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1. 发明申请

US20080315227A1 Light-Emitting Diode Arrangement 有权
标题翻译：发光二极管布置
公开(公告)号：US20080315227A1
公开(公告)日：2008-12-25
申请号：US11631058
申请日：2005-05-18
申请人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
发明人： Georg Bogner , Stefan Grotsch , Gunter Waitl , Mario Wanninger
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/58 , H01L33/60 , H01L33/64 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.
摘要翻译：公开了一种发光二极管装置，其包括具有辐射去耦表面的至少一个发光二极管（LED）芯片，通过该发光二极管芯片，在LED芯片中产生的大部分电磁辐射沿主要发射方向排出; 横向围绕LED芯片的壳体; 以及设置在主发射方向上的辐射去耦表面之后的反射光学器件。 LED布置特别适用于诸如配备相机的手机，数码相机或摄像机等设备。

2. 发明申请

US20080192153A1 Projection Apparatus 有权
标题翻译：投影仪
公开(公告)号：US20080192153A1
公开(公告)日：2008-08-14
申请号：US11914020
申请日：2006-04-21
申请人： Gerhard Kuhn , Moritz Engl , Patrick Kromotis , Stefan Grotsch , Josef Huttner , Mario Wanninger , Georg Bogner
发明人： Gerhard Kuhn , Moritz Engl , Patrick Kromotis , Stefan Grotsch , Josef Huttner , Mario Wanninger , Georg Bogner
IPC分类号： H04N5/74
CPC分类号： G02B19/0066 , F21K9/00 , F21V17/101 , G02B19/0028 , G02B26/0833 , G02B27/0983 , G03B21/14 , G03B21/2033 , G03B21/208 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L2924/0002 , H04N9/315 , H01L2924/00
摘要： A projection apparatus is specified, comprising a light modulator having a light receiving region with a cross-sectional area to be illuminated of the size AM and a maximum acceptance angle a for incident light, and at least one light source by means of which, during its operation, a light cone is produced for illuminating said cross-sectional area of said light receiving region and which comprises a number N of LED chips having a maximum radiation angle β. At least one of the LED chips has a radiation decoupling area of the size AD. The relation 0.7·(AM·sin2(α))/(AD·sin2(β)·n2)≦N≦1.3·(AM·sin2(α))/(AD·sin2(β)·n2) applies, where n is equal to 1 or to the refractive index of a coupling medium with which the LED chips are provided.
摘要翻译：一种投影装置，其特征在于包括一个光调制器，该光调制器具有受光区域，该受光区域具有被照亮的尺寸A M M的横截面积和入射光的最大接收角度α，以及至少一个光源，在其操作期间，产生用于照亮所述光接收区域的所述横截面区域的光锥并且包括具有最大辐射角β的N个LED芯片。至少一个LED芯片具有尺寸为A D D D的放射去耦合区域。（α2）（α））/（A）D 2（S）2（（N）（α））/（A）N = 1.3。（A）M 适用于其中n等于1或耦合介质的折射率，其中LED 提供芯片。

3. 发明申请

US20060011928A1 Surface-mountable light-emitting diode and/or photodiode and method for the production thereof 审中-公开
标题翻译：表面贴装发光二极管和/或光电二极管及其制造方法
公开(公告)号：US20060011928A1
公开(公告)日：2006-01-19
申请号：US10519347
申请日：2003-06-04
申请人： Jorg Sorg , Georg Bogner , Gunter Waitl , Reinhold Brunner
发明人： Jorg Sorg , Georg Bogner , Gunter Waitl , Reinhold Brunner
IPC分类号： H01L31/0203 , H01L33/00 , H01L31/0232
CPC分类号： H01L33/62 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48247 , H01L2224/48472 , H01L2224/73265 , H01L2924/12041 , H05K1/0203 , H05K3/3442 , H01L2924/00014 , H01L2924/00
摘要： A surface-mountable miniature luminescent diode with a chip package which has a leadframe (16) and a semiconductor chip (22) which is arranged on the leadframe (16) and is in electrical contact with it and which contains an active, radiation-emitting region. The leadframe (16) is formed by a flexible multi-layered sheet (12, 14).
摘要翻译：一种具有芯片封装的表面贴装微型发光二极管，其具有引线框架（16）和半导体芯片（22），所述引线框架和半导体芯片（22）布置在所述引线框架（16）上并且与所述引线框架（16）电接触并且包含有源辐射地区。引线框架（16）由柔性多层板（12,14）形成。

