装置具有至少一个适于携带由发光二极管芯片产生的热的导热元件（13），以及至少一个适于携带热量的冷却装置从导热元件。发光二极管装置特别适用于例如用在机动车辆前照灯中。

6. 发明授权

US06135645A Laser device with a silicone-attached element 有权
标题翻译：具有硅树脂附件的激光装置
公开(公告)号：US06135645A
公开(公告)日：2000-10-24
申请号：US376944
申请日：1999-08-18
申请人： Stefan Grotsch
发明人： Stefan Grotsch
IPC分类号： G02B6/42 , H01S3/00 , H01S5/00 , H01S5/02 , H01S5/022 , G02B6/36
CPC分类号： G02B6/4236 , G02B6/4204 , H01S5/02288 , H01S5/02248 , H01S5/02272
摘要： A laser device includes a component emitting laser radiation and at least one element for beam guidance or beam projection, which are disposed in a common housing. The element for beam guidance or beam projection is attached in the housing through the use of silicone.
摘要翻译：激光装置包括发射激光辐射的部件和用于光束引导或光束投影的至少一个元件，其被布置在公共壳体中。用于光束引导或光束投影的元件通过使用硅胶连接在外壳中。

7. 发明申请

US20080315227A1 Light-Emitting Diode Arrangement 有权
标题翻译：发光二极管布置
公开(公告)号：US20080315227A1
公开(公告)日：2008-12-25
申请号：US11631058
申请日：2005-05-18
申请人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
发明人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.
摘要翻译：公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。

8. 发明申请

US20080151547A1 LIGHT-EMITTING MODULE 有权
标题翻译：发光模块
公开(公告)号：US20080151547A1
公开(公告)日：2008-06-26
申请号：US11853129
申请日：2007-09-11
申请人： Stefan Grotsch , Moritz Engl , Florin Oswald , Michael Sailer , Alexander Wilm
发明人： Stefan Grotsch , Moritz Engl , Florin Oswald , Michael Sailer , Alexander Wilm
IPC分类号： F21S8/00
CPC分类号： G02B19/0028 , F21K9/00 , F21S41/141 , F21S41/143 , F21S41/39 , F21V17/005 , F21V19/0035 , F21V29/763 , F21V29/80 , F21Y2115/10 , G02B19/0066 , G02B27/62 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting module is specified that comprises a light source, a carrier for said light source, and an optical element, wherein the optical element comprises dowel pins that engage in corresponding recesses in the carrier. The light-emitting module is particularly well suited for use in optical projection apparatuses and in motor vehicle projection lamps.
摘要翻译：规定了包括光源，所述光源的载体和光学元件的发光模块，其中所述光学元件包括接合在所述载体中的相应凹部中的定位销。发光模块特别适用于光投射装置和机动车投影灯。

9. 发明申请

US20080094851A1 MOTOR-VEHICLE HEADLIGHT 有权
标题翻译：电动车头灯
公开(公告)号：US20080094851A1
公开(公告)日：2008-04-24
申请号：US11924209
申请日：2007-10-25
申请人： Moritz Engl , Stefan Grotsch , Markus Hofmann , Rainer Huber , Kurt Lang , Mario Wanninger
发明人： Moritz Engl , Stefan Grotsch , Markus Hofmann , Rainer Huber , Kurt Lang , Mario Wanninger
IPC分类号： F21V14/04 , B60Q1/06
CPC分类号： F21S43/255 , F21S41/143 , F21S41/147 , F21S41/16 , F21S41/43 , F21S41/635 , F21S41/645 , F21S41/657 , F21S41/675 , F21Y2115/10
摘要： A motor-vehicle headlight is specified, having at least one light-emitting diode, and an apparatus for controllable manipulation of the beam path of the electromagnetic radiation emitted from the light-emitting diode. The described motor-vehicle headlight is distinguished inter alia by a particularly variable emission characteristic.
摘要翻译：规定了具有至少一个发光二极管的机动车前灯，以及用于可控地操纵从发光二极管发射的电磁辐射的光束路径的装置。描述的机动车辆头灯尤其通过特别可变的发射特性来区分。

10. 发明申请

US20050148110A1 Method for producing a luminescence diode chip 有权
标题翻译：发光二极管芯片的制造方法
公开(公告)号：US20050148110A1
公开(公告)日：2005-07-07
申请号：US10979359
申请日：2004-11-01
申请人： Hubert Ott , Stefan Grotsch , Herbert Brunner
发明人： Hubert Ott , Stefan Grotsch , Herbert Brunner
IPC分类号： G21K4/00 , H01L21/00 , H01L33/50 , H01L33/58
CPC分类号： H01L33/58 , H01L33/507 , H01L2224/48091 , H01L2924/00014
摘要： A method for producing a luminescence diode chip, in which provision is made of a semiconductor body is provided having an epitaxially grown semiconductor layer sequence having an active zone and a radiation coupling-out area, the active zone emitting an electromagnetic radiation during operation of the luminescence diode, a large part of said electromagnetic radiation being coupled out via the radiation coupling-out area. A luminescence conversion material is arranged downstream of the radiation coupling-out area in an emission direction of the semiconductor body. A radiation-transmissive covering body having a first main area, a second main area opposite to the first main area, and also side areas connecting the first and second main areas. The covering body is applied to the radiation coupling-out area of the semiconductor layer sequence in such a way that the first main area faces the radiation coupling-out area. The application of the covering body is preceded by the application of a first conversion layer, having a luminescence conversion material, to the first main area of the covering body.
摘要翻译：提供一种制造发光二极管芯片的方法，其中提供具有半导体本体的外延生长的半导体层序列，其具有有源区和辐射耦合区，所述有源区在操作期间发射电磁辐射发光二极管，所述电磁辐射的大部分经由辐射耦合输出区被耦合输出。发光转换材料被布置在半导体本体的发射方向上的辐射耦合输出区域的下游。具有第一主区域，与第一主区域相对的第二主区域以及连接第一主区域和第二主区域的侧面区域的辐射透射覆盖体。将覆盖体施加到半导体层序列的辐射耦合出区域，使得第一主区域面向辐射耦合输出区域。覆盖体的应用之前是将具有发光转换材料的第一转换层应用于覆盖体的第一主区域。

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