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1. 发明申请

US20030197501A1 Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor 有权
公开(公告)号：US20030197501A1
公开(公告)日：2003-10-23
申请号：US10443829
申请日：2003-05-23
申请人： Fujitsu Limited
发明人： Shigeyuki Maruyama , Futoshi Fukaya , Makoto Haseyama
IPC分类号： G01R031/02
CPC分类号： H01L21/6838 , G01R1/07314 , G01R31/2831 , G01R31/2886 , H01L21/67126 , H01L21/68735 , H01L21/68785
摘要： A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.

2. 发明申请

US20040070412A1 Device testing contactor, method of producing the same, and device testing carrier 有权
标题翻译：设备测试接触器，其制造方法和设备测试载体
公开(公告)号：US20040070412A1
公开(公告)日：2004-04-15
申请号：US10670377
申请日：2003-09-26
申请人： FUJITSU LIMITED
发明人： Makoto Haseyama , Shigeyuki Maruyama
IPC分类号： G01R031/02
CPC分类号： G01R1/0433 , Y10T29/49147 , Y10T29/49149 , Y10T29/49208 , Y10T29/4922
摘要： A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.
摘要翻译：提供了用于测试半导体器件的接触器。半导体器件测试接触器电连接到要测试的半导体器件的电极。这种接触器包括布线板和用于加强布线板的第一加强件。接触器具有柔性基膜和与半导体器件的电极电连接的器件连接焊盘。第一加强构件设置在与布线板的半导体器件连接表面相对的表面上。接线板和第一加强件共同接合。

3. 发明申请

US20040070010A1 Contactor, a method of manufacturing the contactor and a device and method of testing electronic component using the contactor 失效
标题翻译：接触器，接触器的制造方法以及使用接触器测试电子部件的装置和方法
公开(公告)号：US20040070010A1
公开(公告)日：2004-04-15
申请号：US10629800
申请日：2003-07-30
申请人： FUJITSU LIMITED
发明人： Makoto Haseyama , Shigeyuki Maruyama
IPC分类号： H01L029/768
CPC分类号： G01R1/06761 , G01R1/0735 , G01R3/00 , H05K3/244 , H05K3/4007 , H05K3/423 , H05K2201/0367 , H05K2201/0382 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , Y10T29/49147 , Y10T29/49151
摘要： A contactor is used for testing an integrated circuit electronic component provided with a plurality of electrodes. The contactor includes an insulating base material provided with holes formed at positions corresponding to the electrodes, a first conductive layer having contacts which are plastically deformed portions of the first conductive layer, and reinforcement members provided on the contacts on a first surface of the contacts. The first surface of the contacts is facing towards the holes. The contacts are provided at positions corresponding to the electrodes for enabling an electrical connection to the electronic component and are protruded from the insulating base material.
摘要翻译：接触器用于测试设置有多个电极的集成电路电子部件。接触器包括：绝缘基材，在与电极对应的位置形成有孔，第一导电层具有第一导电层的塑性变形部分的触点，以及设置在触点的第一表面上的触点上的加强部件。触点的第一表面朝向孔。触点设置在与电极对应的位置处，用于能够与电子部件电连接并且从绝缘基材突出。

4. 发明申请

US20030090281A1 Device testing contactor, method of producing the same, and device testing carrier 有权
公开(公告)号：US20030090281A1
公开(公告)日：2003-05-15
申请号：US10308025
申请日：2002-12-03
申请人： FUJITSU LIMITED
发明人： Makoto Haseyama , Shigeyuki Maruyama
IPC分类号： G01R031/02
CPC分类号： G01R1/0433 , Y10T29/49147 , Y10T29/49149 , Y10T29/49208 , Y10T29/4922
摘要： A contactor used for testing a semiconductor device is provided. The semiconductor device testing contactor is electrically connected to electrodes of a semiconductor device to be tested. Such a contactor includes a wiring board and a first reinforcing member for reinforcing the wiring board. The contactor has a flexible base film and device connecting pads to be electrically connected to the electrodes of the semiconductor device. The first reinforcing member is disposed on the surface opposite to the semiconductor device connecting surface of the wiring board. The wiring board and the first reinforcing member are collectively bonded.

