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1. 发明授权

US08314441B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US08314441B2
公开(公告)日：2012-11-20
申请号：US13084149
申请日：2011-04-11
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or -receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.
摘要翻译：具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

2. 发明授权

US07414269B2 Housing for a radiation-emitting component, method for the production thereof, and radiation-emitting component 有权
标题翻译：用于辐射发射部件的壳体，其制造方法和辐射发射部件
公开(公告)号：US07414269B2
公开(公告)日：2008-08-19
申请号：US10558461
申请日：2004-05-28
申请人： Stefan Grötsch , Patrick Kromotis
发明人： Stefan Grötsch , Patrick Kromotis
IPC分类号： H01L27/15 , H01L21/00
CPC分类号： F21K99/00 , F21Y2115/10 , H01L25/0753 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： The invention proposes a housing for at least two radiation-emitting components, particularly LEDs, comprising a system carrier (1) and a reflector arrangement (2) disposed on said system carrier (1), the reflector arrangement comprising a number of reflectors each of which serves to receive at least one radiation-emitting component and which are fastened to one another by means of a holding device (4).
摘要翻译：本发明提出了一种用于至少两个辐射发射部件（特别是LED）的壳体，其包括设置在所述系统载体（1）上的系统载体（1）和反射器装置（2），所述反射器装置包括多个反射器其用于接收至少一个辐射发射部件，并且通过保持装置（4）彼此紧固。

3. 发明授权

US07726835B2 LED array 有权
标题翻译： LED阵列
公开(公告)号：US07726835B2
公开(公告)日：2010-06-01
申请号：US11816951
申请日：2006-02-06
申请人： Georg Bogner , Moritz Engl , Stefan Grötsch , Patrick Kromotis , Jorg Erich Sorg
发明人： Georg Bogner , Moritz Engl , Stefan Grötsch , Patrick Kromotis , Jorg Erich Sorg
IPC分类号： H01L27/15
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/42 , H01L33/505 , H01L33/507 , H01L2924/0002 , H01L2924/00
摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface, and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
摘要翻译：在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体，透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

4. 发明授权

US07514279B2 Optoelectronic component and method for producing it 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US07514279B2
公开(公告)日：2009-04-07
申请号：US11002326
申请日：2004-12-02
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L21/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.
摘要翻译：一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

5. 发明申请

US20070290383A1 Method for producing a lens mold 审中-公开
标题翻译：透镜模具的制造方法
公开(公告)号：US20070290383A1
公开(公告)日：2007-12-20
申请号：US11894569
申请日：2007-08-20
申请人： Georg Bogner , Wolfgang Gramann , Patrick Kromotis , Werner Marchl , Werner Spath , Gunter Waitl
发明人： Georg Bogner , Wolfgang Gramann , Patrick Kromotis , Werner Marchl , Werner Spath , Gunter Waitl
IPC分类号： B29D11/00
CPC分类号： G02B3/0031 , B29D11/00278 , B29D11/00365 , F21V5/04 , F21Y2115/10 , G02B3/0056 , H01L25/0753 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2924/01019 , H01L2924/12041 , H01L2924/1815 , H01L2924/19041 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A method for producing a lens mold suitable for manufacturing a field of micro-lenses is disclosed. The method includes the step of molding the lens mold from a sheaf of closely-packed balls held by a hexagonal mounting.
摘要翻译：公开了一种用于制造适于制造微透镜领域的透镜模具的方法。该方法包括从由六边形安装件保持的紧密包装的球的一组模制模制透镜模具的步骤。

6. 发明申请

US20050093005A1 Optoelectronic component and method for producing it 有权
标题翻译：光电元件及其制造方法
公开(公告)号：US20050093005A1
公开(公告)日：2005-05-05
申请号：US11002326
申请日：2004-12-02
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L23/02 , H01L31/0203 , H01L33/48 , H01L33/60 , H01L21/00 , H01L27/15 , H01L29/26 , H01L31/12
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.
摘要翻译：一种光电元件，其具有基本壳体或框架（12）和至少一个半导体芯片（20），特别是辐射发射或接收半导体芯片，位于基本壳体的空腔（18）中。为了提高光电子部件（10）的效率，在半导体芯片周围的区域的空腔内设置反射器。这些反射器是由以下事实构成的：提供了至少部分地填充到空腔（18）中的填充化合物（28），填充化合物（28）的材料和数量被选择为使填充物由于填充化合物和基本壳体之间的粘合力，复合物呈现在腔体中从底部到顶部基本上锥形化的形式，并且填充化合物的锥形内部区域（30）用作反射器。

