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    • 1. 发明授权
    • Performance driven layout optimization using morphing of a basis set of representative layouts
    • 性能驱动布局优化使用变形的基础代表性布局
    • US08510699B1
    • 2013-08-13
    • US13416588
    • 2012-03-09
    • Emrah AcarAditya BansalRama N. SinghAmith Singhee
    • Emrah AcarAditya BansalRama N. SinghAmith Singhee
    • G06F17/50G06F9/455
    • G06F9/455G06F17/5068
    • Techniques for generating variants of a circuit layout and evaluating quality of the variants are provided. In one aspect, a method for generating at least one variant layout for a cell design includes the following steps. At least a first basis layout and a second basis layout are obtained for the cell design, each having a plurality of shapes, each of the shapes being a polygon having a plurality of sides and vertices. One or more of the shapes in the first basis layout are linked with one or more of the shapes in the second basis layout that represent a common feature of the cell design resulting in a plurality of linked shapes. Starting with either the first basis layout or the second basis layout, a location of the vertices of each of the linked shapes are changed to produce the variant layout for the cell design.
    • 提供了用于产生电路布局的变型和评估变体的质量的技术。 一方面,用于为单元设计生成至少一个变体布局的方法包括以下步骤。 为单元设计获得至少第一基础布局和第二基本布局,每个布局具有多个形状,每个形状是具有多个边和顶点的多边形。 第一基本布局​​中的一个或多个形状与第二基本布局中的一个或多个形状相关联,其表示单元设计的共同特征,导致多个连接形状。 从第一基本布局​​或第二基本布局开始,改变每个链接形状的顶点的位置,以产生单元格设计的变体布局。
    • 3. 发明授权
    • Circuit technique to electrically characterize block mask shifts
    • 电路技术,用于表征块掩模移位
    • US08969104B2
    • 2015-03-03
    • US13488532
    • 2012-06-05
    • Emrah AcarAditya BansalDureseti ChidambarraoLiang-Teck PangAmith Singhee
    • Emrah AcarAditya BansalDureseti ChidambarraoLiang-Teck PangAmith Singhee
    • H01L23/34
    • H01L22/34H01L22/14H01L27/0203H01L27/1104H01L2924/0002H01L2924/00
    • A physical test integrated circuit has a plurality of repeating circuit portions corresponding to an integrated circuit design. A first of the portions is fabricated with a nominal block mask location, and additional ones of the portions are deliberately fabricated with predetermined progressive increased offset of the block mask location from the nominal block mask location. For each of the portions, the difference in threshold voltage between a first field effect transistor and a second field effect transistor is determined. The predetermined progressive increased offset of the block mask location is in a direction from the first field effect transistor to the second field effect transistor. The block mask overlay tolerance is determined at a value of the progressive increased offset corresponding to an inflection of the difference in threshold voltage from a zero difference. A method for on-chip monitoring, and corresponding circuits, are also disclosed.
    • 物理测试集成电路具有对应于集成电路设计的多个重复电路部分。 这些部分中的第一部分被制造成具有标称块掩模位置,并且附加的部分被有意地用块掩模位置与标称块掩模位置的预定逐渐增加的偏移来制造。 对于每个部分,确定第一场效应晶体管和第二场效应晶体管之间的阈值电压差。 块掩模位置的预定逐渐增加的偏移在从第一场效应晶体管到第二场效应晶体管的方向上。 在与零差异的阈值电压的差的变化相对应的逐行增加偏移的值处确定块掩模覆盖公差。 还公开了用于片上监视的方法和相应的电路。
    • 8. 发明授权
    • Compensating for variations in device characteristics in integrated circuit simulation
    • 补偿集成电路仿真中器件特性的变化
    • US08594989B2
    • 2013-11-26
    • US12420910
    • 2009-04-09
    • Emrah AcarKanak B. AgarwalDamir JamsekSani R. Nassif
    • Emrah AcarKanak B. AgarwalDamir JamsekSani R. Nassif
    • G06F17/50G06G7/62
    • G06F17/5036
    • According to a method of simulation data processing, a difference is determined between a simulated value of a characteristic for a simulated integrated circuit device and a corresponding empirical value of the characteristic for a fabricated integrated circuit device. A data structure containing a simulation model of the fabricated integrated circuit device is accessed, where the data structure includes a plurality of entries each accessed via a unique index and an index used to access the data structure is offset in accordance with the difference between the simulated value and the empirical value. Operation of the simulated integrated circuit device is then simulated utilizing a value obtained from one of the plurality of entries of the data structure. Results of the simulation are stored in a data storage medium.
    • 根据模拟数据处理的方法,在仿真集成电路器件的特性的模拟值与制造的集成电路器件的特性的对应经验值之间确定差异。 访问包含制造的集成电路器件的仿真模型的数据结构,其中数据结构包括通过唯一索引访问的多个条目,并且用于访问数据结构的索引根据模拟的 价值和经验价值。 然后使用从数据结构的多个条目之一获得的值来模拟仿真集成电路器件的操作。 模拟结果存储在数据存储介质中。
    • 10. 发明申请
    • INTEGRATED CIRCUIT MODELING BASED ON EMPIRICAL TEST DATA
    • 基于实际测试数据的集成电路建模
    • US20100262412A1
    • 2010-10-14
    • US12420891
    • 2009-04-09
    • Emrah AcarKanak B. AgarwalDamir JamsekSani R. Nassif
    • Emrah AcarKanak B. AgarwalDamir JamsekSani R. Nassif
    • G06F17/50
    • G06F17/5036
    • In accordance with one embodiment, a plurality of empirical measurements of a fabricated integrated circuit including a fabricated transistor having multiple terminals is received. The plurality of empirical measurements each include an empirical terminal current set and an empirical terminal voltage set for the terminals of the fabricated transistor. A mathematical simulation model of a simulated transistor is also received. Utilizing the mathematical simulation model, an intermediate data set is calculated by determining, for each of a plurality of different terminal voltage sets, a simulated terminal current set and a simulated terminal charge set. A modeling tool processes the intermediate data set to obtain a time domain simulation model of the fabricated transistor that, for each of the plurality of empirical measurements, provides a simulated terminal charge set. The time domain simulation model is stored in a computer-readable data storage medium.
    • 根据一个实施例,接收包括具有多个端子的制造晶体管的制造的集成电路的多个经验测量。 多个经验测量每个包括经验终端电流集合和为制造的晶体管的端子设置的经验终端电压。 还接收了模拟晶体管的数学模拟模型。 利用数学模拟模型,通过针对多个不同终端电压组中的每一个确定模拟终端电流集合和模拟终端电荷组来计算中间数据集。 建模工具处理中间数据集以获得制造的晶体管的时域仿真模型,对于多个经验测量中的每一个提供模拟终端电荷组。 时域仿真模型存储在计算机可读数据存储介质中。