5. 发明申请

US20020190741A1 Contactor for semiconductor devices, a testing apparatus using such contactor, a testing method using such contactor, and a method of cleaning such contactor 有权
公开(公告)号：US20020190741A1
公开(公告)日：2002-12-19
申请号：US10225133
申请日：2002-08-22
申请人： FUJITSU LIMITED
发明人： Shigeyuki Maruyama , Futoshi Fukaya , Makoto Haseyama
IPC分类号： G01R031/02
CPC分类号： H01L21/6838 , G01R1/07314 , G01R31/2831 , G01R31/2886 , H01L21/67126 , H01L21/68735 , H01L21/68785
摘要： A contactor for semiconductor devices includes a base unit for holding a semiconductor device provided with a plurality of terminals and a wiring substrate provided with contact electrodes at positions corresponding to at least some of the terminals. The contact electrodes and the terminals are electrically connected when the wiring substrate is held on the base unit. The contactor further includes a position maintaining force applying mechanism for applying a position maintaining force between the base unit and the wiring substrate and a contact pressure applying mechanism for applying a contact pressure between the semiconductor device and the wiring substrate. The position maintaining force applying mechanism and the contact pressure applying mechanism are operable in an independent manner.

6. 发明申请

US20040124866A1 Semiconductor testing device 失效
标题翻译：半导体测试装置
公开(公告)号：US20040124866A1
公开(公告)日：2004-07-01
申请号：US10685542
申请日：2003-10-16
申请人： FUJITSU LIMITED
发明人： Shigeyuki Maruyama , Kazuhiro Tashiro , Makoto Haseyama , Futoshi Fukaya
IPC分类号： G01R031/02
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译：半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部，所述连接部分至少可变形并延伸到所述开口中。

7. 发明申请

US20030132027A1 Integrated circuit contactor, and method and apparatus for production of integrated circuit contactor 有权
公开(公告)号：US20030132027A1
公开(公告)日：2003-07-17
申请号：US10369711
申请日：2003-02-21
申请人： Fujitsu Limited
发明人： Shigeyuki Maruyama , Makoto Haseyama , Futoshi Fukaya , Susumu Moriya , Naomi Miyaji
IPC分类号： H05K001/11 , H01R012/04
CPC分类号： H01L24/11 , G01R1/06738 , G01R1/06744 , G01R1/06761 , G01R1/07314 , G01R3/00 , H01L21/4853 , H01L24/13 , H01L24/45 , H01L24/78 , H01L2224/05571 , H01L2224/05573 , H01L2224/11 , H01L2224/1134 , H01L2224/1184 , H01L2224/13 , H01L2224/1308 , H01L2224/13099 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13173 , H01L2224/45144 , H01L2224/45155 , H01L2224/45164 , H01L2224/45169 , H01L2224/45173 , H01L2224/749 , H01L2224/78301 , H01L2224/78302 , H01L2224/81345 , H01L2224/85207 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01R4/26 , Y10T29/49117 , Y10T29/49147 , Y10T29/49162 , H01L2224/48 , H01L2924/00
摘要： An integrated circuit contactor includes a base of an insulating material, the base being elastically deformable. A plurality of pads of a first conductive material are bonded to the base at positions corresponding to positions of terminals on an integrated circuit. A plurality of contacts of a second conductive material are bonded to the plurality of pads, respectively, the terminals of the integrated circuit being electrically connected to the contacts only when a pressure is exerted onto the contacts by the terminals of the integrated circuit, each contact having a projecting edge with a roughness produced by pulling a wire of the second conductive material apart from a corresponding one of the plurality of pads after the wire is bonded to the corresponding pad.