4. 发明申请

US20050245018A1 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US20050245018A1
公开(公告)日：2005-11-03
申请号：US10494160
申请日：2002-10-28
申请人： Georg Bogner , Herbert Brunner , Gertrud Krauter , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Gertrud Krauter , Gunter Waitl
IPC分类号： H01L33/48 , H01L33/60 , H01L21/8238
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.
摘要翻译：具有壳体（2）的光电子部件，布置在壳体的凹部（6）中的光电子半导体芯片（3），并且具有电端子（1A，1B），所述半导体芯片导电地连接到引线框的电气端子。壳体（2）由封装材料形成，其中填充物在从UV范围的波长范围内具有高反射度。

5. 发明申请

US20050212098A1 Surface-mountable semiconductor component and method for producing it 有权
标题翻译：表面贴装半导体元件及其制造方法
公开(公告)号：US20050212098A1
公开(公告)日：2005-09-29
申请号：US11052712
申请日：2005-01-31
申请人： Georg Bogner , Jorg Sorg , Gunter Waitl
发明人： Georg Bogner , Jorg Sorg , Gunter Waitl
IPC分类号： H01L23/12 , H01L21/56 , H01L23/31 , H01L23/48 , H01L23/495 , H01L23/498 , H01L33/48 , H01L33/62
CPC分类号： H01L21/561 , H01L21/565 , H01L23/3121 , H01L23/49838 , H01L23/4985 , H01L24/48 , H01L24/97 , H01L33/486 , H01L33/62 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/85399 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01061 , H01L2924/01068 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2224/85 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012
摘要： Surface-mountable semiconductor component having a semiconductor chip (1), at least two external electrical connections (31/314/41, 32/324/42), which are electrically conductively connected to at least two electrical contacts of the semiconductor chip (1), and an encapsulation material (50). The two external electrical connections are arranged at a film (2) having a thickness of less than or equal to 100 μm. The semiconductor chip (1) is fixed at a first main surface (22) of the film (2) and the encapsulation material (50) is applied on the first surface (22).
摘要翻译：具有半导体芯片（1）的表面安装半导体部件，至少两个外部电连接（31/314/41,32/324/42），其导电地连接到半导体芯片（1）的至少两个电触头）和封装材料（50）。两个外部电连接被布置在厚度小于或等于100μm的膜（2）上。半导体芯片（1）固定在膜（2）的第一主表面（22）上，并且封装材料（50）被施加在第一表面（22）上。

6. 发明授权

US08110437B2 Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof 有权
标题翻译：用于将半导体芯片附着在塑料密封剂中的方法，光电子半导体部件及其制造方法
公开(公告)号：US08110437B2
公开(公告)日：2012-02-07
申请号：US10514461
申请日：2003-05-14
申请人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
发明人： Gunter Waitl , Georg Bogner , Michael Hiegler , Matthias Winter
IPC分类号： H01L21/00
CPC分类号： H01L33/62 , H01L21/52 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29007 , H01L2224/2908 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/48465 , H01L2224/73265 , H01L2224/8319 , H01L2224/83801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01063 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/07811 , H01L2924/12041 , H01L2924/157 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/01029 , H01L2924/00012 , H01L2924/01049 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is injection-molded. Through the use of a low-melting solder 3 applied in a layer thickness of less than 10 μm, the soldering process can be carried out largely without thermal damage to the plastic encapsulant 5.
摘要翻译：辐射发射或接收半导体芯片9被软焊接以安装在引线框架2上，预成型的塑料密封剂5（所谓的预成型封装）被注射成型。通过使用以小于10μm的层厚度施加的低熔点焊料3，可以在很大程度上进行焊接工艺，而不会对塑料密封剂5造成热损伤。

7. 发明授权

US07838357B2 Optoelectronic component 有权
标题翻译：光电元件
公开(公告)号：US07838357B2
公开(公告)日：2010-11-23
申请号：US10494160
申请日：2002-10-28
申请人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Gertrud Kräuter , Gunter Waitl
IPC分类号： H01L218/8238
CPC分类号： H01L33/486 , H01L33/483 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Optoelectronic component, having a housing body (2), an optoelectronic semiconductor chip (3) arranged in a recess (6) of the housing body, and having electrical terminals (1A, 1B), the semiconductor chip being electrically conductively connected to the electrical terminals of the leadframe. The housing body (2) is formed from an encapsulation material, with a filler which has a high degree of reflection in a wavelength range from the UV range.
摘要翻译：具有壳体（2），布置在壳体主体的凹部（6）中的光电子半导体芯片（3），并具有电端子（1A，1B）的光电子部件，该半导体芯片导电地连接到电气引线框的端子。壳体（2）由封装材料形成，其具有在从UV范围的波长范围内具有高反射度的填料。