7. 发明申请

US20100327307A1 Optoelectronic Component 有权
标题翻译：光电元件
公开(公告)号：US20100327307A1
公开(公告)日：2010-12-30
申请号：US12879130
申请日：2010-09-10
申请人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus Ruhnau , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L33/60
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.
摘要翻译：具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

8. 发明申请

US20090103297A1 LED ARRAY 有权
标题翻译： LED阵列
公开(公告)号：US20090103297A1
公开(公告)日：2009-04-23
申请号：US11816951
申请日：2006-02-06
申请人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
发明人： Georg Bogner , Moritz Engl , Stefan Grotsch , Patrick Kromotis , Jorg Erich Sorg
IPC分类号： F21V33/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/42 , H01L33/505 , H01L33/507 , H01L2924/0002 , H01L2924/00
摘要： In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.
摘要翻译：在包括多个具有辐射输出耦合表面的多个辐射发射半导体芯片的LED阵列中，由半导体芯片发射的辐射基本上通过所述辐射输出耦合表面耦合，以及对所发射的辐射透明的盖体，透明盖体在面向半导体芯片的辐射输出耦合表面的表面上包括由对所发射的辐射透明的导电材料制成的一个或多个导电迹线，并且半导体芯片各自包括在辐射输出耦合表面，至少一个电触点，其连接到所述导电迹线或所述多个导电迹线中的至少一个。至少一个发光转换材料被包含在透明盖体中和/或被涂覆到覆盖体和/或半导体芯片的层中。

9. 发明申请

US20090026482A1 Optoelectronic Component 有权
标题翻译：光电元件
公开(公告)号：US20090026482A1
公开(公告)日：2009-01-29
申请号：US12242170
申请日：2008-09-30
申请人： Marcus RUHNAU , Bert Braune , Patrick Kromotis , Georg Bogner
发明人： Marcus RUHNAU , Bert Braune , Patrick Kromotis , Georg Bogner
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L31/0203 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.
摘要翻译：具有基本壳体或框架的光电子部件和在基本壳体的空腔中的至少一个半导体芯片，特别是辐射发射或接收半导体芯片。为了提高光电子部件的效率，在半导体芯片周围的区域的空腔内设置反射体。这些反射体是由于填充化合物至少部分地填充到空腔中而形成的，填充化合物的材料和数量被选择为使得填充化合物由于填充化合物和基本壳体呈现在腔中从底部到顶部基本上锥形变宽的形式，并且填充化合物的锥形内部区域用作反射器。

10. 发明申请

US20060232969A1 Illumination device for backlighting an image reproduction device 有权
标题翻译：照明装置，用于照亮图像再现装置
公开(公告)号：US20060232969A1
公开(公告)日：2006-10-19
申请号：US10529675
申请日：2003-09-01
申请人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll
发明人： Georg Bogner , Patrick Kromotis , Ralf Mayer , Heinrich Noll
IPC分类号： F21S13/14
CPC分类号： H05B33/0803 , G02F1/133603 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2224/48472 , H01L2224/8592 , H05B33/0821 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to an illumination device for backlighting an image reproduction device that contains light valves. Said device is characterised in that light spots formed respectively by at least one light emitting diode are arranged in a grid on a thermally conductive support. The respective surface area of the light spots is less than that of the surface area defined by the grid.
摘要翻译：本发明涉及用于背光包含光阀的图像再现装置的照明装置。所述装置的特征在于，分别由至少一个发光二极管形成的光点以格栅布置在导热支撑件上。光斑的相应表面积小于由栅格限定的表面积的表面积。

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