8. 发明申请

US20040070961A1 Contactor apparatus for semiconductor devices and a test method of semiconductor devices 有权
标题翻译：用于半导体器件的接触器装置和半导体器件的测试方法
公开(公告)号：US20040070961A1
公开(公告)日：2004-04-15
申请号：US10677378
申请日：2003-10-03
申请人： FUJITSU LIMITED
发明人： Makoto Haseyama
IPC分类号： H05K001/11 , H05K001/14
CPC分类号： G01R31/2887 , G01R1/07371 , G01R31/2865 , G01R31/2874
摘要： A contactor apparatus having a first contactor (2) and a second contactor (4) acquires an electrical conduction to a plurality of semiconductor devices formed on a semiconductor wafer (6). The first contactor (2) has contacts (2b) which are directly brought into contact with power supply terminals (6a) of the semiconductor devices. The second contactor (4) is movable relative to the first contactor (2) and has contacts (4a) which are brought into contact with signal terminals (6b) of the semiconductor devices. Thereby, the number of contacts to be formed on a single contactor can be reduced and the number of pattern wirings can also be reduced, which makes the fabrication of the contactor easier.
摘要翻译：具有第一接触器（2）和第二接触器（4）的接触器装置获得对形成在半导体晶片（6）上的多个半导体器件的电导通。第一接触器（2）具有直接与半导体器件的电源端子（6a）接触的触点（2b）。第二接触器（4）可相对于第一接触器（2）移动，并且具有与半导体器件的信号端子（6b）接触的触点（4a）。因此，可以减少在单个接触器上形成的触点的数量，并且还可以减少图案布线的数量，这使得接触器的制造更容易。

9. 发明申请

US20010011898A1 IC socket, a test method using the same and an IC socket mounting mechanism 有权
标题翻译： IC插座，使用其的测试方法和IC插座安装机构
公开(公告)号：US20010011898A1
公开(公告)日：2001-08-09
申请号：US09809204
申请日：2001-03-16
申请人： Fujitsu Limited
发明人： Makoto Haseyama , Shigeyuki Maruyama , Masataka Mizukoshi , Futoshi Fukaya
IPC分类号： G01R031/02
CPC分类号： G01R1/0466 , G01R1/0483 , G01R1/06738 , G01R31/2863 , G01R31/2886 , H01L2924/00013 , H01L2224/29099
摘要： An IC to be tested having solder bumps is mounted on an IC socket mounted on a test board. The IC socket is provided with a contact unit including a plurality of straight contact pins each having an lower end connected to the test board and an upper end connected to the solder bumps and also including an elastic member for supporting the plurality of contact pins. A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of the plurality of solder bumps piercing an associated one of the solder bumps.
摘要翻译：将被测试的具有焊锡凸块的IC安装在安装在测试板上的IC插座上。 IC插座设置有接触单元，该接触单元包括多个直接接触针，每个具有连接到测试板的下端和连接到焊料凸块的上端，并且还包括用于支撑多个接触针的弹性构件。多个接触针的直径被构造成足够小以使多个接触针刺穿相应的焊料凸块，使得通过多个焊料凸块中的每一个的上端穿过相关联的一个焊接凸块来建立电连接焊锡凸块。

10. 发明申请

US20010011724A1 Semiconductor testing device 有权
标题翻译：半导体测试装置
公开(公告)号：US20010011724A1
公开(公告)日：2001-08-09
申请号：US09828221
申请日：2001-04-09
申请人： FUJITSU LIMITED
发明人： Shigeyuki Maruyama , Kazuhiro Tashiro , Makoto Haseyama
IPC分类号： H01L023/58 , H01L023/48 , H01L023/52 , H01L029/40
CPC分类号： G01R31/308 , G01R31/302 , H01L2924/0002 , H05K3/326 , H01L2924/00
摘要： A semiconductor testing device is used for testing a semiconductor device which has at least one spherical connection terminal. The testing device includes an insulating substrate having an opening formed therein at a position corresponding to the position of the spherical connection terminal, and a contact member, formed on the insulating substrate, including a connection portion which is connected with the spherical connection terminal, at least the connection portion being deformable and extending into the opening.
摘要翻译：半导体测试装置用于测试具有至少一个球形连接端子的半导体器件。该测试装置包括：绝缘基板，其在与球形连接端子的位置对应的位置处形成有开口;以及接触部件，形成在绝缘基板上，包括与球形连接端子连接的连接部，所述连接部分至少可变形并延伸到所述开口中。

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