8. 发明申请

US20060022215A1 Semiconductor component emitting and/or receiving electromagnetic radiation, and housing base for such a component 有权
标题翻译：发射和/或接收电磁辐射的半导体部件和用于这种部件的壳体基座
公开(公告)号：US20060022215A1
公开(公告)日：2006-02-02
申请号：US11179028
申请日：2005-07-18
申请人： Karlheinz Arndt , Georg Bogner , Bert Braune , Gunter Waitl
发明人： Karlheinz Arndt , Georg Bogner , Bert Braune , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L33/52 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/1815 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： Disclosed is a radiation emitting and/or receiving semiconductor component comprising at least one radiation emitting and/or receiving semiconductor chip (1), which is disposed in a recess (2) of a housing base body (3) and is there encapsulated with an encapsulant (4) that is readily transparent to electromagnetic radiation emitted and/or received by the semiconductor chip (1). The recess (2) comprises a chip well (21) in which the semiconductor chip (1) is secured, and a trench (22) that runs at least partway around the chip well (21) inside the recess (2), such that between the chip well (21) and the trench (22) the housing base body (3) comprises a wall (23) whose apex, viewed from a bottom face of the chip well (21), lies below the level of the surface of the housing base body (3) from which the recess (2) leads into the housing base body (3), and the encapsulant (4) extends outward from the chip well (21) over the wall into the trench (22). A corresponding housing base body is also disclosed.
摘要翻译：公开了一种辐射发射和/或接收半导体部件，其包括至少一个辐射发射和/或接收半导体芯片（1），其布置在壳体基体（3）的凹部（2）中，并且被封装有对由半导体芯片（1）发射和/或接收的电磁辐射容易透明的密封剂（4）。凹部（2）包括其中固定有半导体芯片（1）的芯片阱（21）和在凹部（2）内部至少沿芯片阱（21）延伸的沟槽（22），使得在芯片井（21）和沟槽（22）之间，壳体基体（3）包括壁（23），其从芯片井（21）的底面观察其顶点位于下表面的水平面所述壳体基体（3）从所述凹部（2）引导到所述壳体基体（3）中，并且所述密封剂（4）从所述芯片孔（21）向外延伸到所述壁上进入所述沟槽（22）。还公开了相应的壳体基体。

9. 发明授权

US07446347B2 Optoelectronic component and method for the production thereof, module and device comprising a module of this type 有权
标题翻译：光电元件及其制造方法，包括这种模块的模块和装置
公开(公告)号：US07446347B2
公开(公告)日：2008-11-04
申请号：US10362614
申请日：2001-08-22
申请人： Georg Bogner , Herbert Brunner , Wolfgang Lex , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Wolfgang Lex , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/486 , H01L25/13 , H01L25/167 , H01L2224/48091 , H01L2924/01055 , H01L2924/01068 , H01L2924/12041 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to an optoelectronic component, having a semiconductor chip (1) which is mounted on a flexible chip support (6), in which conductor tracks (3, 5) for electrically connecting the semiconductor chip (1) are embodied on a first main face, and on which a housing frame (7) is disposed that is filled with a radiation-permeable medium, in particular a filler compound. A display device, an illumination or backlighting device, and a method for producing components of the invention are also disclosed.
摘要翻译：本发明涉及一种光电子元件，其具有安装在柔性芯片支撑件（6）上的半导体芯片（1），其中用于电连接半导体芯片（1）的导体轨道（3,5）体现在第一主面，并且在其上设置有填充有辐射透过介质，特别是填充剂化合物的壳体框架（7）。本发明还公开了一种显示装置，照明或背光装置及其制造方法。

10. 发明申请

US20080265266A1 Housing for an Optoelectronic Component, Optoelectronic Component and Method for the Production of an Optoelectronic Component 有权
标题翻译：光电元件的壳体，光电元件的制造和光电子元件的制造方法
公开(公告)号：US20080265266A1
公开(公告)日：2008-10-30
申请号：US11575705
申请日：2005-09-20
申请人： Georg Bogner , Herbert Brunner , Michael Hiegler , Gunter Waitl
发明人： Georg Bogner , Herbert Brunner , Michael Hiegler , Gunter Waitl
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/00014
摘要： A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.
摘要翻译：公开了一种用于光电子部件的壳体，其包括具有芯片安装表面的载体。与载体分开制造的光学元件被施加到载体上。芯片安装表面和光学元件限定了分离平面，载体和光学元件之间的分离平面布置在芯片安装表面的平面内。还公开了具有这种类型的壳体的光电子部件和这种类型的光电子部件的制造方法。

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